公开(公告)号：US20180056448A1

公开(公告)日：2018-03-01

申请号：US15560720

申请日：2016-03-24

申请人： TOHOKU UNIVERSITY ,  PANASONIC CORPORATION

发明人： Yamato HAYASHI ,  Hirotsugu TAKIZAWA ,  Akio FURUSAWA

IPC分类号： B23K35/02 ,  B23K35/30 ,  B23K35/26 ,  B22F1/00 ,  B22F9/04 ,  C22C5/02 ,  C22C5/08 ,  C22C13/02 ,  C22C13/00 ,  H01B1/02

CPC分类号： B23K35/025 ,  B22F1/00 ,  B22F1/0044 ,  B22F9/00 ,  B22F9/04 ,  B22F2009/045 ,  B23K35/22 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/40 ,  C22C5/02 ,  C22C5/06 ,  C22C5/08 ,  C22C12/00 ,  C22C13/00 ,  C22C13/02 ,  H01B1/02 ,  H01B1/22 ,  H01B13/00

摘要： A liquid dispersion of metal nanoparticles for solder paste comprises metal nanoparticles made of an alloy and a reducing dispersion medium, wherein the metal nanoparticles have an average particle diameter of 1.0 to 200 nm, the metal nanoparticles have a sintering initiation temperature of less than 50° C., and the liquid dispersion comprises substantially no surfactant or surface modifier.

公开(公告)号：US20200335470A1

公开(公告)日：2020-10-22

申请号：US16846522

申请日：2020-04-13

申请人： Panasonic Corporation

发明人： Akio FURUSAWA ,  Shinji ISHITANI ,  Kiyohiro HINE

IPC分类号： H01L23/00 ,  B23K35/02 ,  B23K35/26 ,  B23K35/30

摘要： There is provided a bonding material which forms a bonding portion between two objects, which material contains (1) first metal particles comprising a first metal and having a median particle diameter in the range of 20 nm to 1 μm, and (2) second metal particles comprising, as a second metal, at least one alloy of Sn and at least one selected from Bi, In and Zn and having a melting point of not higher than 200° C.