公开(公告)号：US11716117B2

公开(公告)日：2023-08-01

申请号：US17167753

申请日：2021-02-04

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Michael Lueders ,  Giacomo Calabrese ,  Nicola Bertoni

IPC: H04B3/00 ,  H04B5/00 ,  H01L21/20 ,  H01L21/50 ,  H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H01L23/34 ,  H01L23/48 ,  H01L23/60 ,  H01L23/522 ,  H01L23/528 ,  H01L25/00 ,  H01L25/065 ,  H01L49/02 ,  H05K3/46 ,  H05K1/16

CPC classification number: H04B5/005 ,  H04B5/0093 ,  H05K1/162 ,  H05K1/165 ,  H05K3/4673

Abstract: A circuit support structure includes a first metal layer, a second metal layer, isolation material containing the first and second metal layers, an isolation circuit, a first plurality of contact pads, and a second plurality of contact pads. The isolation circuit includes a first circuit element in the first metal layer and a second circuit element in the second metal layer and electrically isolated from the first circuit element by the isolation material. The first plurality of contact pads is adapted to be coupled to a first integrated circuit on the circuit support structure and includes a first contact pad electrically coupled to the first circuit element. The second plurality of contact pads is adapted to be coupled to a second integrated circuit on the circuit support structure and includes a second contact pad electrically coupled to the second circuit element.

公开(公告)号：US20230138281A1

公开(公告)日：2023-05-04

申请号：US17515391

申请日：2021-10-29

Applicant: Texas Instruments Incorporated

Inventor： Raul Blecic ,  Nicola Bertoni

IPC: H01F27/36 ,  H01F27/28

Abstract: A laminate transformer includes a multilayer substrate having at least first, second, third, and fourth metal layers. The second metal layer and the third metal layer are separated by a voltage barrier having a thickness. A first multiloop coil has at least a first loop on the first metal layer and at least a second loop on the second metal layer. A second multiloop coil has at least a third loop on the third metal layer and at least a fourth loop on the fourth metal layer. A partial EMI shield for the first multiloop coil is on the second metal layer. A partial EMI shield for the second multiloop coil is on the third metal layer.

公开(公告)号：US20240371800A1

公开(公告)日：2024-11-07

申请号：US18773348

申请日：2024-07-15

Applicant: Texas Instruments Incorporated

Inventor： Raul Blecic ,  Nicola Bertoni ,  Zhemin Zhang

IPC: H01L23/64 ,  H01F19/00 ,  H01F27/36 ,  H01L21/48 ,  H01L23/498 ,  H01L23/552

Abstract: An electronic device includes a multilevel lamination structure having a core layer, dielectric layers and conductive features formed in metal layers on or between respective ones or pairs of the dielectric layers. The core layer and the dielectric layers extend in respective planes of orthogonal first and second directions and are stacked along an orthogonal third direction. The conductive features include a first patterned conductive feature having multiple conductive turns in each of a first pair of the metal layers to form a first winding having a first turn and a final turn adjacent to one another in the same metal layer of the first pair, and a second patterned conductive feature having multiple conductive turns in a second pair of the metal layers to form a second winding having a first turn and a final turn.

公开(公告)号：US20230344467A1

公开(公告)日：2023-10-26

申请号：US18347201

申请日：2023-07-05

Applicant: Texas Instruments Incorporated

Inventor： Michael Lueders ,  Giacomo Calabrese ,  Nicola Bertoni

IPC: H04B5/00 ,  H05K3/46 ,  H05K1/16

CPC classification number: H04B5/005 ,  H04B5/0093 ,  H05K3/4673 ,  H05K1/162 ,  H05K1/165

Abstract: A circuit support structure includes a first metal layer, a second metal layer, isolation material containing the first and second metal layers, an isolation circuit, a first plurality of contact pads, and a second plurality of contact pads. The isolation circuit includes a first circuit element in the first metal layer and a second circuit element in the second metal layer and electrically isolated from the first circuit element by the isolation material. The first plurality of contact pads is adapted to be coupled to a first integrated circuit on the circuit support structure and includes a first contact pad electrically coupled to the first circuit element. The second plurality of contact pads is adapted to be coupled to a second integrated circuit on the circuit support structure and includes a second contact pad electrically coupled to the second circuit element.

