利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

4 条记录 (耗时 0.017 秒)

    Light emitting device
    2.
    发明授权
    Light emitting device 有权
    发光装置

    公开(公告)号：US08633499B2

    公开(公告)日：2014-01-21

    申请号：US13533875

    申请日：2012-06-26

    申请人： Syota Shimonishi ,  Hiroyuki Tajima ,  Yosuke Tsuchiya ,  Akira Sengoku

    发明人： Syota Shimonishi ,  Hiroyuki Tajima ,  Yosuke Tsuchiya ,  Akira Sengoku

    IPC分类号： H01L29/18

    CPC分类号： H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16 ,  H01L2924/07811 ,  H01L2924/00

    摘要： There is a reflective layer covering almost the entire surface of the light emitting portion except the portions where the light emitting elements are arranged, it is possible to increase the reflectivity of the light emitting portion to realize a higher luminance. In addition, the heat generated from the light emitting elements can be dissipated through the reflective layer, so that it is possible to prevent overheat of the light emitting device, and it is thus possible to improve the reliability of the light emitting device.

    摘要翻译： 除了布置发光元件的部分之外，存在覆盖发光部的整个表面的反射层，可以增加发光部的反射率，以实现更高的亮度。 此外，由发光元件产生的热能够通过反射层消散，从而可以防止发光器件的过热，从而可以提高发光器件的可靠性。

    LED module for lighting
    4.
    发明授权
    LED module for lighting 有权
    LED模组照明

    公开(公告)号：US08827493B2

    公开(公告)日：2014-09-09

    申请号：US13330892

    申请日：2011-12-20

    申请人： Syota Shimonishi ,  Hiroyuki Tajima ,  Yosuke Tsuchiya ,  Hideaki Kato

    发明人： Syota Shimonishi ,  Hiroyuki Tajima ,  Yosuke Tsuchiya ,  Hideaki Kato

    IPC分类号： H05B33/08 ,  H05K1/02 ,  F21Y105/00 ,  F21K99/00 ,  F21V25/10 ,  F21Y101/02

    CPC分类号： H05K1/026 ,  F21K9/00 ,  F21V25/10 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05B33/0821 ,  H05K1/0269 ,  H05K2201/09381 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/162 ,  Y02B20/341

    摘要： An object of the present invention is to provide a LED module, capable of protecting LED chips from an excessive voltage, at low cost.An LED module for lighting includes a wiring substrate having a plurality of wiring patterns formed thereon, and a plurality of LED chips connected to the wiring patterns so as to constitute a series circuit or a series-parallel circuit. In the LED module, the wiring patterns comprises an anode side wiring pattern constituting an anode side electrode of the circuit, and a cathode side wiring pattern constituting a cathode side electrode of the circuit, the anode side wiring pattern and the cathode side wiring pattern are disposed to surround connection regions of the wiring patterns with the LED chips, and forms guard electrodes, and both edge portions of the anode side wiring pattern face both edge portions of the cathode side wiring pattern with gaps, respectively.

    摘要翻译： 本发明的目的是提供一种能够以低成本保护LED芯片免受过电压的LED模块。 用于照明的LED模块包括其上形成有多个布线图案的布线基板和连接到布线图案的多个LED芯片，以构成串联电路或串联并联电路。 在LED模块中，布线图案包括构成电路的阳极侧电极的阳极侧布线图案和构成电路的阴极侧电极的阴极侧布线图案，阳极侧布线图案和阴极侧布线图案 设置成围绕LED芯片的布线图案的连接区域形成保护电极，并且阳极侧布线图案的两个边缘部分分别面对具有间隙的阴极侧布线图案的两个边缘部分。