公开(公告)号：US20180062283A1

公开(公告)日：2018-03-01

申请号：US15680826

申请日：2017-08-18

Applicant: TDK Corporation

Inventor： Kazuharu KITATANI

IPC: H01R9/22 ,  H01R9/24 ,  H01R9/18

CPC classification number: H01R9/223 ,  H01R4/34 ,  H01R9/18 ,  H01R9/24 ,  H01R9/2416 ,  H01R13/447

Abstract: There is provided a terminal block to which load lines can be attached in multiple directions and which includes a terminal cover that makes terminal portions difficult for fingers to touch and is less likely to damage the load lines. The terminal block includes: a conductive plate including a first-direction connection portion that extends in a first direction and is capable of being connected with at least one wire, and a second-direction connection portion that is in electrical conduction with the first-direction connection portion, extends in a second direction different from the first direction, and is capable of being connected with at least one wire.

公开(公告)号：US20190164686A1

公开(公告)日：2019-05-30

申请号：US16133042

申请日：2018-09-17

Applicant: TDK Corporation

Inventor： Kazuharu KITATANI ,  Kiyomi YAMAZAKI ,  Tomokazu IKARASHI

IPC: H01F27/32 ,  H01F30/04 ,  H01F27/30 ,  H01F27/29

Abstract: A substrate includes primary side terminal holes into which the primary side terminals are inserted, secondary side terminal holes into which the secondary side terminals are inserted, and a slit disposed between the primary side terminal holes and the secondary side terminal holes. A transformer is mounted from the side of a mounting surface of the substrate. An insulating member is inserted into the slit from the side of a soldering surface of the substrate. The insulating member includes a protrusion portion that protrudes outside an area defined by virtual lines which are direct extension lines of the width of the slit to the side of the soldering surface. The protrusion portion is formed at a position more distant from the substrate than an end position of the shortest terminal of the primary side terminals and the secondary side terminals from the soldering surface of the substrate.

公开(公告)号：US20190164687A1

公开(公告)日：2019-05-30

申请号：US16136430

申请日：2018-09-20

Applicant: TDK Corporation

Inventor： Kazuharu KITATANI ,  Kiyomi YAMAZAKI ,  Tomokazu IKARASHI

IPC: H01F27/32 ,  H01F27/29 ,  H01F27/24

Abstract: A highly reliable winding part is provided which is capable of providing insulation with reliability. A core is attached to a bobbin along a first direction. First terminals and second terminals are disposed along the first direction. A first terminal group and a second terminal group are disposed with the core interposed between the groups. A first insulation portion or a recess along a second direction that is not parallel to the first direction is provided between the first terminals and the second terminals, and a second insulation portion or a core groove along the first direction is provided between the first terminal group and the second terminal group.

公开(公告)号：US20190164688A1

公开(公告)日：2019-05-30

申请号：US16136578

申请日：2018-09-20

Applicant: TDK Corporation

Inventor： Kazuharu KITATANI ,  Kiyomi YAMAZAKI ,  Tomokazu IKARASHI

IPC: H01F27/32 ,  H01F27/29 ,  H01F27/30 ,  H01F27/24

Abstract: First terminals connected to a first winding and second terminals connected to a second winding that is required to be insulated from the first winding are protruded from a bobbin, at least two terminals for each winding. The terminals are sequentially disposed in a row as “a first terminal, a first terminal, a second terminal, and a second terminal” in that order. A winding part is provided, of which mounting area can be reduced even when an automatic winding machine winds a plurality of windings at a time.

公开(公告)号：US20170105285A1

公开(公告)日：2017-04-13

申请号：US15281340

申请日：2016-09-30

Applicant: TDK Corporation

Inventor： Kazuharu KITATANI ,  Yasunobu NOGUCHI

IPC: H05K1/18 ,  H05K3/34 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/0263 ,  H05K1/11 ,  H05K3/306 ,  H05K3/34 ,  H05K3/3447 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10257 ,  H05K2201/10272

Abstract: A circuit board includes a base substrate, a busbar disposed on a mounting surface-side of the base substrate; and an electronic component disposed on the mounting surface-side and including a plurality of terminals, at least one of which is soldered to a component connecting end portion extending from the busbar. The base substrate has an opening into which the component connecting end portion can be inserted. A first insertion portion through which the terminal can be inserted is provided in the component connecting end portion. The busbar is fixed to the base substrate so that the component connecting end portion is inserted into the opening with a soldering surface, on a side of the component connecting end portion where the terminal inserted through the first insertion portion protrudes, positioned closer to a rear surface of the base substrate than the component mounting surface.