公开(公告)号：US20160007446A1

公开(公告)日：2016-01-07

申请号：US14768424

申请日：2014-02-12

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Kazuya ISHIKAWA ,  Nobuhiro SASAKI ,  Hideo ISHIHARA ,  Katsunosuke HAGA

IPC: H05K1/02 ,  H05K1/11 ,  H01G4/30 ,  H01G4/12 ,  H01G4/232

CPC classification number: H05K1/0216 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K1/113 ,  H05K1/181 ,  H05K2201/09481 ,  H05K2201/10015 ,  H05K2201/10378 ,  H05K2201/10636 ,  Y02P70/611

Abstract: An embodiment of an multilayer ceramic capacitor with interposer includes: an interposer 20 having an insulated substrate 21, two first conductor pads 22, two second conductor pads 23 and two conductor vias 24 connecting the first conductor pads 22 and second conductor pads 23; and a multilayer ceramic capacitor 10 having external electrodes 12 that are each connected to each first conductor pad 22 of the interposer 20 via solder SOL. Each conductor via 24 of the interposer 20 has a through hole 24a inside, and a void GA not filled with the solder SOL is present in each through hole 24a on the second conductor pad 23 side. The multilayer ceramic capacitor with interposer is capable of suppressing noise due to electrostriction.

Abstract translation: 具有插入器的多层陶瓷电容器的实施例包括：具有绝缘基板21，两个第一导体焊盘22，两个第二导体焊盘23和连接第一导体焊盘22和第二导体焊盘23的两个导体通孔24的插入件20; 以及具有外部电极12的多层陶瓷电容器10，每个外部电极12经由焊料SOL连接到插入件20的每个第一导体焊盘22。 插入器20的每个导体通孔24在其内部具有通孔24a，并且在第二导体焊盘23侧的每个通孔24a中都存在未填充有焊料SOL的空隙GA。 具有中介层的多层陶瓷电容器能够抑制由于电致伸缩引起的噪声。