公开(公告)号：US20230326682A1

公开(公告)日：2023-10-12

申请号：US18192515

申请日：2023-03-29

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Tomoki SAKAI

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/005 ,  H05K1/16

CPC classification number: H01G4/306 ,  H01G4/12 ,  H01G4/005 ,  H05K1/162

Abstract: A multilayer ceramic electronic component includes a ceramic body that has internal electrodes stacked in a direction of a first axis, and end surfaces perpendicular to a second axis orthogonal to the first axis, the internal electrodes being alternately led out to the end surfaces, and external electrodes covering the end surfaces of the ceramic body, wherein each of the external electrodes includes a base film formed on a corresponding one of the end surfaces and connected to the plurality of internal electrodes, a first Ni film formed on the base film, a metal film that is formed on the first Ni film and contains a metal having a lower ionization tendency than Ni, as a main component, a second Ni film formed on the metal film and having a higher hydrogen concentration than the first Ni film, and a surface layer film formed on the second Ni film.

公开(公告)号：US20250014832A1

公开(公告)日：2025-01-09

申请号：US18894297

申请日：2024-09-24

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Tomoki SAKAI

IPC: H01G4/30 ,  C04B35/468 ,  H01G2/06 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

Abstract: A multi-layer ceramic electronic component includes: a ceramic body including internal electrodes laminated and drawn to an end face of the ceramic body; and an external electrode including: a base film disposed on the end face of the ceramic body and formed from an electrically conductive material, a first nickel film disposed on and in contact with the base film in a thickness direction of the base film, and a second nickel film disposed on the first nickel film in a thickness direction of the first nickel film, wherein the base film is in contact with the internal electrodes, or the first nickel film is thicker than the second nickel film.

公开(公告)号：US20210366657A1

公开(公告)日：2021-11-25

申请号：US17317735

申请日：2021-05-11

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Tomoki SAKAI

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/008 ,  H01G2/06 ,  C04B35/468

Abstract: A method of producing a multi-layer ceramic electronic component includes: forming a base film formed from an electrically conductive material on a surface of a ceramic body including internal electrodes laminated and drawn to the surface in such a manner that the base film is connected to the internal electrodes; forming a first nickel film on the base film by an electrolytic plating method; performing, after forming the first nickel film, heat treatment in a weakly reducing atmosphere at a temperature equal to or higher than a temperature at which the first nickel film is recrystallized; and forming a second nickel film on the first nickel film, on which the heat treatment is performed, by an electrolytic plating method.

公开(公告)号：US20230326681A1

公开(公告)日：2023-10-12

申请号：US18332176

申请日：2023-06-09

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Tomoki SAKAI

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G2/06 ,  C04B35/468 ,  H01G4/008

CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/1227 ,  H01G2/065 ,  C04B35/468 ,  H01G4/008 ,  C04B2235/66

Abstract: A multi-layer ceramic electronic component includes: a ceramic body including internal electrodes laminated and drawn to a surface of the ceramic body; and an external electrode including: a base film disposed on the surface of the ceramic body, connected to the internal electrodes, and formed from an electrically conductive material, a first nickel film disposed on and in contact with the base film in a thickness direction of the base film, and a second nickel film disposed on the first nickel film in a thickness direction of the first nickel film.

公开(公告)号：US20230326676A1

公开(公告)日：2023-10-12

申请号：US18187246

申请日：2023-03-21

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Tomoki SAKAI

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/248 ,  H01G2/06

CPC classification number: H01G4/2325 ,  H01G4/30 ,  H01G4/248 ,  H01G2/06

Abstract: A multilayer ceramic electronic component includes a ceramic body having internal electrodes stacked in a direction of a first axis, and end surfaces perpendicular to a second axis orthogonal to the first axis, and external electrodes covering the end surfaces of the ceramic body, respectively, wherein each of the external electrodes includes a base film formed on a corresponding one of the end surfaces and connected to the plurality of internal electrodes that are led out to the corresponding end surface, a first Ni film formed on the base film, a second Ni film formed on the first Ni film, a surface layer film formed on the second Ni film, and a metal film that is formed between the first Ni film and the second Ni film and contains a metal having a Young's modulus lower than that of Ni, as a main component.