公开(公告)号：US20160049257A1

公开(公告)日：2016-02-18

申请号：US14923999

申请日：2015-10-27

Applicant: TDK CORPORATION

Inventor： Yukihiko SHIRAKAWA ,  Tatsuo INAGAKI ,  Shintaro KON ,  Osamu HIROSE ,  Masahiko KONNO

IPC: H01G4/30 ,  H05K1/18 ,  H01G4/248 ,  H01G4/012

CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248 ,  H05K1/181 ,  H05K3/3442 ,  H05K2203/046

Abstract: An electronic component comprises an element body and an outer electrode. The element body has a pair of end faces opposing each other, a pair of main faces opposing each other while extending so as to connect the pair of end faces to each other, and a pair of side faces opposing each other while extending so as to connect the pair of main faces to each other. The outer electrode is formed on the end face side of the element body and covers a portion of the main and side faces adjacent to the end face. At least a surface of an electrode portion of the outer electrode located on the side face side thereof is covered with an insulating layer.

Abstract translation: 电子部件包括元件主体和外部电极。 元件主体具有彼此相对的一对端面，一对主面相互延伸，同时延伸以将一对端面彼此连接，并且一对侧面彼此相对延伸，以便 将一对主面相互连接。 外电极形成在元件体的端面侧，并且覆盖与端面相邻的主面和侧面的一部分。 至少位于其侧面侧的外电极的电极部分的表面被绝缘层覆盖。

公开(公告)号：US20160118193A1

公开(公告)日：2016-04-28

申请号：US14990192

申请日：2016-01-07

Applicant: TDK CORPORATION

Inventor： Yukihiko SHIRAKAWA ,  Kazuhiro NAKAMURA ,  Shintaro KON ,  Hiromitsu NOGIWA

IPC: H01G4/30 ,  H01G4/228 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01C1/148 ,  H01G4/12 ,  H01G4/224 ,  H01G4/228 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248

Abstract: An electronic component comprises an element body, an external electrode, and an insulating resin coating layer. The element body has a pair of end faces opposed to each other, a pair of principal faces extending so as to connect the pair of end faces and opposed to each other, and a pair of side faces extending so as to connect the pair of principal faces and opposed to each other. The external electrode is formed so as to cover at least a partial region of the principal face and/or a partial region of the side face and has a plating layer comprised of Sn or an Sn alloy. The insulating resin coating layer covers at least the portion of the external electrode formed so as to cover the side face.

公开(公告)号：US20150255215A1

公开(公告)日：2015-09-10

申请号：US14716082

申请日：2015-05-19

Applicant: TDK CORPORATION

Inventor： Yukihiko SHIRAKAWA ,  Kazuhiro NAKAMURA ,  Shintaro KON ,  Hiromitsu NOGIWA

IPC: H01G4/224 ,  H01G4/248 ,  H01G4/232

CPC classification number: H01G4/30 ,  H01C1/148 ,  H01G4/12 ,  H01G4/224 ,  H01G4/228 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248

Abstract: An electronic component comprises an element body, an external electrode, and an insulating resin coating layer. The element body has a pair of end faces opposed to each other, a pair of principal faces extending so as to connect the pair of end faces and opposed to each other, and a pair of side faces extending so as to connect the pair of principal faces and opposed to each other. The external electrode is formed so as to cover at least a partial region of the principal face and/or a partial region of the side face and has a plating layer comprised of Sn or an Sn alloy. The insulating resin coating layer covers at least the portion of the external electrode formed so as to cover the side face.

Abstract translation: 电子部件包括元件主体，外部电极和绝缘树脂涂层。 元件主体具有彼此相对的一对端面，一对主面被延伸以便连接该对端面并彼此相对，并且一对侧面延伸以连接该对主体 面对彼此反对。 外部电极形成为覆盖主面的至少一部分区域和/或侧面的部分区域，并且具有由Sn或Sn合金构成的镀层。 绝缘树脂被覆层至少覆盖形成为覆盖侧面的外部电极的部分。