公开(公告)号：US20240061537A1

公开(公告)日：2024-02-22

申请号：US18492829

申请日：2023-10-24

Applicant: Synaptics Incorporated

Inventor： Brett Dunlap ,  Paul Wickboldt

IPC: G06F3/044 ,  G01N27/22 ,  G06F1/16 ,  G06V40/13 ,  H01L21/48 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18

CPC classification number: G06F3/0445 ,  G01N27/221 ,  G06F1/1692 ,  G06F3/0446 ,  G06V40/1306 ,  G06V40/1329 ,  H01L21/4857 ,  H01L21/486 ,  H05K1/0298 ,  H05K1/036 ,  H05K1/112 ,  H05K1/145 ,  H05K1/184 ,  H05K1/186 ,  H05K2201/10151

Abstract: A biometric sensor may comprise a plurality of a first type of signal traces formed on a first surface of a first layer of a multi-layer laminate package; at least one trace of a second type, formed on a second surface of the first layer or on a first surface of a second layer of the multi-layer laminate package; and connection vias in at least the first layer electrically connecting the signal traces of the first type or the signal traces of the second type to respective circuitry of the respective first or second type contained in an integrated circuit physically and electrically connected to one of the first layer, the second layer or a third layer of the multi-layer laminate package.

公开(公告)号：US11119615B2

公开(公告)日：2021-09-14

申请号：US16399074

申请日：2019-04-30

Applicant: Synaptics Incorporated

Inventor： Brett Dunlap ,  Paul Wickboldt

IPC: G06K9/00 ,  G06F3/044 ,  G01N27/22 ,  G06F1/16 ,  H01L21/48 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18

Abstract: It will be understood by those skilled in the art that there is disclosed in the present application a biometric sensor that may comprise a plurality of a first type of signal traces formed on a first surface of a first layer of a multi-layer laminate package; at least one trace of a second type, formed on a second surface of the first layer or on a first surface of a second layer of the multi-layer laminate package; and connection vias in at least the first layer electrically connecting the signal traces of the first type or the signal traces of the second type to respective circuitry of the respective first or second type contained in an integrated circuit physically and electrically connected to one of the first layer, the second layer or a third layer of the multi-layer laminate package.

公开(公告)号：US10338754B2

公开(公告)日：2019-07-02

申请号：US15282494

申请日：2016-09-30

Applicant: Synaptics Incorporated

Inventor： Guozhong Shen ,  Ozan Ersan Erdogan ,  Shengmin Wen ,  Brett Dunlap

IPC: G06F3/044

Abstract: An input device for capacitive sensing includes: a plurality of sensor electrodes, the plurality of sensor electrodes comprising a plurality of transmitter electrodes and a plurality of receiver electrodes, wherein the plurality of transmitter electrodes is configured to be driven by sensing signals and the plurality of receiver electrodes is configured to receive detected signals corresponding to respective sensing signals driven onto the plurality of transmitter electrodes; a plurality of transmitter electrode vias, wherein each transmitter electrode via corresponds to a respective transmitter electrode of the plurality of transmitter electrodes; and conductive shielding, configured to mitigate effects of the plurality of transmitter electrode vias on the detected signals received on one or more receiver electrodes of the plurality of receiver electrodes, wherein the conductive shielding comprises: a first portion disposed above the plurality of transmitter electrode vias; and a second portion disposed outside the plurality of transmitter electrode vias.

公开(公告)号：US20190258840A1

公开(公告)日：2019-08-22

申请号：US16399074

申请日：2019-04-30

Applicant: Synaptics Incorporated

Inventor： Brett Dunlap ,  Paul Wickboldt

IPC: G06K9/00 ,  G01N27/22 ,  H05K1/03 ,  G06F3/044 ,  H01L21/48 ,  G06F1/16 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18

Abstract: It will be understood by those skilled in the art that there is disclosed in the present application a biometric sensor that may comprise a plurality of a first type of signal traces formed on a first surface of a first layer of a multi-layer laminate package; at least one trace of a second type, formed on a second surface of the first layer or on a first surface of a second layer of the multi-layer laminate package; and connection vias in at least the first layer electrically connecting the signal traces of the first type or the signal traces of the second type to respective circuitry of the respective first or second type contained in an integrated circuit physically and electrically connected to one of the first layer, the second layer or a third layer of the multi-layer laminate package.

公开(公告)号：US10055631B1

公开(公告)日：2018-08-21

申请号：US15343168

申请日：2016-11-03

Applicant: Synaptics Incorporated

Inventor： Shengmin Wen ,  Brett Dunlap ,  Jay Kim

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  G06K9/00 ,  H01L23/538 ,  H01L23/00 ,  H01L23/498

CPC classification number: G06K9/0002 ,  G06K9/00053 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/2402 ,  H01L2224/2413 ,  H01L2224/24247 ,  H01L2224/24265

Abstract: A sensor package and a method of forming a sensor package are disclosed. The sensor package comprises: a multilayer substrate comprising a mold compound layer and a plurality of patterned metal layers; an embedded die embedded in the multilayer substrate, wherein the mold compound layer of the multilayer substrate surrounds the embedded die; and, a sensing element disposed over the multilayer substrate, the sensing element comprising a first patterned metal layer electrically connected to the embedded die through the multilayer substrate.

