公开(公告)号：US20240258245A1

公开(公告)日：2024-08-01

申请号：US18159966

申请日：2023-01-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： KWANG-SOO KIM ,  WOOCHAN KIM ,  VIVEK KISHORECHAND ARORA

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49555 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/32225 ,  H01L2224/48141 ,  H01L2224/48245 ,  H01L2224/73265 ,  H01L2224/92247

Abstract: An electronic device that includes a substrate and a die disposed on the substrate, the die having an active surface. Wire bonds are attached from the active surface of the die to the substrate. A radiation barrier is attached to the substrate and disposed over the die. The radiation barrier is configured to mitigate electromagnetic radiation exposure to the die. A mold compound is formed over the die, the wire bonds, and the radiation barrier.

公开(公告)号：US20230378022A1

公开(公告)日：2023-11-23

申请号：US17749311

申请日：2022-05-20

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： KWANG-SOO KIM ,  Vivek Kishorechand Arora ,  Woochan Kim

IPC: H01L23/373 ,  H01L25/07 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L23/3735 ,  H01L25/072 ,  H01L24/48 ,  H01L23/49861 ,  H01L21/4839 ,  H01L23/49822 ,  H01L23/49844 ,  H01L2924/1033 ,  H01L2924/1306 ,  H01L2224/48245 ,  H01L24/32 ,  H01L2224/32227 ,  H01L2224/73265 ,  H01L24/73 ,  H01L2224/48137

Abstract: A power module includes an interconnect of an integrated circuit (IC) package having a heat slug. The power module also includes a direct bonded copper (DBC) substrate. The DBC substrate has a first surface formed of pattern copper, the patterned copper has a pad and a second surface that opposes the first surface, the second surface has a sheet of copper. The second surface of the DBC substrate is thermally coupled to the heat slug. The power module further includes a die mounted on the pad of the first surface of the DBC substrate. The die has a power transistor. The die and the heat slug are thermally coupled and electrically isolated.