公开(公告)号：US20210175055A1

公开(公告)日：2021-06-10

申请号：US17113031

申请日：2020-12-05

Applicant: TOKYO ELECTRON LIMITED

Inventor： Atsushi SAWACHI ,  Ichiro SONE ,  Takuya NISHIJIMA ,  Suguru SATO

IPC: H01J37/32 ,  G01J3/443

Abstract: A measuring device for a vacuum processing apparatus including a processing chamber having a first gate for loading and unloading a substrate and a second gate different from the first gate is provided. The measuring device includes a case having art opening that is sized to correspond to the second gate of the processing chamber and is airtightly attachable to the second gate, a decompressing mechanism configured to reduce a pressure in the case, and a measuring mechanism accommodated in the case and configured to measure a state in the processing chamber through the opening in a state where the pressure in the case is reduced by the decompressing mechanism.

公开(公告)号：US20240290591A1

公开(公告)日：2024-08-29

申请号：US18655368

申请日：2024-05-06

Applicant: Tokyo Electron Limited

Inventor： Atsushi SAWACHI ,  Ichiro SONE ,  Takuya NISHIJIMA ,  Suguru SATO

IPC: H01J37/32 ,  G01J3/443

CPC classification number: H01J37/32972 ,  G01J3/443 ,  H01J37/32733

Abstract: A measuring device for a vacuum processing apparatus including a processing chamber having a first gate for loading and unloading a substrate and a second gate different from the first gate is provided. The measuring device includes a case having an opening that is sized to correspond to the second gate of the processing chamber and is airtightly attachable to the second gate, a decompressing mechanism configured to reduce a pressure in the case, and a measuring mechanism accommodated in the case and configured to measure a state in the processing chamber through the opening in a state where the pressure in the case is reduced by the decompressing mechanism.

公开(公告)号：US20240261918A1

公开(公告)日：2024-08-08

申请号：US18638830

申请日：2024-04-18

Applicant: Tokyo Electron Limited

Inventor： Atsushi SAWACHI ,  Ichiro SONE ,  Suguru SATO ,  Takuya NISHIJIMA

IPC: B23Q3/155 ,  H01L21/687

CPC classification number: B23Q3/1556 ,  H01L21/68785

Abstract: A part replacement system includes a part storage device configured to store an unused consumable part, and a replacement device that is connected to a processing device and the part storage device, the replacement device being configured to replace a used consumable part installed in the processing device with the unused consumable part stored in the part storage device. The replacement device is moved to a position of the processing device having the used consumable part that requires replacement, and the replacement device is connected to the processing device, and the part storage device is moved to a position of the replacement device connected to the processing device having the used consumable part that requires replacement, and the part storage device is connected to the replacement device.

公开(公告)号：US20220122818A1

公开(公告)日：2022-04-21

申请号：US17504578

申请日：2021-10-19

Applicant: Tokyo Electron Limited

Inventor： Atsushi SAWACHI ,  Jun HIROSE ,  Takuya NISHIJIMA ,  Ichiro SONE ,  Suguru SATO

IPC: H01J37/32

Abstract: A substrate processing apparatus is provided. The substrate processing apparatus comprise: a first chamber including a sidewall providing an opening, the first chamber further including a movable part movable upward and downward within the first chamber; a substrate support disposed within the first chamber; a second chamber disposed within the first chamber and defining, together with the substrate support, a processing space in which a substrate mounted on the substrate support is processed, the second chamber being separable from the first chamber and transportable between an inner space of the first chamber and the outside of the first chamber via the opening; a clamp releasably fixing the second chamber to the movable part extending above the second chamber; a release mechanism configured to release the fixing of the second chamber by the clamp; and a lift mechanism configured to move the movable part upward and downward.

公开(公告)号：US20240339306A1

公开(公告)日：2024-10-10

申请号：US18746251

申请日：2024-06-18

Applicant: Tokyo Electron Limited

Inventor： Atsushi SAWACHI ,  Jun HIROSE ,  Takuya NISHIJIMA ,  Ichiro SONE ,  Suguru SATO

IPC: H01J37/32

CPC classification number: H01J37/32733 ,  H01J37/3244 ,  H01J37/32899

Abstract: A substrate processing apparatus is provided. The substrate processing apparatus comprise: a first chamber including a sidewall providing an opening, the first chamber further including a movable part movable upward and downward within the first chamber; a substrate support disposed within the first chamber; a second chamber disposed within the first chamber and defining, together with the substrate support, a processing space in which a substrate mounted on the substrate support is processed, the second chamber being separable from the first chamber and transportable between an inner space of the first chamber and the outside of the first chamber via the opening; a clamp releasably fixing the second chamber to the movable part extending above the second chamber; a release mechanism configured to release the fixing of the second chamber by the clamp; and a lift mechanism configured to move the movable part upward and downward.

公开(公告)号：US20210407768A1

公开(公告)日：2021-12-30

申请号：US17356997

申请日：2021-06-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Atsushi SAWACHI ,  Jun HIROSE ,  Takuya NISHIJIMA ,  Ichiro SONE ,  Suguru SATO

IPC: H01J37/32

Abstract: A substrate processing apparatus includes a first chamber having an inner space and an opening, a substrate support disposed in the inner space of the first chamber, an actuator configured to move the substrate support between a first position and a second position, a second chamber that is disposed in the inner space of the first chamber and defines a substrate processing space together with the substrate support when the substrate support is located at the first position, and at least one fixing mechanism configured to detachably fix the second chamber to the first chamber in the inner space of the first chamber. The second chamber is transferred between the inner space of the first chamber and an outside of the first chamber through the opening when the substrate support is located at the second position.