公开(公告)号：US10050159B2

公开(公告)日：2018-08-14

申请号：US15375253

申请日：2016-12-12

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chien-Chih Chen ,  Su-Yu Yeh ,  Tzu-Shin Chen ,  Mu-Han Cheng ,  Chun-Hai Huang

IPC: H01L31/0232 ,  G02B3/00 ,  G02B5/20 ,  H01L27/146 ,  H01L31/0352

CPC classification number: H01L31/02327 ,  G02B3/0068 ,  G02B5/201 ,  H01L27/14643

Abstract: A semiconductor device and a method for fabricating the semiconductor device are provided. In the method for fabricating the semiconductor device, at first, a dielectric layer is provided. Then, trenches are formed in the dielectric layer. Thereafter, the trenches are filled with spacer material to form a spacer structure in the dielectric layer for defining pixel regions. Then, lens structures are formed on the pixel regions. Each of the lens structures includes a first curved lens layer, a second curved lens layer and a curved color filter layer. The curved color filter layer is disposed on the second curved lens layer or between the first curved lens layer and the second curved lens layer.

公开(公告)号：US20190160625A1

公开(公告)日：2019-05-30

申请号：US15869056

申请日：2018-01-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsiang-Chu Hu ,  Chun-Hai Huang ,  Mu-Han Cheng ,  Yu-Chin Tseng ,  Chien-Chih Chen ,  Tzu-Shin Chen

IPC: B24B37/005 ,  B24B37/20 ,  B24B53/017

Abstract: A system, a control method and an apparatus for chemical mechanical polishing (CMP) are introduced in the present application. The CMP apparatus may include a polishing pad, a first sensor, a polishing head and a condition. The polishing pad has a plurality of groves arranged randomly or in a specific pattern. The first sensor is configured to measure the pad profile of the polishing pad, where the pad profile includes the depth of each of the grooves on the polishing pad. The polishing head and the conditioner are operated according to at least one polishing condition, and the at least one polishing condition is tuned according to the pad profile.

公开(公告)号：US20180166594A1

公开(公告)日：2018-06-14

申请号：US15375253

申请日：2016-12-12

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chien-Chih Chen ,  Su-Yu Yeh ,  Tzu-Shin Chen ,  Mu-Han Cheng ,  Chun-Hai Huang

IPC: H01L31/0232 ,  G02B3/00 ,  G02B5/20 ,  H01L27/146 ,  H01L31/0352

CPC classification number: H01L31/02327 ,  G02B3/0068 ,  G02B5/201 ,  H01L27/14643 ,  H01L31/035281

Abstract: A semiconductor device and a method for fabricating the semiconductor device are provided. In the method for fabricating the semiconductor device, at first, a dielectric layer is provided. Then, trenches are formed in the dielectric layer. Thereafter, the trenches are filled with spacer material to form a spacer structure in the dielectric layer for defining pixel regions. Then, lens structures are formed on the pixel regions. Each of the lens structures includes a first curved lens layer, a second curved lens layer and a curved color filter layer. The curved color filter layer is disposed on the second curved lens layer or between the first curved lens layer and the second curved lens layer.

公开(公告)号：US10792783B2

公开(公告)日：2020-10-06

申请号：US15869056

申请日：2018-01-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsiang-Chu Hu ,  Chun-Hai Huang ,  Mu-Han Cheng ,  Yu-Chin Tseng ,  Chien-Chih Chen ,  Tzu-Shin Chen

IPC: B24B37/005 ,  B24B37/26 ,  B24B49/18 ,  B24B53/017 ,  B24B37/20 ,  B24B49/12 ,  B24B49/00 ,  B24B37/04 ,  B24B53/00

Abstract: A system, a control method and an apparatus for chemical mechanical polishing (CMP) are introduced in the present application. The CMP apparatus may include a polishing pad, a first sensor, a polishing head and a condition. The polishing pad has a plurality of groves arranged randomly or in a specific pattern. The first sensor is configured to measure the pad profile of the polishing pad, where the pad profile includes the depth of each of the grooves on the polishing pad. The polishing head and the conditioner are operated according to at least one polishing condition, and the at least one polishing condition is tuned according to the pad profile.