WIRELESS POWER AND DATA TRANSFER USING A SINGLE PAIR OF COILS

    公开(公告)号:US20240275208A1

    公开(公告)日:2024-08-15

    申请号:US18569968

    申请日:2022-06-20

    摘要: A wireless power and data transfer system (1000) comprising: a single pair of inductive coils including: a primary coil (1009) arranged to transmit a power signal having a first frequency; and a secondary coil (1011) arranged to receive the power signal from the primary coil by wireless induction; a primary side circuit (1001) arranged to: generate a modulated first control signal by modulating a first control signal on a first carrier signal; and superimpose the modulated first control signal onto the power signal at the primary coil (1009), the first carrier signal having a second frequency different to the first frequency; and a secondary side circuit (1003) arranged to: generate a modulated second control signal by modulating a second control signal on a second carrier signal; and superimpose the modulated second control signal onto the power signal at the secondary coil (1011), the second carrier signal having a third frequency different to the first frequency and second frequency.

    Wireless power and data synchronous transfer system and data modulation method

    公开(公告)号:US12126402B2

    公开(公告)日:2024-10-22

    申请号:US18278074

    申请日:2022-07-22

    IPC分类号: H04B5/79 H02J50/12 H04B5/26

    CPC分类号: H04B5/79 H02J50/12 H04B5/266

    摘要: Disclosed in the present invention are a wireless power and data synchronous transfer system and a data modulation method, wherein a power/information complex modulation is carried out on a primary side front converter and a secondary side back converter, and output power/information flow can be transmitted across the wireless power transfer circuit, thus realizing communication between the primary side and the secondary side. With the method of the present invention, by modulating a digital frequency band signal to a direct current bus, frequency mixing effect of an inverter/rectifier circuit is utilized to move a spectrum of modulated digital signal to a frequency near a power transfer frequency and then the modulated digital signal is transmitted to a circuit on the other side, and the circuit on the other side demodulates the signal to obtain a baseband signal. The present invention has wide applicability and can be used in various wireless power transfer systems, especially for high-frequency systems.

    PACKAGED INTEGRATED CIRCUIT HAVING PACKAGE SUBSTRATE WITH INTEGRATED ISOLATION CIRCUIT

    公开(公告)号:US20240120964A1

    公开(公告)日:2024-04-11

    申请号:US18542381

    申请日:2023-12-15

    IPC分类号: H05K1/16 H05K3/46

    摘要: A package substrate includes a first metal layer, a second metal layer, isolation material containing the first and second metal layers, an isolation circuit, a first plurality of contact pads, and a second plurality of contact pads. The isolation circuit includes a first circuit element in the first metal layer and a second circuit element in the second metal layer and electrically isolated from the first circuit element by the isolation material. The first plurality of contact pads is adapted to be coupled to a first integrated circuit on the package substrate and includes a first contact pad coupled to the first circuit element. The second plurality of contact pads is adapted to be coupled to a second integrated circuit on the package substrate and includes a second contact pad coupled to the second circuit element.