公开(公告)号：US20230407459A1

公开(公告)日：2023-12-21

申请号：US18036827

申请日：2021-11-15

Applicant: TOHOKU UNIVERSITY ,  TANAKA KIKINZOKU KOGYO K.K.

Inventor： Akihito FUJINO ,  Kunihiro TANAKA ,  Shuichi KUBOTA ,  Takao ASADA ,  Tetsuo ENDOH ,  Shoji IKEDA

IPC: C23C14/34 ,  C23C14/14

CPC classification number: C23C14/3414 ,  C23C14/14

Abstract: The present invention relates to a platinum-based sputtering target containing platinum or a platinum alloy. The platinum-based sputtering target of the present invention is characterized by a material structure in a thickness-direction cross section thereof. Specifically, when a thickness-direction cross section is equally divided into n sections (n=5 to 20) along a thickness direction, a region including (n−2) sections excluding both end sections is set as a determination region, and when an average grain size in each of the sections is measured in the determination region, as well as an average grain size in the entire determination region is measured, the average grain size in the entire determination region is 150 μm or less, and a coefficient of variation calculated based on the average grain size in each of the sections of the determination region is 15% or less.

公开(公告)号：US20240382908A1

公开(公告)日：2024-11-21

申请号：US18689951

申请日：2022-08-22

Applicant: TANAKA KIKINZOKU KOGYO K.K.

Inventor： Daisuke HORIKAWA ,  Toru MATSUMURA ,  Masato EBISUGI ,  Shuichi KUBOTA

IPC: B01D71/02 ,  B01D53/22 ,  B01D67/00 ,  B01D69/02 ,  C22C5/04

Abstract: A hydrogen permeable membrane that includes a PdCu alloy and can be used for hydrogen purification. The hydrogen permeable membrane includes 38.75 mass % or more and 39.5 mass % or less of Cu with the balance being Pd and inevitable impurities as the PdCu alloy, and the area percentage of a β phase on an arbitrary cross section is 95% or more. The hydrogen permeable membrane of the present invention has a hydrogen permeability coefficient ϕ of 2.0×10−8 mol/m·S·Pa1/2 or more at any temperature in a temperature range of 150° C. or higher and 350°° C. or lower. This value exceeds the hydrogen permeability coefficient of a PdCu alloy membrane containing Cu concentration of 40 mass %, which has been thus far considered to be optimal, demonstrating that the present invention is excellent in terms of hydrogen permeability.

公开(公告)号：US20160163425A1

公开(公告)日：2016-06-09

申请号：US14907893

申请日：2014-07-22

Applicant: TANAKA KIKINZOKU KOGYO K.K.

Inventor： Naoji KASHIMA ,  Tomonori WATANABE ,  Shigeo NAGAYA ,  Kunihiro SHIMA ,  Shuichi KUBOTA ,  Ryosuke SUGANUMA

IPC: H01B12/06 ,  C30B29/02 ,  C30B29/22 ,  C30B19/12

CPC classification number: H01B12/06 ,  C30B19/12 ,  C30B23/025 ,  C30B25/183 ,  C30B25/186 ,  C30B29/02 ,  C30B29/225 ,  H01L39/2461

Abstract: The present invention provides a textured substrate for forming an epitaxial film, including a textured metal layer on at least one surface of the layer, the textured metal layer including a copper layer having a cube texture, the textured metal layer having, on a surface of the layer, palladium added in an amount of 10 to 300 ng/mm2 per unit area, the hydrogen content of the surface of the textured metal layer being 700 to 2000 ppm. This textured substrate is produced through a step of adding 10 to 300 ng/mm2 per unit area of palladium by strike plating to a surface of the copper layer having a cube texture.

Abstract translation: 本发明提供了一种用于形成外延膜的织构化衬底，其包括在该层的至少一个表面上的织构化金属层，该纹理化金属层包括具有立体结构的铜层，该织构化金属层在 该层，每单位面积添加量为10〜300ng / mm 2的钯，织构化金属层的表面的氢含量为700〜2000ppm。 这种织构化的基板是通过在具有立体结构的铜层的表面上通过冲击镀添加10至300ng / mm 2的每单位面积钯的步骤而制造的。