公开(公告)号：US11917751B2

公开(公告)日：2024-02-27

申请号：US17534936

申请日：2021-11-24

Applicant: TOPPAN INC.

Inventor： Masao Aratani

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/18 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H05K1/115 ,  H05K3/18 ,  H05K3/467 ,  H05K2201/0344 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2201/09745 ,  H05K2201/09827 ,  H05K2201/09845

Abstract: A multilayer wiring board that improves the reliability of connection at a via hole connection portion, and a method for producing the multilayer wiring board. In a multilayer wiring board comprising a plurality of metal wiring layers alternately laminated with insulating layers interposed therebetween are electrically connected to each other via a via hole plated layer, wherein a dissimilar metallic layer, made from material different from that of the metal wiring layers, is interposed between each of the metal wiring layers on the bottom surface of the via hole and the via hole plated layer, and the dissimilar metallic layer interposed between the each of the metal wiring layers on the bottom surface of the via hole and the via hole plated layer is arranged in a concave shape on the surface of the concave portion formed in the metal wiring layer on the bottom surface of the via hole.