公开(公告)号：US12218598B2

公开(公告)日：2025-02-04

申请号：US17828424

申请日：2022-05-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Giacomo Calabrese ,  Nicola Bertoni

IPC: H02M3/335 ,  H02M1/44

Abstract: A converter includes a transformer having a primary and secondary windings. The primary winding has first and second winding terminals. A switch network has first-sixth switch network terminals. The first switch network terminal couples to the first winding terminal. The second switch network terminal couples to the second winding terminal. A first transistor has a first control input and first and second current terminals. The second current terminal couples to the third switch network terminal. A second transistor has a second control input and third and fourth current terminals. The fourth current terminal couples to the fourth switch network terminal. A third transistor has a third control input and fifth and sixth current terminals. The fifth current terminal couples to the fifth switch network terminal. A fourth transistor has a fourth control input and seventh and eighth current terminals. The seventh current terminal couples to the sixth switch network terminal.

公开(公告)号：US20210258045A1

公开(公告)日：2021-08-19

申请号：US17167753

申请日：2021-02-04

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Michael Lueders ,  Giacomo Calabrese ,  Nicola Bertoni

IPC: H04B5/00 ,  H05K1/16 ,  H05K3/46

Abstract: A circuit support structure includes a first metal layer, a second metal layer, isolation material containing the first and second metal layers, an isolation circuit, a first plurality of contact pads, and a second plurality of contact pads. The isolation circuit includes a first circuit element in the first metal layer and a second circuit element in the second metal layer and electrically isolated from the first circuit element by the isolation material. The first plurality of contact pads is adapted to be coupled to a first integrated circuit on the circuit support structure and includes a first contact pad electrically coupled to the first circuit element. The second plurality of contact pads is adapted to be coupled to a second integrated circuit on the circuit support structure and includes a second contact pad electrically coupled to the second circuit element.

公开(公告)号：US12051657B2

公开(公告)日：2024-07-30

申请号：US17474103

申请日：2021-09-14

Applicant: Texas Instruments Incorporated

Inventor： Raul Ble{hacek over (c)}ić ,  Nicola Bertoni ,  Zhemin Zhang

IPC: H01L23/64 ,  H01F27/36 ,  H01L21/48 ,  H01L23/498 ,  H01L23/552 ,  H01L49/02 ,  H01F19/00

CPC classification number: H01L23/645 ,  H01F27/363 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/552 ,  H01L28/10 ,  H01F19/00

Abstract: An electronic device includes a multilevel lamination structure having a core layer, dielectric layers and conductive features formed in metal layers on or between respective ones or pairs of the dielectric layers. The core layer and the dielectric layers extend in respective planes of orthogonal first and second directions and are stacked along an orthogonal third direction. The conductive features include a first patterned conductive feature having multiple conductive turns in each of a first pair of the metal layers to form a first winding having a first turn and a final turn adjacent to one another in the same metal layer of the first pair, and a second patterned conductive feature having multiple conductive turns in a second pair of the metal layers to form a second winding having a first turn and a final turn.

公开(公告)号：US20240120964A1

公开(公告)日：2024-04-11

申请号：US18542381

申请日：2023-12-15

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Giacomo Calabrese ,  Nicola Bertoni ,  Misha Ivanov

IPC: H05K1/16 ,  H05K3/46

CPC classification number: H04B5/75 ,  H04B5/266 ,  H05K1/162 ,  H05K1/165 ,  H05K3/4673

Abstract: A package substrate includes a first metal layer, a second metal layer, isolation material containing the first and second metal layers, an isolation circuit, a first plurality of contact pads, and a second plurality of contact pads. The isolation circuit includes a first circuit element in the first metal layer and a second circuit element in the second metal layer and electrically isolated from the first circuit element by the isolation material. The first plurality of contact pads is adapted to be coupled to a first integrated circuit on the package substrate and includes a first contact pad coupled to the first circuit element. The second plurality of contact pads is adapted to be coupled to a second integrated circuit on the package substrate and includes a second contact pad coupled to the second circuit element.

公开(公告)号：US20220415829A1

公开(公告)日：2022-12-29

申请号：US17474103

申请日：2021-09-14

Applicant: Texas Instruments Incorporated

Inventor： Raul Blecic ,  Nicola Bertoni ,  Zhemin Zhang

IPC: H01L23/64 ,  H01L23/498 ,  H01L23/552 ,  H01L21/48 ,  H01L49/02 ,  H01F27/36

Abstract: An electronic device includes a multilevel lamination structure having a core layer, dielectric layers and conductive features formed in metal layers on or between respective ones or pairs of the dielectric layers. The core layer and the dielectric layers extend in respective planes of orthogonal first and second directions and are stacked along an orthogonal third direction. The conductive features include a first patterned conductive feature having multiple conductive turns in each of a first pair of the metal layers to form a first winding having a first turn and a final turn adjacent to one another in the same metal layer of the first pair, and a second patterned conductive feature having multiple conductive turns in a second pair of the metal layers to form a second winding having a first turn and a final turn.