Multilayer ceramic capacitor
    1.
    发明授权

    公开(公告)号:US09842693B2

    公开(公告)日:2017-12-12

    申请号:US14959363

    申请日:2015-12-04

    CPC classification number: H01G4/012 H01G4/12 H01G4/232 H01G4/30 H01G4/385

    Abstract: A multilayer ceramic capacitor includes an element body, a first terminal electrode, a second terminal electrode, and a plurality of internal electrodes. The plurality of internal electrodes include a plurality of first internal electrodes, a plurality of second internal electrodes, a plurality of third internal electrodes, and a plurality of fourth internal electrodes. The element body includes a plurality of first and second regions. The first regions are located between the first internal electrodes opposed with each other. The second regions are located between the first internal electrodes opposed to each other through the third internal electrodes, and between the second internal electrodes opposed to each other through the fourth internal electrodes. The first regions and the second regions are alternately located in the first direction.

    ELECTRONIC COMPONENT
    3.
    发明公开

    公开(公告)号:US20230268128A1

    公开(公告)日:2023-08-24

    申请号:US18154165

    申请日:2023-01-13

    CPC classification number: H01G4/224 H01G4/005 H01G4/12 H01G4/248

    Abstract: An electronic component having a case including an accommodation part having an opening; a ceramic element in the accommodation part with first and second main faces facing each other, a first and second electrode formed to the first and second main face, respectively; a first metal terminal including a first electrode connecting part connecting to the first electrode, a first mounting part exposed out of the accommodation part through the opening, and a first terminal arm part connecting the first electrode connecting part and the first mounting part; a second metal terminal including a second electrode connecting part connecting to the second electrode, a second mounting part exposed out of the accommodation part through the opening, and a second terminal arm part connecting the second electrode connecting part and the second mounting part; and an insulation member between the first electrode and the second terminal arm part.

    Electronic device
    4.
    发明授权

    公开(公告)号:US11646163B2

    公开(公告)日:2023-05-09

    申请号:US17228822

    申请日:2021-04-13

    CPC classification number: H01G4/40 H01F27/28 H01G4/224 H01G4/228 H01G4/38

    Abstract: An electronic device includes first and second capacitors, a case, a coil, and first to fourth conductive terminals. The first capacitor includes first and second terminal electrodes. The second capacitor includes third and fourth terminal electrodes. The case includes an accommodation recess for accommodating the first and second capacitors. The coil is separated from the first and second capacitors by a part of the case and disposed outside the accommodation recess. The first terminal is connected to the first electrode and partly disposed on a mounting-side bottom surface of the case. The second terminal is connected to one end of the coil and the second electrode and partly disposed on the surface. The third terminal is connected to the other end of the coil and the third electrode and partly disposed on the surface. The fourth terminal is connected to the fourth electrode and partly disposed on the surface.

    Electronic component
    5.
    发明授权

    公开(公告)号:US11443897B2

    公开(公告)日:2022-09-13

    申请号:US17243961

    申请日:2021-04-29

    Abstract: An electronic component includes an element body, an external electrode, and a metal terminal. In the metal terminal, a base includes a first surface and a second surface opposing each other, and a pair of third surfaces coupling the first surface and the second surface. A first metal layer is disposed on the first surface and connected to solder with which the external electrode and the metal terminal are connected together. A second metal layer is disposed on the second surface. A coating layer is disposed on each of the third surfaces. The first metal layer and the second metal layer each include an outermost layer containing Sn. Each of the coating layer includes an outermost layer lower in solder wettability than the respective outermost layers of the first metal layer and the second metal layer.

    Electronic component
    6.
    发明授权

    公开(公告)号:US12278055B2

    公开(公告)日:2025-04-15

    申请号:US18154165

    申请日:2023-01-13

    Abstract: An electronic component having a case including an accommodation part having an opening; a ceramic element in the accommodation part with first and second main faces facing each other, a first and second electrode formed to the first and second main face, respectively; a first metal terminal including a first electrode connecting part connecting to the first electrode, a first mounting part exposed out of the accommodation part through the opening, and a first terminal arm part connecting the first electrode connecting part and the first mounting part; a second metal terminal including a second electrode connecting part connecting to the second electrode, a second mounting part exposed out of the accommodation part through the opening, and a second terminal arm part connecting the second electrode connecting part and the second mounting part; and an insulation member between the first electrode and the second terminal arm part.

    ELECTRONIC COMPONENT
    7.
    发明申请

    公开(公告)号:US20250104925A1

    公开(公告)日:2025-03-27

    申请号:US18804885

    申请日:2024-08-14

    Abstract: An electronic component includes: a substrate; a plurality of multilayer capacitors mounted on a first main surface of the substrate; and a sealing part formed of a resin and sealing the plurality of multilayer capacitors. A first external electrode and a second external electrode of the multilayer capacitor are mounted on the substrate by solder. At least a part of adjacent multilayer capacitors overlaps each other when viewed from a direction in which a pair of side surfaces of an element body are opposed to each other, the direction being along the first main surface of the substrate. In the adjacent multilayer capacitors, stacking directions of a plurality of internal electrodes are the same, and a distance between the adjacent multilayer capacitors is ½ or less of a height of the multilayer capacitor mounted on the substrate.

    Electronic component with metal terminal, connection structure, and method for manufacturing connection structure

    公开(公告)号:US12230448B2

    公开(公告)日:2025-02-18

    申请号:US17899797

    申请日:2022-08-31

    Abstract: An electronic component with a metal terminal includes an electronic component having an element body, and external electrodes respectively provided on end surfaces facing each other in an X direction in the element body; and plate-shaped metal terminals having joint portions joined to the external electrodes, and leg portions provided to protrude beyond the electronic component in a Z direction. The leg portion of the metal terminal has an extending part continuously extending in the Z direction from the joint portion, a first bent part bent from a tip of the extending part to the electronic component side at a first angle formed to be an acute angle with respect to the extending part, and a second bent part bent from a tip of the first bent part at a second angle larger than the first angle with respect to the extending part.

    Ceramic electronic component
    10.
    发明授权

    公开(公告)号:US11430607B2

    公开(公告)日:2022-08-30

    申请号:US17322079

    申请日:2021-05-17

    Abstract: An electronic component according to the present invention is an electronic component including: a ceramic element body including an internal electrode; and an external electrode formed on an outer surface of the ceramic element body. The external electrode includes: a first electrode layer electrically connected to at least a part of the internal electrode; and a second electrode layer formed on an outside of the first electrode layer. The first electrode layer has a first conductor region containing copper, and the second electrode layer has a second conductor region including a matrix phase containing silver and palladium and copper particles dispersed in the matrix phase.

Patent Agency Ranking