公开(公告)号：US20130264780A1

公开(公告)日：2013-10-10

申请号：US13856046

申请日：2013-04-03

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasuharu IWASHITA ,  Osamu HIRAKAWA ,  Eiji MANABE ,  Takeshi TAMURA ,  Akira FUKUTOMI

IPC: H01L21/683 ,  B23Q3/08

CPC classification number: H01L21/6838 ,  B23Q3/088 ,  Y10T29/49998 ,  Y10T279/11

Abstract: In accordance with some embodiments of the present disclosure, a substrate holding apparatus is provided. The substrate holding apparatus includes a first holding part, a second holding part and a controller. The first holding part adsorbs and holds a first region including a central portion of a substrate. The second holding part adsorbs and holds a second region located outside the first region of the substrate. The second holding part adsorbs and holds the second region of the substrate after the first holding part adsorbs and holds the first region of the substrate.

Abstract translation: 根据本公开的一些实施例，提供了一种基板保持装置。 基板保持装置包括第一保持部，第二保持部以及控制部。 第一保持部吸附并保持包括基板的中心部分的第一区域。 第二保持部吸附并保持位于基板的第一区域外侧的第二区域。 在第一保持部吸附并保持基板的第一区域之后，第二保持部吸附并保持基板的第二区域。

公开(公告)号：US20180019153A1

公开(公告)日：2018-01-18

申请号：US15644318

申请日：2017-07-07

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masataka MATSUNAGA ,  Takahiro MASUNAGA ,  Takashi KOGA ,  Yasuharu IWASHITA ,  Shingo KATSUKI ,  Masaaki UMITSUKI ,  Kazutoshi ISHIMARU ,  Fumio SAKATA

IPC: H01L21/683 ,  H01L21/68 ,  H01L21/67

Abstract: A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.

公开(公告)号：US20140234033A1

公开(公告)日：2014-08-21

申请号：US14182969

申请日：2014-02-18

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasuharu IWASHITA ,  Osamu HIRAKAWA ,  Yasutaka SOMA ,  Takeshi TAMURA ,  Kazutaka NODA

IPC: B65G51/03

CPC classification number: H01L21/6838 ,  B32B43/006 ,  Y10S156/93 ,  Y10S156/941

Abstract: Disclosed is a substrate conveyance apparatus capable of suppressing a substrate from being damaged. The substrate conveyance apparatus includes a plurality of nozzles, and a main body unit. The plurality of nozzles are configured to jet a gas toward a surface of a substrate to hold the substrate in a non-contact manner. The main body unit is provided with the plurality of nozzles. At least surfaces of the plurality of nozzles are formed of a resin.

Abstract translation: 公开了能够抑制基板受损的基板输送装置。 基板输送装置包括多个喷嘴和主体单元。 多个喷嘴构造成朝向基板的表面喷射气体，以非接触的方式保持基板。 主体单元设置有多个喷嘴。 多个喷嘴的至少表面由树脂形成。