公开(公告)号：US3597834A

公开(公告)日：1971-08-10

申请号：US3597834D

申请日：1968-02-14

Applicant: TEXAS INSTRUMENTS INC

Inventor： LATHROP JAY W ,  CLARK ROBERT S ,  WOOD SAM J JR

IPC: H01L21/00 ,  H01L23/485 ,  H01L23/522 ,  B41M3/08 ,  B01J17/00

CPC classification number: H01L23/485 ,  H01L21/00 ,  H01L23/522 ,  H01L2924/0002 ,  Y10T29/49155 ,  H01L2924/00

Abstract: This specification discloses an improvement in forming an electrically continuous circuit in which one metal conductor is connected with another metal conductor through an aperture in an insulating layer therebetween. The improvement is characterized by electrolessly depositing a metal conductor in and through the aperture to effect electrical connection with the first metal conductors and electrically connecting the second layer metal conductor therewith. Thus, good electrical continuity is effected regardless of the configuration of the sidewalls of the aperture.

公开(公告)号：US3581161A

公开(公告)日：1971-05-25

申请号：US3581161D

申请日：1969-01-02

Applicant: TEXAS INSTRUMENTS INC

Inventor： CUNNINGHAM JAMES A ,  CLARK ROBERT S

IPC: H01L21/00 ,  H01L23/29 ,  H01L23/485 ,  H01L23/522 ,  H01L5/02

CPC classification number: H01L23/485 ,  H01L21/00 ,  H01L23/291 ,  H01L23/522 ,  H01L2924/0002 ,  H01L2924/00

Abstract: There is disclosed a multilevel contact and interconnection system for integrated circuits comprising at least three levels. Ohmically connecting to the semiconductor through an opening in its insulating layer is a first layer of molybdenum. The second layer is of gold and the third of molybdenum. This system is virtually alloyless since the molybdenum does not alloy with the semiconductor material or the gold.