公开(公告)号：US20180096980A1

公开(公告)日：2018-04-05

申请号：US15562501

申请日：2016-03-29

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Noboru ASAHI ,  Yoshiyuki ARAI ,  Yoshinori MIYAMOTO ,  Shimpei AOKI ,  Masatsugu NIMURA

IPC: H01L25/00 ,  H01L21/78 ,  H01L23/00

CPC classification number: H01L25/50 ,  B28D5/029 ,  H01L21/67092 ,  H01L21/67144 ,  H01L21/78 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/05571 ,  H01L2224/13009 ,  H01L2224/13082 ,  H01L2224/13116 ,  H01L2224/16145 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/7598 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/9205 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for manufacturing a semiconductor device includes laminating a plurality of semiconductor wafers via an adhesive, heating such that the adhesive reaches a specific viscosity, and pressing the semiconductor wafers under a provisional pressure bonding load such that a gap between solder of through-electrodes provided to chip parts and through-electrodes of an adjacent semiconductor wafer falls within a specific range that is greater than zero, to produce a provisional pressure-bonded laminate; cutting the provisional pressure-bonded laminate with a cutter to produce a provisional pressure-bonded laminate chip part; and heating the provisional pressure-bonded laminate chip part to at least curing temperature of the adhesive and at least melting point of the solder, and pressing the provisional pressure-bonded laminate chip part under a main pressure bonding load to produce a main pressure-bonded laminate chip part such that the solder comes into contact with the through-electrodes of adjacent chip parts.