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公开(公告)号:US20190244927A1
公开(公告)日:2019-08-08
申请号:US15942583
申请日:2018-04-02
发明人: Sheng-Chin Lin , Yao-Ming Wu , Yen-Hsiang Chen , Yi-Ming Chen
IPC分类号: H01L23/00 , C09D5/34 , C09D179/08 , C08G73/10
CPC分类号: H01L24/29 , C08G73/1042 , C08G73/1082 , C08G73/1085 , C09D5/34 , C09D179/085 , H01L21/6836 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/02373 , H01L2224/0401 , H01L2224/05569 , H01L2224/05639 , H01L2224/05647 , H01L2224/05684 , H01L2224/12105 , H01L2224/16227 , H01L2224/27003 , H01L2224/2744 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/9221 , H01L2924/07025 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106
摘要: A cover film includes a release layer and a polyimide layer disposed on the release layer. The polyimide layer includes an inner surface and an outer surface opposite to the inner surface. The outer surface is exposed to the atmosphere, and the polyimide layer is formed from a reaction of a polyimide composition made of diamine monomer and tetracarboxylic dianhydride monomer. The polyimide layer further includes a cross-linker and an initiator. The diamine monomer is an aliphatic diamine monomer with a number of carbon greater than or equal to 36. A lowest viscosity of the polyimide layer is less than 20000 Pa·s when polyimide layer is under a temperature in a range of 60° C. to 160° C.