Repositionable, moisture-curing adhesive tape

    公开(公告)号:US10858549B2

    公开(公告)日:2020-12-08

    申请号:US16096224

    申请日:2017-04-18

    Applicant: TESA SE

    Abstract: The present invention relates to a pressure-sensitive adhesive tape comprising or consisting of a moisture-curing composition comprising or consisting of: A 5 to 60 parts by weight of at least one film-former component; B 40 to 95 parts by weight of at least one epoxide component; C 10 to 500 parts by weight of at least one moisture-activatable curing agent; D optionally 0.1 to 15 parts by weight of at least one stabilizer, and E optionally 0.1 to 200 parts by weight of at least one additive, based in each case on the moisture-curing composition, with the parts by weight of components A and B adding up to 100 and with the moisture-curing composition being characterized in that the moisture-activatable hardener C comprises or consists of at least one blocked amine. The invention further relates to a method for assembling two components using such adhesive tape.

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