公开(公告)号：US20200185332A1

公开(公告)日：2020-06-11

申请号：US16790625

申请日：2020-02-13

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Yuichi SUGIYAMA ,  Masashi MIYAZAKI ,  Yoshiki HAMADA

IPC: H01L23/538 ,  H01L23/31 ,  H01L25/16 ,  H01L21/48 ,  H01L23/13

Abstract: A circuit board includes a core layer including a plurality of metal layers laminated one over another, a bottommost metal layer of the plurality of metal layers being thickest, and a topmost metal layer of the plurality of metal layer being thinnest; an upper insulating layer and an upper conductive pattern provided over a top surface of the core layer; and a lower insulating layer and a lower conductive pattern provided below a bottom surface of the core layer, wherein the topmost metal layer of the core metal layer is patterned to have a prescribed shaped section that serves as wiring and that is connected to the upper conductive pattern, wherein a metal ratio that is defined as a ratio of an area that is formed of metal relative to an entire area in a plan view is higher in the bottommost metal layer than in the topmost metal layer.

公开(公告)号：US20190069398A1

公开(公告)日：2019-02-28

申请号：US16107214

申请日：2018-08-21

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Yuichi SUGIYAMA ,  Masashi MIYAZAKI ,  Yutaka HATA

IPC: H05K1/02 ,  H05K1/18 ,  H01L27/146 ,  H05K3/00 ,  H05K3/42 ,  H05K3/28

Abstract: A circuit board includes a flexible wiring board with a reinforcing member. The flexible wiring board has a first, second and third sections. The reinforcing member is embedded in a cavity in the first section of the wiring board, and is sandwiched by a pair of resin layers provided below and above. A pair of wiring layers are disposed on the pair of the resin layers, respectively. The metal reinforcing member has either a plate shape or a frame shape and is disposed closer to one of the pair of the wiring layers than to another of the pair of the wiring layers in a vertical direction.

公开(公告)号：US20140253794A1

公开(公告)日：2014-09-11

申请号：US14155311

申请日：2014-01-14

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Masashi MIYAZAKI ,  Yuichi SUGIYAMA ,  Tatsuro SAWATARI ,  Hideki YOKOTA ,  Yutaka HATA

IPC: H04N5/225

CPC classification number: H04N5/2257 ,  H01L24/47 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H04N5/2253 ,  H04N5/2254 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A camera module, in which a recessed portion that has a greater depth than the thickness of an imaging device is disposed on the surface (top surface) of an embedded-component substrate. An imaging device is bonded to a bottom of the recessed portion such that an opening is present between the surface (top surface) of the imaging device and the surface (top surface) of the embedded-component substrate. Connection pads on the imaging device are connected to conductor pads disposed on the surface (top surface) of the embedded-component substrate by bonding wires that go through the opening.

Abstract translation: 在嵌入式部件基板的表面（上表面）上设置相机模块，其中具有比成像装置的厚度更大的深度的凹部。 成像装置结合到凹部的底部，使得在成像装置的表面（顶表面）和嵌入部件基板的表面（顶表面）之间存在开口。 成像装置上的连接焊盘通过接合穿过开口的导线连接到设置在嵌入式组件衬底的表面（顶表面）上的导体焊盘。

公开(公告)号：US20190104237A1

公开(公告)日：2019-04-04

申请号：US16143356

申请日：2018-09-26

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Yuichi SUGIYAMA ,  Masashi MIYAZAKI ,  Yutaka HATA

IPC: H04N5/225 ,  H05K1/18 ,  H05K1/11 ,  H05K3/46 ,  H05K1/02

Abstract: A circuit board includes a flexible wiring board having a first section in one end and a second section next to the first section in a plan view; a plate-shaped reinforcing member embedded in the flexible wiring board in the first section; and a first multilayer wiring layer on a top surface of the flexible wiring board in the first section, the first multilayer wiring layer having an opening that exposes a portion of a top surface of the reinforcing member for mounting a device thereon.

公开(公告)号：US20190051608A1

公开(公告)日：2019-02-14

申请号：US16057655

申请日：2018-08-07

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Yuichi SUGIYAMA ,  Masashi MIYAZAKI ,  Yoshiki HAMADA

IPC: H01L23/538 ,  H01L23/13 ,  H01L21/48 ,  H01L25/16 ,  H01L23/31

Abstract: A semiconductor module includes a metal core layer that includes: a first metal layer and a second metal layer on the first metal layer, wherein a portion of the second metal layer is removed to expose a surface of the first metal layer, the removed portion of the second metal layer defining a cavity in the metal core layer having the exposed surface of the first metal layer as a bottom surface, and at least one of a side wall and the bottom surface of the cavity has a smoother surface profile than a surface of the first metal layer that is not exposed by the cavity and under the second metal layer; and a semiconductor element provided in the cavity, affixed to the bottom surface of the cavity with a fixing material containing a resin component.

