公开(公告)号：US11959518B2

公开(公告)日：2024-04-16

申请号：US17422316

申请日：2019-09-19

Applicant: TAIHO KOGYO CO., LTD.

Inventor： Shigeyuki Suga

IPC: F16C33/12 ,  B32B15/01 ,  C25D5/10 ,  C25D7/10

CPC classification number: F16C33/12 ,  B32B15/017 ,  C25D5/10 ,  C25D7/10 ,  Y10T428/12681 ,  Y10T428/12715 ,  Y10T428/1275 ,  Y10T428/12882

Abstract: A technique capable of reducing the possibility of generation of a Cu—Sb compound in an overlay and the possibility of delamination between layers. A sliding member includes: an overlay including an alloy plating film of Bi and Sb; a lining including an Al alloy; a first intermediate layer including Cu as a main component, and laminated on the lining; and a second intermediate layer including Ag as a main component, and connecting the first intermediate layer and the overlay.

公开(公告)号：US11149791B2

公开(公告)日：2021-10-19

申请号：US17042542

申请日：2019-02-28

Applicant: TAIHO KOGYO CO., LTD.

Inventor： Masaya Ichikawa ,  Shigeyuki Suga

IPC: F16C33/12 ,  B32B15/01 ,  C22C12/00 ,  C22C5/06 ,  B22F5/10 ,  B22F7/08 ,  C22C9/02 ,  C25D3/56 ,  C25D7/10

Abstract: To provide a sliding member including an overlay capable of realizing good fatigue resistance while preventing interlayer peeling. A sliding member including an overlay formed of an alloy plating film of Bi and Sb, and the overlay is bonded to a lining formed of a copper alloy via an intermediate layer containing Ag as a main component.

公开(公告)号：US12209612B2

公开(公告)日：2025-01-28

申请号：US18013457

申请日：2021-06-28

Applicant: TAIHO KOGYO CO., LTD.

Inventor： Shigeyuki Suga ,  Hironori Sugitani

IPC: F16C33/12 ,  C22C12/00 ,  F16C17/02

Abstract: A sliding member including an overlay capable of realizing good fatigue resistance while preventing interlayer peeling. The sliding member including an overlay formed of an alloy plating film of Bi and Sb, wherein Bi—Sb oxide is formed on a surface of the overlay.

公开(公告)号：US20170159712A1

公开(公告)日：2017-06-08

申请号：US15438041

申请日：2017-02-21

Applicant: TAIHO KOGYO CO., LTD.

Inventor： Hitoshi Wada ,  Shigeyuki Suga ,  Takashi Tomikawa

IPC: F16C33/14 ,  C25D3/54 ,  F16C33/12 ,  C25D7/10 ,  C25D5/48 ,  C25D3/38 ,  C25D5/12

CPC classification number: F16C33/14 ,  C25D3/38 ,  C25D3/54 ,  C25D5/10 ,  C25D5/12 ,  C25D5/48 ,  C25D7/10 ,  C25D11/04 ,  C25D11/26 ,  F16C33/12 ,  F16C33/122 ,  F16C2204/10 ,  F16C2204/20 ,  F16C2204/36 ,  F16C2204/44 ,  F16C2204/52 ,  F16C2223/70 ,  F16C2360/22 ,  Y10T428/12569 ,  Y10T428/12972

Abstract: In a method, in which a plain bearing alloy layer is bonded to a surface of a backing steel sheet, and, a Bi-based overlay layer is then deposited on the plain bearing alloy layer by electroplating, replacement of Bi with the backing steel sheet and deposition of Bi on the backing steel sheet are prevented. Prior to the step of electroplating of the Bi-based overlay layer, the following metals and the like are formed on at least the back surface of the backing steel sheet. An electrochemically more noble metal than Bi, an electrochemically more base metal than Bi and capable of forming a passivation state, or resin.