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    Isolated transformer with integrated shield topology for reduced EMI
    3.
    发明授权
    Isolated transformer with integrated shield topology for reduced EMI 有权

    公开(公告)号：US11538766B2

    公开(公告)日：2022-12-27

    申请号：US16800043

    申请日：2020-02-25

    Applicant: Texas Instruments Incorporated

    Inventor： Vijaylaxmi Gumaste Khanolkar ,  Robert Martinez ,  Zhemin Zhang ,  Yongbin Chu

    IPC: H01L23/552 ,  H01L23/495 ,  H01L21/56 ,  H01F27/28 ,  H01L25/00

    Abstract: A packaged electronic device includes first conductive leads and second conductive leads at least partially exposed to an exterior of a package structure, and a multilevel lamination structure in the package structure. The multilevel lamination structure includes a first patterned conductive feature having multiple turns in a first level to form a first winding coupled to at least one of the first conductive leads in a first circuit, a second patterned conductive feature having multiple turns in a different level to form a second winding coupled to at least one of the second conductive leads in a second circuit isolated from the first circuit, and a conductive shield trace having multiple turns in a second level spaced apart from and between the first patterned conductive feature and the second patterned conductive feature, the conductive shield trace coupled in the first circuit.

    Compensated active electro-magnetic interference filters
    4.
    发明授权
    Compensated active electro-magnetic interference filters 有权

    公开(公告)号：US10374510B2

    公开(公告)日：2019-08-06

    申请号：US15715975

    申请日：2017-09-26

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Yongbin Chu ,  Jeffrey Anthony Morroni ,  Yogesh Kumar Ramadass

    IPC: H02M1/44 ,  H02M1/12

    Abstract: An active electromagnetic interference (EMI) filter includes an amplifier configured to sense noise signals on a power conductor, and drive a cancellation signal onto the power conductor. The cancellation signal is to reduce the amplitude of the noise signals. Some embodiments of the active EMI filter include a high frequency compensation network that improves the high frequency phase margin of the active EMI filter and improves the stability of the active EMI filter at high frequencies. Some embodiments of the active EMI filter include a low frequency compensation capacitor that increases the phase margin of the active EMI filter at low frequencies. Some embodiments of the active EMI filter include low frequency compensation circuitry that increases the low frequency tolerance of the active EMI filter.

    Active shunt filtering
    6.
    发明授权
    Active shunt filtering 有权

    公开(公告)号：US11606849B2

    公开(公告)日：2023-03-14

    申请号：US16457768

    申请日：2019-06-28

    Applicant: Texas Instruments Incorporated

    Inventor： Yongbin Chu ,  Yogesh Kumar Ramadass ,  Jeffrey Anthony Morroni

    IPC: H05B45/36 ,  H02M1/44 ,  H02M3/158 ,  H05B45/10 ,  H05B45/3725

    Abstract: In described examples, a system (e.g., a light-emitting diode dimmer system) includes a switching device coupled to a switching controller. The switching controller generates a control signal, which includes a low frequency signal (e.g., for controlling a dimming function) and a switching signal. An active electromagnetic interference filter (AEF) is coupled to the DC source. An active shunt is coupled to a power input node of the switching device and is configured to selectively couple a shunt current to the power input node of the switching device in synchronization with the low frequency signal (e.g., which can reduce, if not also eliminate, a saturation time of the AEF and improve the performance of the AEF).

    ISOLATED TRANSFORMER WITH INTEGRATED SHIELD TOPOLOGY FOR REDUCED EMI
    10.
    发明申请
    ISOLATED TRANSFORMER WITH INTEGRATED SHIELD TOPOLOGY FOR REDUCED EMI 审中-公开

    公开(公告)号：US20200303319A1

    公开(公告)日：2020-09-24

    申请号：US16800043

    申请日：2020-02-25

    Applicant: Texas Instruments Incorporated

    Inventor： Vijaylaxmi Gumaste Khanolkar ,  Robert Martinez ,  Zhemin Zhang ,  Yongbin Chu

    IPC: H01L23/552 ,  H01L23/495 ,  H01L25/00 ,  H01L21/56 ,  H01F27/28

    Abstract: A packaged electronic device includes first conductive leads and second conductive leads at least partially exposed to an exterior of a package structure, and a multilevel lamination structure in the package structure. The multilevel lamination structure includes a first patterned conductive feature having multiple turns in a first level to form a first winding coupled to at least one of the first conductive leads in a first circuit, a second patterned conductive feature having multiple turns in a different level to form a second winding coupled to at least one of the second conductive leads in a second circuit isolated from the first circuit, and a conductive shield trace having multiple turns in a second level spaced apart from and between the first patterned conductive feature and the second patterned conductive feature, the conductive shield trace coupled in the first circuit.

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