公开(公告)号：US20210035932A1

公开(公告)日：2021-02-04

申请号：US17009664

申请日：2020-09-01

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hiroyuki SADA ,  Shoichi IRIGUCHI ,  Genki YANO ,  Luu Thanh NGUYEN ,  Ashok PRABHU ,  Anindya PODDAR ,  Yi YAN ,  Hau NGUYEN

IPC: H01L23/00 ,  H01L21/78

Abstract: A method for backside metallization includes inkjet printing a pattern of nanosilver conductive ink on a first surface of a silicon wafer. The silicon wafer includes a plurality of dies. The pattern includes a clearance area along a scribe line between the dies. A laser is focused, through a second surface of the wafer, at a point between the first surface of the silicon wafer and the second surface of the silicon wafer. The second surface is opposite the first surface. The dies are separated along the scribe line.

公开(公告)号：US20250079258A1

公开(公告)日：2025-03-06

申请号：US18459198

申请日：2023-08-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Woochan KIM ,  Ashok PRABHU

IPC: H01L23/373 ,  H01L23/00 ,  H01L25/065

Abstract: In examples, a package comprises a substrate including a conductive member coupled to a conductive terminal, with the conductive terminal exposed to an exterior of the package. The package also includes a first semiconductor die having first device and first non-device sides, with the first device side coupled to the substrate and the first non-device side opposing the first device side, and with the first device side having circuitry formed therein. The package also includes a second semiconductor die having second device and second non-device sides, with the second device side coupled to the substrate and the second non-device side opposing the second device side, and with the second device side having circuitry formed therein. The package also includes first and second adhesive layers contacting the first and second non-device sides, respectively. The package also includes a passivation overcoat (PO) layer contacting the first and second adhesive layers, and a semiconductor layer contacting the PO layer and exposed to an exterior of the package.