公开(公告)号：US20130208401A1

公开(公告)日：2013-08-15

申请号：US13757058

申请日：2013-02-01

Applicant: TDK Corporation

Inventor： Yukihiko SHIRAKAWA ,  Yasuhito TAKAMATSU ,  Osamu HIROSE ,  Kazuhiro NAKAMURA ,  Daisuke HIROTA

IPC: H01G13/06 ,  H01G4/008

CPC classification number: H01G13/06 ,  H01G4/008 ,  H01G4/12 ,  H01G4/2325 ,  H01G4/30

Abstract: An electronic component has an element body and an external electrode arranged on the element body. The element body has a pair of end faces opposed to each other, a pair of principal faces opposed to each other, and a pair of side faces opposed to each other. The external electrode is formed so as to cover the end face and a partial region of the principal face and/or a partial region of the side face. The external electrode has a thick film electrode, a thin film electrode, and a plated layer. The thick film electrode is formed on the end face. The thin film electrode is formed so as to cover the thick film electrode and the partial region of the principal face and/or the partial region of the side face. The plated layer is formed outside the thin film electrode and contains Sn or an Sn alloy.

Abstract translation: 电子部件具有设置在元件主体上的元件主体和外部电极。 元件主体具有彼此相对的一对端面，彼此相对的一对主面以及彼此相对的一对侧面。 外部电极形成为覆盖主面的端面和主面的部分区域和/或侧面的部分区域。 外部电极具有厚膜电极，薄膜电极和镀层。 厚膜电极形成在端面上。 形成薄膜电极以覆盖厚膜电极以及侧面的主面和/或部分区域的部分区域。 电镀层形成在薄膜电极的外侧，并含有Sn或Sn合金。

公开(公告)号：US20160118193A1

公开(公告)日：2016-04-28

申请号：US14990192

申请日：2016-01-07

Applicant: TDK CORPORATION

Inventor： Yukihiko SHIRAKAWA ,  Kazuhiro NAKAMURA ,  Shintaro KON ,  Hiromitsu NOGIWA

IPC: H01G4/30 ,  H01G4/228 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01C1/148 ,  H01G4/12 ,  H01G4/224 ,  H01G4/228 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248

Abstract: An electronic component comprises an element body, an external electrode, and an insulating resin coating layer. The element body has a pair of end faces opposed to each other, a pair of principal faces extending so as to connect the pair of end faces and opposed to each other, and a pair of side faces extending so as to connect the pair of principal faces and opposed to each other. The external electrode is formed so as to cover at least a partial region of the principal face and/or a partial region of the side face and has a plating layer comprised of Sn or an Sn alloy. The insulating resin coating layer covers at least the portion of the external electrode formed so as to cover the side face.

公开(公告)号：US20150255215A1

公开(公告)日：2015-09-10

申请号：US14716082

申请日：2015-05-19

Applicant: TDK CORPORATION

Inventor： Yukihiko SHIRAKAWA ,  Kazuhiro NAKAMURA ,  Shintaro KON ,  Hiromitsu NOGIWA

IPC: H01G4/224 ,  H01G4/248 ,  H01G4/232

CPC classification number: H01G4/30 ,  H01C1/148 ,  H01G4/12 ,  H01G4/224 ,  H01G4/228 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248

Abstract: An electronic component comprises an element body, an external electrode, and an insulating resin coating layer. The element body has a pair of end faces opposed to each other, a pair of principal faces extending so as to connect the pair of end faces and opposed to each other, and a pair of side faces extending so as to connect the pair of principal faces and opposed to each other. The external electrode is formed so as to cover at least a partial region of the principal face and/or a partial region of the side face and has a plating layer comprised of Sn or an Sn alloy. The insulating resin coating layer covers at least the portion of the external electrode formed so as to cover the side face.

Abstract translation: 电子部件包括元件主体，外部电极和绝缘树脂涂层。 元件主体具有彼此相对的一对端面，一对主面被延伸以便连接该对端面并彼此相对，并且一对侧面延伸以连接该对主体 面对彼此反对。 外部电极形成为覆盖主面的至少一部分区域和/或侧面的部分区域，并且具有由Sn或Sn合金构成的镀层。 绝缘树脂被覆层至少覆盖形成为覆盖侧面的外部电极的部分。