公开(公告)号：US20180086952A1

公开(公告)日：2018-03-29

申请号：US15358148

申请日：2016-11-22

Applicant: TAIFLEX Scientific Co., Ltd.

Inventor： I-Ling Teng ,  Tzu-Ching Hung ,  Chiao-Pei Chen ,  Yu-Hsien Lee ,  Tsung-Tai Hung ,  Bo-Sheng Wang ,  Cheng-Yen Hsiao ,  Chen-Hsin Huang

IPC: C09J125/08 ,  B32B7/12 ,  B32B15/08

CPC classification number: C09J125/08 ,  B32B7/12 ,  B32B15/08 ,  B32B15/085 ,  B32B15/20 ,  B32B27/32 ,  B32B2250/40 ,  B32B2255/06 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2307/714 ,  B32B2307/752 ,  B32B2553/00 ,  C08K5/098 ,  C09J153/025

Abstract: An adhesive composition is provided. The adhesive composition includes a mixture (A), wherein the mixture (A) includes a first component (a), a cross-linking agent (b), and a second component (c), wherein the second component (c) includes a calcium-containing complex compound or a calcium-containing compound. Based on the total weight of the mixture (A), a content of the first component (a) is from 40 to 80 wt %, a content of the cross-linking agent (b) is from 20 to 60 wt %, and a content of the second component (c) is from 1 to 20 wt %. Specifically, the calcium-containing complex compound is selected from the group consisting of a compound represented by formula (1), a compound represented by formula (2), a compound represented by formula (3), and a compound represent by formula (4), and the calcium-containing compound is selected from the group consisting of a compound represented by formula (5) and a compound represent by formula (6).

公开(公告)号：US20160088728A1

公开(公告)日：2016-03-24

申请号：US14530833

申请日：2014-11-03

Applicant: TAIFLEX Scientific Co., Ltd.

Inventor： Fu-Min Wang ,  Tsung-Tai Hung ,  I-Ling Teng ,  Feng-Jung Tien ,  Yu-Hsien Lee ,  Tzu-Ching Hung

IPC: H05K1/03 ,  H05K1/02

CPC classification number: H05K3/386 ,  H05K1/0237 ,  H05K1/118

Abstract: An insulation film of a signal transmission line includes a substrate layer, and a bonding layer arranged on the substrate layer for directly covering metal conductors of the signal transmission line, wherein the bonding layer is made of a polyolefin copolymer resin or a polyolefin resin mixture.

Abstract translation: 信号传输线的绝缘膜包括基底层和布置在基底层上用于直接覆盖信号传输线的金属导体的接合层，其中粘合层由聚烯烃共聚树脂或聚烯烃树脂混合物制成。

公开(公告)号：US20150257296A1

公开(公告)日：2015-09-10

申请号：US14200201

申请日：2014-03-07

Applicant: TAIFLEX SCIENTIFIC CO., LTD.

Inventor： Tzu-Ching Hung ,  Yu-Chen Shih ,  Feng-Jung Tien ,  Chen-Kuo Lu ,  Yu-Hsien Lee ,  Su-Ping Wu

IPC: H05K5/03

CPC classification number: H05K3/281 ,  H05K1/0209 ,  H05K1/0274 ,  H05K2201/0195 ,  H05K2201/2054 ,  Y10T428/24959

Abstract: A cover layer of a printed circuit board has a polymer film, a reflective composite layer and an adhesive layer. The polymer film has a melting point greater than 260° C. The reflective composite layer is mounted on one side surface of the polymer film and has a first reflective pigment. The adhesive layer is mounted on another side surface of the polymer film. Also, at a range of wavelength where a reflectivity of the cover layer is greater than 89%, absorption of the polymer film to the same range of wavelength is less than 35%. The cover layer is laminated on a printed circuit board and after surface mount technology process at a temperature ranging from 160° C. to 320° C., the cover layer has a reflectivity over 89% without yellowing and delamination.

Abstract translation: 印刷电路板的覆盖层具有聚合物膜，反射复合层和粘合剂层。 聚合物膜的熔点大于260℃。反射复合层安装在聚合物膜的一个侧表面上并具有第一反射颜料。 粘合剂层安装在聚合物膜的另一侧表面上。 此外，在覆盖层的反射率大于89％的波长范围内，聚合物膜在相同波长范围内的吸收小于35％。 覆盖层层压在印刷电路板上，并且在160℃至320℃的温度范围内的表面贴装技术工艺之后，覆盖层的反射率超过89％，没有黄化和分层。