公开(公告)号：US5045249A

公开(公告)日：1991-09-03

申请号：US150485

申请日：1988-02-09

申请人： Sungho Jin ,  John J. Mottine, Jr. ,  Robert L. Opila, Jr. ,  Richard C. Sherwood ,  Thomas H. Tiefel ,  William C. Vesperman

发明人： Sungho Jin ,  John J. Mottine, Jr. ,  Robert L. Opila, Jr. ,  Richard C. Sherwood ,  Thomas H. Tiefel ,  William C. Vesperman

IPC分类号： H01L21/58 ,  H01R4/04 ,  H01R12/52 ,  H01R12/71 ,  H01R13/24 ,  H05K3/32

CPC分类号： H05K3/323 ,  H01R12/714 ,  H01R4/04 ,  H01L2224/83851 ,  H01L2224/83902 ,  H01R12/52 ,  H01R13/2414 ,  H05K2201/0314 ,  H05K2201/083 ,  H05K2201/09945 ,  H05K2203/104 ,  H05K2203/1189

摘要： Electrical interconnections are made by means of a layer or sheet medium comprising chains of magnetically aligned, electrically conducting particles in a nonconducting matrix material. End particles of chains protrude from a surface of the medium, thereby enhancing electrical contact properties of the medium. The medium can be used for temporary as well as permanent connections; in the latter case the use of a nonconductive adhesive material is convenient for physical attachment to contacts on both sides of the medium.

摘要翻译： 电互连通过在非导电基体材料中包含磁性排列的导电颗粒链的层或片介质制成。 链的末端颗粒从介质的表面突出，从而增强介质的电接触性能。 该介质可用于临时和永久连接; 在后一种情况下，使用非导电粘合剂材料便于物理连接到介质两侧的触点。