公开(公告)号：US20200315032A1

公开(公告)日：2020-10-01

申请号：US16809122

申请日：2020-03-04

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Yuichi SUGIYAMA ,  Masashi MIYAZAKI ,  Yutaka HATA ,  Hiroyuki KOBAYASHI

IPC: H05K3/46 ,  H05K3/44

Abstract: A manufacturing method of a multilayer board includes: forming a metal core layer including a main body, an island portion, and four connection portions, the island portion having a substantially rectangle shape and being located in an opening formed in the main body, the opening having a substantially rectangle shape, the four connection portions connecting side surfaces of four corners of the island portion or side surfaces of vicinities of the four corners of the island portion to a side surface of the main body; forming a first insulating layer on the metal core layer and in the opening; and forming, in the first insulating layer, a hole reaching each of the four connection portions and removing at least a part of each of the four connection portions through the hole to electrically separate the main body and the island portion from each other

公开(公告)号：US20180213642A1

公开(公告)日：2018-07-26

申请号：US15879228

申请日：2018-01-24

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Yuichi SUGIYAMA ,  Masashi MIYAZAKI ,  Hiroyuki KOBAYASHI

IPC: H05K1/09 ,  H05K1/03 ,  H04N5/225 ,  H05K3/44 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K1/09 ,  H01L23/48 ,  H04N5/2253 ,  H05K1/0201 ,  H05K1/0366 ,  H05K1/056 ,  H05K3/4038 ,  H05K3/44 ,  H05K3/4608 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2203/0323

Abstract: A printed circuit board includes a metal core substrate, an insulating layer formed on a surface of the metal core substrate, and a wiring pattern formed on the insulating layer. The metal core substrate includes a first metal layer made of a first metal material, and a second metal layer made of a second metal material differing from the first metal material, the second metal layer being laminated on the first metal layer. The elastic modulus of the second metal layer is lower than the elastic modulus of the first metal layer, and the thermal conductivity of the second metal layer is greater than the thermal conductivity of the first metal layer.