DISTRIBUTED MECHANISM FOR FINE-GRAINED TEST POWER CONTROL

    公开(公告)号:US20230185633A1

    公开(公告)日:2023-06-15

    申请号:US17551011

    申请日:2021-12-14

    CPC classification number: G06F9/5094 G06F9/5016 G06F11/3086 G06F11/321

    Abstract: An integrated circuit comprises a set of processor cores, wherein each processor core of the set of processor cores includes BIST logic circuitry and multiple memory blocks coupled to the BIST logic circuitry. Each processor core further includes multiple power control circuitry, where each power control circuitry of the multiple power control circuitry is coupled to a respective processor core of the set of processor cores, multiple isolation circuitry, where each isolation circuitry of the multiple isolation circuitry is coupled to a respective processor core of the set of processor cores, a built-in-self repair (BISR) controller coupled to the each of the set of processor cores, each of the multiple power control circuitry, and each of the multiple isolation circuitry, and a safety controller coupled to the BISR controller, the multiple power control circuitry, and to the multiple isolation circuitry.

    DISTRIBUTED MECHANISM FOR FINE-GRAINED TEST POWER CONTROL

    公开(公告)号:US20250123903A1

    公开(公告)日:2025-04-17

    申请号:US18999134

    申请日:2024-12-23

    Abstract: An example circuit, e.g., an integrated circuit, comprises processor cores, each of which includes multiple memory blocks; power control circuits respectively coupled to the processor cores; isolation circuits respectively coupled to the processor cores; and controller circuitry coupled to each of the processor cores, to each of the power control circuits, and to each of the isolation circuits. The controller circuitry is configured to select a subset of processor cores of the processor cores and a subset of memory blocks of the subset of processor cores for testing; and cause non-selected memory blocks of the processor cores to be at least one of power gated, clock gated, and isolated from the selected subset of memory blocks.

    BUILT-IN MEMORY REPAIR WITH REPAIR CODE COMPRESSION

    公开(公告)号:US20240321378A1

    公开(公告)日:2024-09-26

    申请号:US18736779

    申请日:2024-06-07

    CPC classification number: G11C29/4401 G11C29/16 G11C29/40

    Abstract: Circuits and methods are directed to repairable memory systems and memory repair processes. An example circuit includes first and second logic coupled together. The first logic receives a plurality of instances of defect data from a plurality of memories, respectively, in which each of the plurality of instances of defect data has a memory-specific format. The first logic converts each of the plurality of instances of defect data to a common format and merges the plurality instances of defect data in the common format to generate merged data. The second logic receives the merged data and determines a plurality of instances of repair data for the plurality of instances of defect data, respectively, based on the merged data.

    BUILT-IN MEMORY REPAIR WITH REPAIR CODE COMPRESSION

    公开(公告)号:US20230253062A1

    公开(公告)日:2023-08-10

    申请号:US18301327

    申请日:2023-04-17

    CPC classification number: G11C29/4401 G11C29/16 G11C29/40

    Abstract: In a described example, an integrated circuit (IC) includes a repairable memory system. A repair controller is coupled to the repairable memory system. The repair controller includes compression logic configured to encode memory repair code data for a respective instance of the repairable memory system and provide compressed repair data. A non-volatile memory controller is coupled to the repair controller and to non-volatile memory. The non-volatile memory controller is configured to transfer the compressed repair data to the non-volatile memory for storage.

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