公开(公告)号：US4266091A

公开(公告)日：1981-05-05

申请号：US950266

申请日：1978-10-10

Applicant: Sunichi Fukuda

Inventor： Sunichi Fukuda

IPC: H01B7/00 ,  H02G5/00 ,  H05K1/18 ,  H05K3/40

CPC classification number: H05K1/186 ,  H02G5/005 ,  H05K1/145 ,  H05K2201/10015 ,  H05K2201/10272 ,  H05K2201/10643 ,  H05K3/4611

Abstract: A laminated bus bar comprises a pair of elongated flat conductors separated by a layer of insulating material which is provided with longitudinally spaced cut-outs. Capacitors which are comprised of a flat wafer of solid dielectric material are positioned in each of the cut-outs in the layer of insulating material and the capacitor plates are electrically and mechanically connected to the conductors.

Abstract translation: 叠层母线包括一对细长扁平导体，隔开的绝缘材料层具有纵向隔开的切口。 由固体电介质材料的平坦晶片组成的电容器定位在绝缘材料层的每个切口中，并且电容器板电连接和机械连接到导体。

公开(公告)号：US4420653A

公开(公告)日：1983-12-13

申请号：US154376

申请日：1980-05-29

Applicant: Sunichi Fukuda ,  Masaaki Muto

Inventor： Sunichi Fukuda ,  Masaaki Muto

IPC: H02G5/00 ,  H01B7/08

CPC classification number: H02G5/005 ,  Y10T29/49117

Abstract: A bus bar having a high distributed capacitance includes plural ceramic plates sandwiched between flat conductors and insulated therefrom by a non-conductive binder. Electrical connectors between the conductors and metallized coatings on the adjacent sides of the plates is established by bridging the binder layers with conductive material which contacts exposed edge portions of the conductors.

Abstract translation: 具有高分布电容的汇流条包括夹在扁平导体之间的多个陶瓷板，并通过非导电粘合剂与其绝缘。 通过用与导体的暴露边缘部分接触的导电材料桥接粘合剂层来建立导体与板的相邻侧面上的金属化涂层之间的电连接器。

公开(公告)号：US4342881A

公开(公告)日：1982-08-03

申请号：US154375

申请日：1980-05-29

Applicant: Sunichi Fukuda ,  Masaaki Muto

Inventor： Sunichi Fukuda ,  Masaaki Muto

IPC: H01B7/00 ,  H01G2/00 ,  H01G4/00 ,  H01G4/018 ,  H01G4/38 ,  H02G5/00 ,  H05K1/02 ,  H05K1/16 ,  H05K7/06 ,  H01B5/00

CPC classification number: H05K7/06 ,  H02G5/005 ,  H05K1/0263 ,  H05K1/162 ,  Y10T29/49169

Abstract: A laminated bus bar with rigid discrete dielectric elements sandwiched between flat conductors is assembled with comparative ease by coating the opposed faces of the elements with a low melt point conductive material except in bands adjacent to the edges of the elements. When the conductive material is reflowed to bond the elements to the conductors, there will be no development of short circuits across the edges of the elements.

Abstract translation: 通过用低熔点导电材料涂覆元件的相对面，除了靠近元件边缘的带之外，通过比较容易地组装具有夹在扁平导体之间的刚性分立介质元件的叠层母线。 当导电材料被回流以将元件结合到导体时，不会在元件的边缘上产生短路。