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公开(公告)号:US10446426B2
公开(公告)日:2019-10-15
申请号:US15553989
申请日:2016-01-27
发明人: Takahiro Fuji , Ryo Shimizu
IPC分类号: H01L21/677 , B65G49/06 , H01L21/20 , H01L21/268 , H01L21/02 , B23K26/12 , H01L21/67 , B23K103/00
摘要: The invention is an atmosphere formation apparatus that is provided in a floatation conveyance apparatus, the floatation conveyance apparatus conveying a workpiece while performing floating support of the workpiece by gas injection, the atmosphere formation apparatus including a small-range atmosphere formation device that forms a small-range atmosphere B in a large-range atmosphere A, the large-range atmosphere A being an atmosphere in a large-range region containing a conveyance path along which the conveyance is performed, the small-range atmosphere B being an atmosphere in a small-range region containing the conveyance path, the small-range atmosphere B being different from the large-range atmosphere A.
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公开(公告)号:US10943785B2
公开(公告)日:2021-03-09
申请号:US16331500
申请日:2017-07-14
IPC分类号: H01L21/00 , H01L21/20 , B23K26/70 , H01L29/66 , B23K26/08 , B23K26/12 , B23K26/00 , B23K26/066 , B23K26/06 , H01L27/12 , H01L21/268 , H01L29/786 , H01L51/50 , B23K103/00 , B23K101/40
摘要: A laser irradiation apparatus (1) according to an embodiment includes an optical-system module (20) configured to apply laser light (L1) to an object to be irradiated, a shield plate (51) in which a slit (54) is formed, through which the laser light (L1) passes, and a reflected-light receiving component (61) disposed between the optical-system module (20) and the shield plate (51), in which the reflected-light receiving component (61) is able to receive, out of the laser light (L1), reflected light (R1) reflected by the shield plate (51).
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公开(公告)号:US11264259B2
公开(公告)日:2022-03-01
申请号:US15769728
申请日:2016-10-25
发明人: Ryo Shimizu , Miki Sawai , Hirotaka Sazuka , Daisuke Ito
IPC分类号: H01L21/677 , C03B25/093 , C03B35/24 , B23K26/354 , B23K26/08 , B65G51/03 , C03B25/02 , C03B35/00 , H01L21/67 , H01L21/683 , C03B32/02 , H01L21/02
摘要: A workpiece conveyance apparatus having: a conveyance path on which the workpiece moves; a gas flotation section that gas-floats the workpiece over the conveyance path; a movable holding section that holds the workpiece to move on the conveyance path along with the workpiece; and a treatment region conveyance path that is located on the conveyance path, and has a treatment region where predetermined treatment for the workpiece is performed, wherein the movable holding section has at least two or more holding sections along a movement direction of the conveyance path, each of the holding sections is capable of switching between release of holding and holding for the workpiece during movement of the workpiece, operation for releasing holding of the workpiece by the holding section on the treatment region conveyance path, and holding the workpiece on the conveyance path other than the treatment region conveyance path.
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公开(公告)号:US10658185B2
公开(公告)日:2020-05-19
申请号:US16330759
申请日:2017-06-02
发明人: Ryo Shimizu , Ryosuke Sato , Teruaki Shimoji
IPC分类号: H01L21/268 , H01L21/677 , B23K26/073 , G01J1/42 , H01L21/02 , H01L29/786 , B23K26/00 , B23K26/70 , B23K26/352 , G09F9/00 , B23K26/12 , H01L21/67 , B23K26/08 , B23K103/00 , B23K101/40
摘要: A laser annealing apparatus (1) according to an embodiment includes a laser oscillator (4) configured to generate a laser beam (L), a floating-type conveying stage (3) configured to float and convey a workpiece (W) to be irradiated with the laser beam (L), and a beam profiler (7) configured to measure a beam profile of the laser beam (L). The floating-type conveying stage (3) includes a conveying surface (3a) opposed to the workpiece (W), and a bottom surface (3b) on the side opposite to the conveying surface (3a). The beam profiler (7) is positioned below the bottom surface (3b) of the floating-type conveying stage (3). The floating-type conveying stage (3) includes a detachable part (12) in a part of it. An opening (S) is formed by detaching the detachable part (12) from the floating-type conveying stage (3), the opening (3) extending from the conveying surface (3a) to the bottom surface (3b). The beam profiler (7) is configured to measure the beam profile of the laser beam (L) through the opening (S).
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