公开(公告)号：US20140355232A1

公开(公告)日：2014-12-04

申请号：US14461245

申请日：2014-08-15

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Tatsuro SAWATARI ,  Yuichi SUGIYAMA

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0216 ,  H05K1/0231 ,  H05K1/0298 ,  H05K1/183 ,  H05K1/185 ,  H05K3/4697 ,  H05K2201/0187 ,  H05K2201/10522

Abstract: A substrate with built-in electronic component includes: a core layer that includes a core material and a cavity formed in the core material and containing an insulating material; an insulating layer that includes a ground wiring and a signal wiring and is formed on the core layer; and a plurality of electronic components that each include a first terminal and a second terminal and are stored in the cavity, the plurality of electronic components each having one end portion and the other end portion, the first terminal being formed at the one end portion and connected to the ground wiring, the second terminal being formed at the other end portion and connected to the signal wiring, the plurality of electronic components having at least one of arrangements in which the first terminals face each other and in which the second terminals face each other.

公开(公告)号：US20140144692A1

公开(公告)日：2014-05-29

申请号：US13872381

申请日：2013-04-29

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Yoshiki HAMADA ,  Yuichi SUGIYAMA ,  Akihiro HOSHINO

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0253 ,  H05K1/0225 ,  H05K1/0228 ,  H05K1/185 ,  H05K2201/09236 ,  H05K2201/0979

Abstract: A multilayer circuit substrate obtained by alternately stacking conductor layers and insulator layers. The conductor layers include a core layer having a greater thickness than any of the other conductor layers and located in an inner layer of the multilayer circuit substrate. A first conductor layer facing the core layer through an insulator layer has first signal wires that transmit high frequency signals, and through-holes are formed in the core layer along the first signal wires in a location facing the first signal wires.

Abstract translation: 通过交替堆叠导体层和绝缘体层而获得的多层电路基板。 导体层包括具有比任何其它导体层更大的厚度并且位于多层电路基板的内层中的芯层。 通过绝缘体层面向芯层的第一导体层具有传输高频信号的第一信号线，并且在面向第一信号线的位置沿着第一信号线在芯层中形成通孔。

公开(公告)号：US20140133120A1

公开(公告)日：2014-05-15

申请号：US13909880

申请日：2013-06-04

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Tatsuro SAWATARI ,  Yuichi SUGIYAMA ,  Hiroshi NAKAMURA ,  Masaki NAGANUMA ,  Tetsuo SAJI

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/185 ,  H05K1/0213 ,  H05K1/0271 ,  H05K1/0298 ,  H05K2201/09063 ,  H05K2203/1178

Abstract: In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively.

Abstract translation: 在分别与具有穿过其的存储部分的芯层最靠近的第一导电层和第三导电层中，形成四个第一穿透孔和四个第一穿透孔，以与存储部分的开口边缘的一部分重叠 其分别投影到第一导电层和第三导电层上。

公开(公告)号：US20190069397A1

公开(公告)日：2019-02-28

申请号：US16107233

申请日：2018-08-21

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Yuichi SUGIYAMA ,  Masashi MIYAZAKI ,  Yutaka HATA

IPC: H05K1/02

Abstract: A circuit board includes a flexible wiring board with a reinforcing member. The flexible wiring board has a first, second and third sections. The reinforcing member is embedded in a cavity in the first section of the wiring board, and is sandwiched by a pair of resin layers provided below and above. A pair of wiring layers are disposed on the pair of the resin layers, respectively. The metal reinforcing member has either a plate shape or a frame shape. The first section of the wiring board is positioned closer to one of the wiring layers than to another of the wiring layers in a vertical direction.

公开(公告)号：US20190053380A1

公开(公告)日：2019-02-14

申请号：US16056171

申请日：2018-08-06

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Yuichi SUGIYAMA ,  Masashi MIYAZAKI

IPC: H05K3/00 ,  H05K1/02 ,  H05K3/44 ,  H05K3/46

Abstract: An intermediate printed board has a plurality of unit regions that are to be cut out and separated to become a plurality of individual printed circuit boards, respectively. The intermediate printed board includes a metal core substrate including: a metal layer; and a plating layer formed on each of a top surface and a bottom surface of the metal layer, the plating layer being absent in each of cutting regions, the cutting regions being regions on the intermediate printed board where the plurality of unit regions are separated so as to produce the plurality of individual printed circuit boards; an insulating layer formed so as to cover a surface of the metal core substrate; and a conductive pattern formed on the insulating layer.