公开(公告)号：US20170229761A1

公开(公告)日：2017-08-10

申请号：US15422765

申请日：2017-02-02

Applicant: TDK Corporation

Inventor： TOSHIO TOMONARI ,  Toshifumi KOMACHI ,  Hirohumi ASOU

IPC: H01Q1/24 ,  H01Q1/36 ,  H04M1/02

CPC classification number: H01Q1/243 ,  H01Q1/36 ,  H01Q7/00 ,  H04B5/0075 ,  H04M1/0202

Abstract: Disclosed herein is an antenna device that includes: a planar coil pattern that surrounds an inner diameter region, the inner diameter region including a center region elongated in a first direction, a first end region positioned at one side in the first direction as viewed from the center region, and a second end region positioned at other side in the first direction as viewed from the center region; and a metal layer that covers the planar coil pattern, the metal layer including a first slit that overlaps a part of the first end region and a second slit that is formed separately from the first slit and overlaps a part of the second end region.

公开(公告)号：US20150303573A1

公开(公告)日：2015-10-22

申请号：US14696899

申请日：2015-04-27

Applicant: TDK CORPORATION

Inventor： TOSHIO TOMONARI ,  Hirohumi ASOU ,  Toshifumi KOMACHI

IPC: H01Q7/00 ,  H01Q7/06

CPC classification number: H01Q7/00 ,  H01Q7/06

Abstract: A coil component is provided with a substrate; an antenna coil formed into a loop-shaped or spiral-shaped on the substrate; and first and second metallic layers disposed so as to overlap the antenna coil in a planar view and to form a slit sandwiched the first and second metallic layers. The slit overlaps with an inner diameter portion of the antenna coil . At least one of the first and second metallic layers is formed into a loop shape having an opening. The antenna coil overlaps with the opening of at least one of the first and second metallic layers in a planar view.

Abstract translation: 线圈部件设置有基板; 在基板上形成为环状或螺旋状的天线线圈; 以及在平面图中与天线线圈重叠设置的第一和第二金属层，并且形成夹在第一和第二金属层之间的狭缝。 狭缝与天线线圈的内径部分重叠。 第一和第二金属层中的至少一个形成为具有开口的环形。 在平面图中，天线线圈与第一和第二金属层中的至少一个的开口重叠。

公开(公告)号：US20170345560A1

公开(公告)日：2017-11-30

申请号：US15605623

申请日：2017-05-25

Applicant: TDK CORPORATION

Inventor： TOSHIO TOMONARI ,  TSUTOMU KOBAYASHI ,  EMI ITO ,  YUMA KOMAYA

IPC: H01F27/38 ,  H03H1/00 ,  H03H7/42 ,  H05K1/11 ,  H01F27/28 ,  H01F27/29 ,  H05K1/18

CPC classification number: H03H7/427 ,  H01F27/2823 ,  H01F27/29 ,  H01F27/292 ,  H01F27/38 ,  H01F2017/0093 ,  H03H1/00 ,  H03H2001/0085 ,  H03H2001/0092 ,  H05K1/0225 ,  H05K1/0233 ,  H05K1/0245 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/1003 ,  H05K2201/1006

Abstract: Disclosed herein is an electronic circuit module that includes a circuit board and a common mode filter mounted on the circuit board. The common mode filter includes first and second terminal electrodes constituting a first pair of terminal electrodes and third and fourth electrodes constituting a second pair of terminal electrodes. The circuit board includes: a first wiring layer having first, second, third, and fourth land patterns connected to the first, second, third, and fourth terminal electrodes, respectively, and first, second, third, and fourth wiring patterns connected to the first, second, third, and fourth land patterns, respectively; and a second wiring layer having a ground pattern that overlaps the first, second, third, and fourth wiring patterns without overlapping the first and second land patterns.