公开(公告)号：US20140284000A1

公开(公告)日：2014-09-25

申请号：US14300356

申请日：2014-06-10

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasutaka SOMA ,  Naoto YOSHITAKA ,  Hiroshi KOMEDA ,  Eiji MANABE ,  Osamu HIRAKAWA ,  Masatoshi DEGUCHI ,  Takeshi TAMURA

IPC: B32B43/00

CPC classification number: B32B43/006 ,  B32B38/10 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/673 ,  H01L21/67346 ,  H01L2221/683 ,  H01L2221/68304 ,  H01L2221/68318 ,  Y10T156/1153 ,  Y10T156/1168 ,  Y10T156/1911 ,  Y10T156/1978 ,  Y10T156/1994

Abstract: A separation apparatus for separating a superposed substrate into a processing target substrate and a supporting substrate, includes: one holding part holding the processing target substrate via a tape; another holding part holding the supporting substrate; and a moving mechanism moving the another holding part in a vertical direction while holding an outer peripheral portion thereof to continuously separate the supporting substrate held by the another holding part from the processing target substrate held by the one holding part starting from an outer peripheral portion toward a central portion of the supporting substrate, wherein the moving mechanism includes: a first moving part holding the another holding part and moving only the outer peripheral portion of the another holding part in the vertical direction; and a second moving part moving the first moving part and the another holding part in the vertical direction.

Abstract translation: 一种用于将叠加的基板分离成处理目标基板和支撑基板的分离装置，包括：一个保持部件，其经由带子保持处理目标基板; 保持支撑基板的另一保持部; 以及移动机构，在保持其外周部分的同时保持其另一保持部分，使从另一个保持部件保持的支撑基板从外周部分开始朝向由保持部分保持的处理对象基板连续分离， 支撑基板的中心部分，其中移动机构包括：第一移动部分，其保持另一保持部分，并且仅在另一保持部分的外周部分沿垂直方向移动; 以及第二移动部件，其沿着垂直方向移动所述第一移动部件和所述另一保持部件。

公开(公告)号：US20160296982A1

公开(公告)日：2016-10-13

申请号：US15089680

申请日：2016-04-04

Applicant: TOKYO ELECTRON LIMITED

Inventor： Osamu HIRAKAWA ,  Yoshitaka OTSUKA

IPC: B08B7/04

CPC classification number: B08B7/04 ,  B08B3/02 ,  B08B5/02 ,  B08B5/04 ,  B08B13/00 ,  B08B15/04 ,  B08B2203/0229 ,  H01L21/67028 ,  H01L21/67253 ,  H01L21/67288

Abstract: An apparatus for removing at least one foreign substance includes a detection unit detecting the at least one foreign substance adhered to a holding surface of a suction holding unit configured to suck and hold a substrate, a removal unit removing the at least one foreign substance adhered to the holding surface using fluid, and a movement mechanism configured to move the detection unit and the removal unit.

Abstract translation: 一种用于去除至少一种异物的设备包括：检测单元，其检测粘附到吸引保持单元的保持表面的至少一种异物，所述吸附保持单元构造成吸附和保持基底;去除单元，去除至少一种附着到 所述保持面使用流体;移动机构，其构造成移动所述检测单元和所述移除单元。

公开(公告)号：US20140234033A1

公开(公告)日：2014-08-21

申请号：US14182969

申请日：2014-02-18

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasuharu IWASHITA ,  Osamu HIRAKAWA ,  Yasutaka SOMA ,  Takeshi TAMURA ,  Kazutaka NODA

IPC: B65G51/03

CPC classification number: H01L21/6838 ,  B32B43/006 ,  Y10S156/93 ,  Y10S156/941

Abstract: Disclosed is a substrate conveyance apparatus capable of suppressing a substrate from being damaged. The substrate conveyance apparatus includes a plurality of nozzles, and a main body unit. The plurality of nozzles are configured to jet a gas toward a surface of a substrate to hold the substrate in a non-contact manner. The main body unit is provided with the plurality of nozzles. At least surfaces of the plurality of nozzles are formed of a resin.

Abstract translation: 公开了能够抑制基板受损的基板输送装置。 基板输送装置包括多个喷嘴和主体单元。 多个喷嘴构造成朝向基板的表面喷射气体，以非接触的方式保持基板。 主体单元设置有多个喷嘴。 多个喷嘴的至少表面由树脂形成。

公开(公告)号：US20140069588A1

公开(公告)日：2014-03-13

申请号：US13975584

申请日：2013-08-26

Applicant: TOKYO ELECTRON LIMITED

Inventor： Osamu HIRAKAWA

IPC: B32B43/00

CPC classification number: B32B43/006 ,  B32B2457/14 ,  H01L21/67092 ,  Y10S156/93 ,  Y10S156/941 ,  Y10S156/942 ,  Y10T156/11 ,  Y10T156/1111 ,  Y10T156/19

Abstract: A delamination system delaminates a laminated substrate, in which a first substrate and a second substrate are bonded together, into the first substrate and the second substrate. The delamination system has a first processing block processing the laminated substrate or the delaminated first substrate and a second processing block processing the delaminated second substrate. The first processing block has a delamination station having a delamination device that delaminates the laminated substrate transferred by a first transfer device into the first substrate and the second substrate. The second processing block has a second cleaning station and a delivery station. The second cleaning station has a second cleaning device cleaning the delaminated second substrate. The delivery station is disposed between the second cleaning station and the delamination station. The delivery station receives the delaminated second substrate from the delamination station and delivers it to the second cleaning station.

