公开(公告)号：US20130264780A1

公开(公告)日：2013-10-10

申请号：US13856046

申请日：2013-04-03

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasuharu IWASHITA ,  Osamu HIRAKAWA ,  Eiji MANABE ,  Takeshi TAMURA ,  Akira FUKUTOMI

IPC: H01L21/683 ,  B23Q3/08

CPC classification number: H01L21/6838 ,  B23Q3/088 ,  Y10T29/49998 ,  Y10T279/11

Abstract: In accordance with some embodiments of the present disclosure, a substrate holding apparatus is provided. The substrate holding apparatus includes a first holding part, a second holding part and a controller. The first holding part adsorbs and holds a first region including a central portion of a substrate. The second holding part adsorbs and holds a second region located outside the first region of the substrate. The second holding part adsorbs and holds the second region of the substrate after the first holding part adsorbs and holds the first region of the substrate.

Abstract translation: 根据本公开的一些实施例，提供了一种基板保持装置。 基板保持装置包括第一保持部，第二保持部以及控制部。 第一保持部吸附并保持包括基板的中心部分的第一区域。 第二保持部吸附并保持位于基板的第一区域外侧的第二区域。 在第一保持部吸附并保持基板的第一区域之后，第二保持部吸附并保持基板的第二区域。

公开(公告)号：US20140284000A1

公开(公告)日：2014-09-25

申请号：US14300356

申请日：2014-06-10

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasutaka SOMA ,  Naoto YOSHITAKA ,  Hiroshi KOMEDA ,  Eiji MANABE ,  Osamu HIRAKAWA ,  Masatoshi DEGUCHI ,  Takeshi TAMURA

IPC: B32B43/00

CPC classification number: B32B43/006 ,  B32B38/10 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/673 ,  H01L21/67346 ,  H01L2221/683 ,  H01L2221/68304 ,  H01L2221/68318 ,  Y10T156/1153 ,  Y10T156/1168 ,  Y10T156/1911 ,  Y10T156/1978 ,  Y10T156/1994

Abstract: A separation apparatus for separating a superposed substrate into a processing target substrate and a supporting substrate, includes: one holding part holding the processing target substrate via a tape; another holding part holding the supporting substrate; and a moving mechanism moving the another holding part in a vertical direction while holding an outer peripheral portion thereof to continuously separate the supporting substrate held by the another holding part from the processing target substrate held by the one holding part starting from an outer peripheral portion toward a central portion of the supporting substrate, wherein the moving mechanism includes: a first moving part holding the another holding part and moving only the outer peripheral portion of the another holding part in the vertical direction; and a second moving part moving the first moving part and the another holding part in the vertical direction.

Abstract translation: 一种用于将叠加的基板分离成处理目标基板和支撑基板的分离装置，包括：一个保持部件，其经由带子保持处理目标基板; 保持支撑基板的另一保持部; 以及移动机构，在保持其外周部分的同时保持其另一保持部分，使从另一个保持部件保持的支撑基板从外周部分开始朝向由保持部分保持的处理对象基板连续分离， 支撑基板的中心部分，其中移动机构包括：第一移动部分，其保持另一保持部分，并且仅在另一保持部分的外周部分沿垂直方向移动; 以及第二移动部件，其沿着垂直方向移动所述第一移动部件和所述另一保持部件。

公开(公告)号：US20130118530A1

公开(公告)日：2013-05-16

申请号：US13669722

申请日：2012-11-06

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hiroshi KOMEDA ,  Eiji MANABE ,  Shinji KOGA ,  Takahide SAKAI

IPC: B08B7/04 ,  B08B3/02 ,  B08B5/04

CPC classification number: H01L21/67051 ,  H01L21/67092 ,  H01L21/6715

Abstract: The present disclosure provides a cleaning apparatus that includes a wafer holding unit configured to hold and rotate a target wafer W, and a cleaning jig with a supplying surface that covers a joint surface of the target wafer W. The cleaning jig is provided with a gas-liquid supplying unit configured to supply a solvent of an adhesive, a rinse liquid of the solvent and an inert gas into a gap between the joint surface and the supplying surface. The cleaning jig is also provided with a suction unit configured to suck the solvent or rinse liquid (mixed liquid) which is supplied to the gap between the joint surface and the supplying surface, and a gas supplying unit configured to supply gas to a step portion.

Abstract translation: 本公开提供了一种清洁装置，其包括被配置为保持和旋转目标晶片W的晶片保持单元，以及具有覆盖目标晶片W的接合表面的供给表面的清洁夹具。清洁夹具设置有气体 - 液体供应单元，其构造成将粘合剂的溶剂，溶剂的漂洗液和惰性气体供给到接合表面和供给表面之间的间隙中。 清洗夹具还设置有抽吸单元，该抽吸单元被配置为吸入供应到接合表面和供给表面之间的间隙的溶剂或冲洗液体（混合液体），以及气体供给单元，其构造成将气体供给到台阶部 。