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公开(公告)号:US12052068B2
公开(公告)日:2024-07-30
申请号:US17661465
申请日:2022-04-29
申请人: GOOGLE LLC
摘要: A method for a hard reset of a target electronic device includes establishing a near field communications (NFC) channel to the target electronic device, receiving a wireless signal at the target electronic device over the NFC channel, and comparing a signature of the received wireless signal with a predefined characteristic signature of a reset command signal. Responsive to the comparing, the method includes generating a reset signal resetting the target electronic device.
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公开(公告)号:US20240275208A1
公开(公告)日:2024-08-15
申请号:US18569968
申请日:2022-06-20
发明人: Karl Obszanski , Karina Obszanska , Cheah Moey , Masoud Kazemi
摘要: A wireless power and data transfer system (1000) comprising: a single pair of inductive coils including: a primary coil (1009) arranged to transmit a power signal having a first frequency; and a secondary coil (1011) arranged to receive the power signal from the primary coil by wireless induction; a primary side circuit (1001) arranged to: generate a modulated first control signal by modulating a first control signal on a first carrier signal; and superimpose the modulated first control signal onto the power signal at the primary coil (1009), the first carrier signal having a second frequency different to the first frequency; and a secondary side circuit (1003) arranged to: generate a modulated second control signal by modulating a second control signal on a second carrier signal; and superimpose the modulated second control signal onto the power signal at the secondary coil (1011), the second carrier signal having a third frequency different to the first frequency and second frequency.
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公开(公告)号:US12119891B2
公开(公告)日:2024-10-15
申请号:US18312277
申请日:2023-05-04
发明人: Hyunjae Kang
摘要: A contactless integrated circuit (IC) card reader configured to communicate with a contactless IC card includes an antenna circuit, a variable amplifier that amplifies a carrier signal at an amplification gain and outputs the amplified carrier signal to the antenna circuit as a transmit signal, a variable attenuator that attenuates a receive signal received through the antenna circuit at an attenuation ratio, and a controller that controls the amplification gain and the attenuation ratio based on the attenuated receive signal.
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公开(公告)号:US12126402B2
公开(公告)日:2024-10-22
申请号:US18278074
申请日:2022-07-22
申请人: ZHEJIANG UNIVERSITY
发明人: Xiangning He , Sheng Liu , Yue Feng , Jiande Wu
摘要: Disclosed in the present invention are a wireless power and data synchronous transfer system and a data modulation method, wherein a power/information complex modulation is carried out on a primary side front converter and a secondary side back converter, and output power/information flow can be transmitted across the wireless power transfer circuit, thus realizing communication between the primary side and the secondary side. With the method of the present invention, by modulating a digital frequency band signal to a direct current bus, frequency mixing effect of an inverter/rectifier circuit is utilized to move a spectrum of modulated digital signal to a frequency near a power transfer frequency and then the modulated digital signal is transmitted to a circuit on the other side, and the circuit on the other side demodulates the signal to obtain a baseband signal. The present invention has wide applicability and can be used in various wireless power transfer systems, especially for high-frequency systems.
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公开(公告)号:US20240266878A1
公开(公告)日:2024-08-08
申请号:US18469040
申请日:2023-09-18
申请人: NuCurrent, Inc.
IPC分类号: H02J50/12 , H01F27/34 , H01F27/36 , H01F38/14 , H01Q1/22 , H01Q1/24 , H01Q1/36 , H01Q1/38 , H01Q7/00 , H02J7/00 , H02J50/70 , H04B5/26 , H04B5/72 , H04B5/79 , H05K5/02 , H05K9/00
CPC分类号: H02J50/12 , H01F27/36 , H01F27/361 , H01F27/363 , H01F27/366 , H01F38/14 , H01Q1/2266 , H01Q1/24 , H01Q1/36 , H01Q1/38 , H01Q7/00 , H01Q7/005 , H02J50/70 , H04B5/26 , H04B5/266 , H04B5/72 , H04B5/79 , H05K5/0247 , H05K9/0084 , H01F2027/348 , H01Q1/248 , H02J7/00034
摘要: An electrically conductive material configured having at least one opening of various unlimited geometries extending through its thickness is provided. The opening is designed to modify eddy currents that form within the surface of the material from interaction with magnetic fields that allow for wireless energy transfer therethrough. The opening may be configured as a cut-out, a slit or combination thereof that extends through the thickness of the electrically conductive material. The electrically conductive material is configured with the cut-out and/or slit pattern positioned adjacent to an antenna configured to receive or transmit electrical energy wirelessly through near-field magnetic coupling (NFMC). A magnetic field shielding material, such as a ferrite, may also be positioned adjacent to the antenna. Such magnetic shielding materials may be used to strategically block eddy currents from electrical components and circuitry located within a device.
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公开(公告)号:US12014867B2
公开(公告)日:2024-06-18
申请号:US17999181
申请日:2021-05-20
CPC分类号: H01F38/14 , H01F27/255 , H01F27/2804 , H01F27/2885 , H01F27/363 , H01R13/62 , H04B5/266 , H01F2027/2819 , H01F2038/143
摘要: A connection system for exchanging electrical signals includes a first symmetrical connector and a second symmetrical connector. Each symmetrical connector has at least one magnetic core provided with at least one turn. The symmetrical connectors are produced in a substrate made of insulating material so as to form a half of a coupling transformer. At least one half of the coupling transformer of each connector is arranged opposite one another so as to be able to exchange a magnetic flux. The electrical signals are emitted by the first connector in the form of a magnetic flux, and the second connector generates the electrical signals on receiving the magnetic flux.
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公开(公告)号:US20240120964A1
公开(公告)日:2024-04-11
申请号:US18542381
申请日:2023-12-15
发明人: Giacomo Calabrese , Nicola Bertoni , Misha Ivanov
CPC分类号: H04B5/75 , H04B5/266 , H05K1/162 , H05K1/165 , H05K3/4673
摘要: A package substrate includes a first metal layer, a second metal layer, isolation material containing the first and second metal layers, an isolation circuit, a first plurality of contact pads, and a second plurality of contact pads. The isolation circuit includes a first circuit element in the first metal layer and a second circuit element in the second metal layer and electrically isolated from the first circuit element by the isolation material. The first plurality of contact pads is adapted to be coupled to a first integrated circuit on the package substrate and includes a first contact pad coupled to the first circuit element. The second plurality of contact pads is adapted to be coupled to a second integrated circuit on the package substrate and includes a second contact pad coupled to the second circuit element.
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