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公开(公告)号:US10727156B2
公开(公告)日:2020-07-28
申请号:US15064304
申请日:2016-03-08
发明人: Steve Qingjun Cai , Chung-Lung Chen , Chialun Tsai
摘要: A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks.
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公开(公告)号:US20160190037A1
公开(公告)日:2016-06-30
申请号:US15064304
申请日:2016-03-08
发明人: Steve Qingjun Cai , Chung-Lung Chen , Chialun Tsai
IPC分类号: H01L23/427 , B23P15/26 , F28F21/04 , F28D15/02 , F28D15/04
CPC分类号: H01L23/427 , B23P15/26 , F28D15/0266 , F28D15/0283 , F28D15/046 , F28F21/04 , H01L21/4882 , H01L2924/0002 , H05K3/22 , Y10T29/49352 , Y10T29/49353 , Y10T156/10 , H01L2924/00
摘要: A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks.
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公开(公告)号:US09326383B2
公开(公告)日:2016-04-26
申请号:US13913114
申请日:2013-06-07
发明人: Steve Qingjun Cai , Chung-Lung Chen , Chialun Tsai
CPC分类号: H01L23/427 , B23P15/26 , F28D15/0266 , F28D15/0283 , F28D15/046 , F28F21/04 , H01L21/4882 , H01L2924/0002 , H05K3/22 , Y10T29/49352 , Y10T29/49353 , Y10T156/10 , H01L2924/00
摘要: A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks.
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公开(公告)号:US10677536B2
公开(公告)日:2020-06-09
申请号:US15367728
申请日:2016-12-02
发明人: Steve Qingjun Cai , Avijit Bhunia
摘要: An osmotic transport apparatus includes a heat conducting chamber having an inner wall, a heat absorption end and a heat dissipation end, an osmotic membrane extending substantially longitudinally along an inner wall of the heat conducting chamber from the heat absorption end to the heat dissipation end, a liquid salt solution disposed in the osmotic membrane, and an inner vapor cavity so that when heat is applied to the heat absorption end, vapor is expelled from the osmotic membrane at the heat absorption end, is condensed on the osmotic membrane at the heat dissipation end, and is drawn into the osmotic membrane at the heat dissipation end for passive pumping transport back to the heat absorption end as more condensate is drawn through the osmotic membrane.
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公开(公告)号:US20170234624A1
公开(公告)日:2017-08-17
申请号:US15367728
申请日:2016-12-02
发明人: Steve Qingjun Cai , Avijit Bhunia
摘要: An osmotic transport apparatus includes a heat conducting chamber having an inner wall, a heat absorption end and a heat dissipation end, an osmotic membrane extending substantially longitudinally along an inner wall of the heat conducting chamber from the heat absorption end to the heat dissipation end, a liquid salt solution disposed in the osmotic membrane, and an inner vapor cavity so that when heat is applied to the heat absorption end, vapor is expelled from the osmotic membrane at the heat absorption end, is condensed on the osmotic membrane at the heat dissipation end, and is drawn into the osmotic membrane at the heat dissipation end for passive pumping transport back to the heat absorption end as more condensate is drawn through the osmotic membrane.
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