公开(公告)号：US20150257296A1

公开(公告)日：2015-09-10

申请号：US14200201

申请日：2014-03-07

Applicant: TAIFLEX SCIENTIFIC CO., LTD.

Inventor： Tzu-Ching Hung ,  Yu-Chen Shih ,  Feng-Jung Tien ,  Chen-Kuo Lu ,  Yu-Hsien Lee ,  Su-Ping Wu

IPC: H05K5/03

CPC classification number: H05K3/281 ,  H05K1/0209 ,  H05K1/0274 ,  H05K2201/0195 ,  H05K2201/2054 ,  Y10T428/24959

Abstract: A cover layer of a printed circuit board has a polymer film, a reflective composite layer and an adhesive layer. The polymer film has a melting point greater than 260° C. The reflective composite layer is mounted on one side surface of the polymer film and has a first reflective pigment. The adhesive layer is mounted on another side surface of the polymer film. Also, at a range of wavelength where a reflectivity of the cover layer is greater than 89%, absorption of the polymer film to the same range of wavelength is less than 35%. The cover layer is laminated on a printed circuit board and after surface mount technology process at a temperature ranging from 160° C. to 320° C., the cover layer has a reflectivity over 89% without yellowing and delamination.

Abstract translation: 印刷电路板的覆盖层具有聚合物膜，反射复合层和粘合剂层。 聚合物膜的熔点大于260℃。反射复合层安装在聚合物膜的一个侧表面上并具有第一反射颜料。 粘合剂层安装在聚合物膜的另一侧表面上。 此外，在覆盖层的反射率大于89％的波长范围内，聚合物膜在相同波长范围内的吸收小于35％。 覆盖层层压在印刷电路板上，并且在160℃至320℃的温度范围内的表面贴装技术工艺之后，覆盖层的反射率超过89％，没有黄化和分层。