公开(公告)号：US11829565B2

公开(公告)日：2023-11-28

申请号：US17400504

申请日：2021-08-12

Applicant: Synaptics Incorporated

Inventor： Brett Dunlap ,  Paul Wickboldt

IPC: G06F3/044 ,  G01N27/22 ,  G06V40/13 ,  G06F1/16 ,  H01L21/48 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18

CPC classification number: G06F3/0445 ,  G01N27/221 ,  G06F1/1692 ,  G06F3/0446 ,  G06V40/1306 ,  G06V40/1329 ,  H01L21/486 ,  H01L21/4857 ,  H05K1/0298 ,  H05K1/036 ,  H05K1/112 ,  H05K1/145 ,  H05K1/184 ,  H05K1/186 ,  H05K2201/10151

Abstract: A biometric sensor may comprise a plurality of a first type of signal traces formed on a first surface of a first layer of a multi-layer laminate package; at least one trace of a second type, formed on a second surface of the first layer or on a first surface of a second layer of the multi-layer laminate package; and connection vias in at least the first layer electrically connecting the signal traces of the first type or the signal traces of the second type to respective circuitry of the respective first or second type contained in an integrated circuit physically and electrically connected to one of the first layer, the second layer or a third layer of the multi-layer laminate package.

公开(公告)号：US20170177113A1

公开(公告)日：2017-06-22

申请号：US15282494

申请日：2016-09-30

Applicant: Synaptics Incorporated

Inventor： Guozhong Shen ,  Ozan Ersan Erdogan ,  Shengmin Wen ,  Brett Dunlap

IPC: G06F3/044 ,  G06F3/041

CPC classification number: G06F3/044 ,  G06F2203/04107

Abstract: An input device for capacitive sensing includes: a plurality of sensor electrodes, the plurality of sensor electrodes comprising a plurality of transmitter electrodes and a plurality of receiver electrodes, wherein the plurality of transmitter electrodes is configured to be driven by sensing signals and the plurality of receiver electrodes is configured to receive detected signals corresponding to respective sensing signals driven onto the plurality of transmitter electrodes; a plurality of transmitter electrode vias, wherein each transmitter electrode via corresponds to a respective transmitter electrode of the plurality of transmitter electrodes; and conductive shielding, configured to mitigate effects of the plurality of transmitter electrode vias on the detected signals received on one or more receiver electrodes of the plurality of receiver electrodes, wherein the conductive shielding comprises: a first portion disposed above the plurality of transmitter electrode vias; and a second portion disposed outside the plurality of transmitter electrode vias.

公开(公告)号：US20210373709A1

公开(公告)日：2021-12-02

申请号：US17400504

申请日：2021-08-12

Applicant: Synaptics Incorporated

Inventor： Brett Dunlap ,  Paul Wickboldt

IPC: G06F3/044 ,  G01N27/22 ,  G06K9/00 ,  G06F1/16 ,  H01L21/48 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18

Abstract: A biometric sensor may comprise a plurality of a first type of signal traces formed on a first surface of a first layer of a multi-layer laminate package; at least one trace of a second type, formed on a second surface of the first layer or on a first surface of a second layer of the multi-layer laminate package; and connection vias in at least the first layer electrically connecting the signal traces of the first type or the signal traces of the second type to respective circuitry of the respective first or second type contained in an integrated circuit physically and electrically connected to one of the first layer, the second layer or a third layer of the multi-layer laminate package.

公开(公告)号：US10325132B2

公开(公告)日：2019-06-18

申请号：US15489561

申请日：2017-04-17

Applicant: Synaptics Incorporated

Inventor： Brett Dunlap ,  Paul Wickboldt

IPC: G06K9/00 ,  G01N27/22 ,  G06F1/16 ,  G06F3/044 ,  H01L21/48 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18

Abstract: It will be understood by those skilled in the art that there is disclosed in the present application a biometric sensor that may comprise a plurality of a first type of signal traces formed on a first surface of a first layer of a multi-layer laminate package; at least one trace of a second type, formed on a second surface of the first layer or on a first surface of a second layer of the multi-layer laminate package; and connection vias in at least the first layer electrically connecting the signal traces of the first type or the signal traces of the second type to respective circuitry of the respective first or second type contained in an integrated circuit physically and electrically connected to one of the first layer, the second layer or a third layer of the multi-layer laminate package.

公开(公告)号：US20170220837A1

公开(公告)日：2017-08-03

申请号：US15489561

申请日：2017-04-17

Applicant: Synaptics Incorporated

Inventor： Brett Dunlap ,  Paul Wickboldt

IPC: G06K9/00 ,  H05K1/18 ,  G06F3/044 ,  H05K1/11 ,  H01L21/48 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  G06F1/16

CPC classification number: G06K9/0002 ,  G01N27/221 ,  G06F1/1692 ,  G06F3/044 ,  G06K9/00053 ,  H01L21/4857 ,  H01L21/486 ,  H05K1/0298 ,  H05K1/036 ,  H05K1/112 ,  H05K1/145 ,  H05K1/184 ,  H05K1/186 ,  H05K2201/10151

Abstract: It will be understood by those skilled in the art that there is disclosed in the present application a biometric sensor that may comprise a plurality of a first type of signal traces formed on a first surface of a first layer of a multi-layer laminate package; at least one trace of a second type, formed on a second surface of the first layer or on a first surface of a second layer of the multi-layer laminate package; and connection vias in at least the first layer electrically connecting the signal traces of the first type or the signal traces of the second type to respective circuitry of the respective first or second type contained in an integrated circuit physically and electrically connected to one of the first layer, the second layer or a third layer of the multi-layer laminate package.