公开(公告)号：US20140293258A1

公开(公告)日：2014-10-02

申请号：US14224712

申请日：2014-03-25

Applicant: TDK CORPORATION

Inventor： Naozumi ISHIKAWA ,  Fumio WATANABE ,  Hiroshi KAMIYAMA

IPC: H05K3/06

CPC classification number: H05K3/0008 ,  H05K1/0269 ,  H05K1/165 ,  H05K3/0002 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/056 ,  H05K2203/166

Abstract: A first alignment mark is given to a substrate, and a second alignment mark is given to a mask. The mask forms an electronic circuit pattern on the substrate. A control unit performs alignment of the mask and the substrate based on the first and second alignment marks. The second alignment mark is formed to surround the first alignment mark. The second alignment mark has a step pattern therein.

Abstract translation: 向基板施加第一对准标记，向掩模施加第二对准标记。 掩模在基板上形成电子电路图案。 控制单元基于第一和第二对准标记执行掩模和基板的对准。 第二对准标记形成为围绕第一对准标记。 第二对准标记中具有台阶图案。

公开(公告)号：US20140292466A1

公开(公告)日：2014-10-02

申请号：US14227111

申请日：2014-03-27

Applicant: TDK CORPORATION

Inventor： Fumio WATANABE ,  Naozumi ISHIKAWA ,  Hiroshi KAMIYAMA

IPC: H01F27/29 ,  H01F41/32 ,  C25D5/02

CPC classification number: H01F27/29 ,  C25D5/022 ,  H01F17/0013 ,  H01F41/042 ,  H01F2017/0066

Abstract: A coil component 1 includes a thin-film coil layer including spiral conductors and bump electrodes 12a to 12d formed on a surface of the thin-film coil layer. The thin-film coil layer includes internal terminal electrodes 24a to 24d connected respectively to corresponding one ends of the spiral conductors, and a fourth insulating layer 15d covering the internal terminal electrode 24a to 24d and having openings ha to hd. Both a top surface TS and a side surface SS of each of the internal terminal electrodes 24a to 24d are exposed through the corresponding opening. The bump electrodes 12a to 12d are each brought into contact with both the top surface TS and side surface SS of each of the internal terminal electrodes 24a to 24d in the corresponding opening.

Abstract translation: 线圈部件1包括薄膜线圈层，该薄膜线圈层包括形成在薄膜线圈层的表面上的螺旋导体和凸起电极12a至12d。 薄膜线圈层包括分别连接到螺旋导体的相应一端的内部端子电极24a至24d以及覆盖内部端子电极24a至24d并具有开口ha至hd的第四绝缘层15d。 每个内部端子电极24a至24d的顶表面TS和侧表面SS都通过相应的开口露出。 凸起电极12a至12d分别与相应开口中的每个内部端子电极24a至24d的顶表面TS和侧表面SS接触。

公开(公告)号：US20140266547A1

公开(公告)日：2014-09-18

申请号：US14198857

申请日：2014-03-06

Applicant: TDK CORPORATION

Inventor： Fumio WATANABE ,  Naozumi ISHIKAWA ,  Hiroshi KAMIYAMA

IPC: H01F27/28 ,  H01F41/04

CPC classification number: H01F17/0013 ,  H01F27/29 ,  H01F41/042 ,  H01F2017/0066 ,  H01F2017/0093 ,  Y10T29/4902

Abstract: An electronic component includes a first conductor layer including a first conductor pattern P1, a first insulating layer covering the first conductor layer, a first opening h1 passing through the first insulting layer to expose top and side surfaces of the first conductor pattern P1 therethrough, and a second conductor layer formed on the first insulating layer and including a second conductor pattern P2 connected to the first conductor pattern P1 through the first opening h1. A first opening region which is a planar region inside the first opening h1 includes a first region in which the first conductor pattern P1 is formed and a second region in which the first conductor pattern P1 is not formed. The second conductor pattern P2 is embedded in both the first and second regions of the first opening h1.

Abstract translation: 电子部件包括：第一导体层，包括第一导体图案P1，覆盖第一导体层的第一绝缘层;穿过第一绝缘层的第一开口h1，以暴露第一导体图案P1的顶部和侧面;以及 形成在第一绝缘层上并包括通过第一开口h1连接到第一导体图案P1的第二导体图案P2的第二导体层。 第一开口h1内的平面区域的第一开口区域包括形成第一导体图案P1的第一区域和未形成第一导体图案P1的第二区域。 第二导体图案P2嵌入第一开口h1的第一和第二区域中。