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1.发明授权
公开(公告)号：US3666913A
公开(公告)日：1972-05-30
申请号：US3666913D
申请日：1966-09-14
Applicant: TEXAS INSTRUMENTS INC
Inventor： HAEFLING JAMES F , MEYER LAWRENCE L
CPC classification number: B23K11/11 , H05K3/328 , Y10T29/49169
Abstract: This invention provides a method for bonding a copper etched circuit board lead to a component lead while eliminating blow out of the copper lead by applying an oxide to the copper lead which is relatively non-conductive at temperatures below the welding temperature but decomposible at the welding temperature. Because of the insulating properties of the oxide, a larger current passes through the component lead than the copper lead, allowing the component lead to be preheated to the bonding temperature, decomposing the oxide and thereby bonding the copper lead to the preheated component lead.
Abstract translation: 本发明提供了一种将铜蚀刻电路板引线接合到元件引线的方法，同时通过向低于焊接温度的温度下相对不导电的铜导线施加氧化物，同时消除铜引线的氧化，但在焊接时可分解 温度。 由于氧化物的绝缘性能，比铜引线更大的电流通过元件引线，允许元件引线被预热到接合温度，分解氧化物，从而将铜引线接合到预热元件引线。
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公开(公告)号：US3261079A
公开(公告)日：1966-07-19
申请号：US22231062
申请日：1962-09-10
Applicant: TEXAS INSTRUMENTS INC
Inventor： CLINGMAN JR WILLIAM H , GRAY FOSTER L , HAEFLING JAMES F , WEST BARRY R
IPC: H01L35/34
CPC classification number: H01L35/34 , Y10S228/903
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3.发明授权
公开(公告)号：US3496021A
公开(公告)日：1970-02-17
申请号：US3496021D
申请日：1966-03-04
Applicant: TEXAS INSTRUMENTS INC
Inventor： HAEFLING JAMES F
CPC classification number: H01M4/9041 , H01M4/8621 , H01M2004/8684 , H01M2004/8689 , H01M2008/147 , H01M2300/0051 , Y02E60/526
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公开(公告)号：US3419765A
公开(公告)日：1968-12-31
申请号：US64297567
申请日：1967-06-01
Applicant: TEXAS INSTRUMENTS INC
Inventor： CLARK JACK H , TASSEL JAMES H VAN , LARRABEE GRAYDON B , HAEFLING JAMES F
IPC: H01L21/00 , H01L23/485 , H01L23/522
CPC classification number: H01L23/485 , H01L21/00 , H01L23/522 , H01L24/05 , H01L2224/04042 , H01L2224/45144 , H01L2224/48463 , H01L2924/01322 , H01L2924/12036 , H01L2924/14 , Y10T29/49126 , H01L2924/00
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