Abstract translation: 分层系统将第一基板和第二基板接合在一起的层压基板分层到第一基板和第二基板中。 分层系统具有处理层压基板或分层第一基板的第一处理块和处理分层第二基板的第二处理块。 第一处理块具有分层台，其具有使由第一转移装置转移到第一基板和第二基板的层压基板分层的分层装置。 第二处理块具有第二清洁站和输送站。 第二清洁站具有清洁分层的第二基板的第二清洁装置。 输送站设置在第二清洁站和分层站之间。 输送站从分层站接收分层的第二基板并将其输送到第二清洁站。

公开(公告)号：US20130146228A1

公开(公告)日：2013-06-13

申请号：US13693151

申请日：2012-12-04

Applicant: Tokyo Electron Limited

Inventor： Osamu HIRAKAWA ,  Masaru HONDA ,  Akira FUKUTOMI ,  Takeshi TAMURA ,  Jiro HARADA ,  Kazutaka NODA

IPC: B32B38/10

CPC classification number: B32B38/10 ,  B32B43/006 ,  B32B2457/14 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/67288 ,  Y10T156/11 ,  Y10T156/1189 ,  Y10T156/19 ,  Y10T156/1972

Abstract: A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate, includes: a first holding unit which holds the processing target substrate; a second holding unit which holds the supporting substrate; a moving mechanism which relatively moves the first holding unit or the second holding unit in a horizontal direction; a load measurement unit which measures a load acting on the processing target substrate and the supporting substrate when the processing target substrate and the supporting substrate are separated; and a control unit which controls the moving mechanism based on the load measured by the load measurement unit.

Abstract translation: 一种分离装置，用于将处理对象基板和支撑基板与粘合剂接合在一起的叠置基板分离到处理对象基板和支撑基板中，包括：保持处理对象基板的第一保持单元; 保持所述支撑基板的第二保持单元; 移动机构，其使所述第一保持单元或所述第二保持单元沿水平方向相对移动; 负载测量单元，当处理对象基板和支撑基板分离时，测量作用在处理对象基板和支撑基板上的负荷; 以及控制单元，其基于由负载测量单元测量的负载来控制移动机构。

公开(公告)号：US20190105691A1

公开(公告)日：2019-04-11

申请号：US16210352

申请日：2018-12-05

Applicant: TOKYO ELECTRON LIMITED

Inventor： Osamu HIRAKAWA ,  Yoshitaka OTSUKA

IPC: B08B7/04 ,  H01L21/67 ,  B08B3/02 ,  B08B5/04 ,  B08B13/00 ,  B08B5/02 ,  B08B15/04

Abstract: An apparatus for removing at least one foreign substance includes a detection unit detecting the at least one foreign substance adhered to a holding surface of a suction holding unit configured to suck and hold a substrate, a removal unit removing the at least one foreign substance adhered to the holding surface using fluid, and a movement mechanism configured to move the detection unit and the removal unit.

公开(公告)号：US20150314339A1

公开(公告)日：2015-11-05

申请号：US14695103

申请日：2015-04-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Osamu HIRAKAWA ,  Takashi SAKAUE ,  Hiroshi KOMEDA ,  Katsuhiro IINO

IPC: B08B3/08

CPC classification number: H01L21/02057 ,  H01L21/67028 ,  H01L21/6708

Abstract: A cleaning device peels off an overlapped substrate and cleans a bonding surface of a peeled substrate to be processed, the overlapped substrate including the substrate to be processed and a support substrate bonded together with a protectant, a peeling agent and an adhesive stacked in order therebetween from the substrate to be processed. The cleaning device includes: a support part that supports the substrate to be processed; a solvent supply part that supplies a solvent of the protectant to the bonding surface of the substrate to be processed supported by the support part; and a peeling agent absorption part that absorbs and removes the peeling agent which has been peeled from the bonding surface of the substrate to be processed.

Abstract translation: 清洁装置剥离重叠的基板并清洁待处理的剥离基板的接合表面，包括待处理基板的重叠基板和与保护剂，剥离剂和粘合在一起的粘合剂的支撑基板 从待处理的基板。 清洁装置包括：支撑部件，其支撑待加工的基板; 溶剂供给部，其将所述保护剂的溶剂供给到由所述支撑部支撑的被处理基板的接合面; 以及剥离剂吸收部，其吸收从所述被处理基板的接合面剥离的剥离剂。

公开(公告)号：US20130264780A1

公开(公告)日：2013-10-10

申请号：US13856046

申请日：2013-04-03

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasuharu IWASHITA ,  Osamu HIRAKAWA ,  Eiji MANABE ,  Takeshi TAMURA ,  Akira FUKUTOMI

IPC: H01L21/683 ,  B23Q3/08

CPC classification number: H01L21/6838 ,  B23Q3/088 ,  Y10T29/49998 ,  Y10T279/11

Abstract: In accordance with some embodiments of the present disclosure, a substrate holding apparatus is provided. The substrate holding apparatus includes a first holding part, a second holding part and a controller. The first holding part adsorbs and holds a first region including a central portion of a substrate. The second holding part adsorbs and holds a second region located outside the first region of the substrate. The second holding part adsorbs and holds the second region of the substrate after the first holding part adsorbs and holds the first region of the substrate.

Abstract translation: 根据本公开的一些实施例，提供了一种基板保持装置。 基板保持装置包括第一保持部，第二保持部以及控制部。 第一保持部吸附并保持包括基板的中心部分的第一区域。 第二保持部吸附并保持位于基板的第一区域外侧的第二区域。 在第一保持部吸附并保持基板的第一区域之后，第二保持部吸附并保持基板的第二区域。