公开(公告)号：US20250014936A1

公开(公告)日：2025-01-09

申请号：US18893241

申请日：2024-09-23

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Koichi KAZAMA ,  Tatsuya OKADA ,  Toshiyuki JINDA ,  Yoshiyuki ARAI

IPC: H01L21/683

Abstract: A transfer device transfers an element held on a transfer substrate to a receiving substrate. The transfer device comprises an energy irradiation unit irradiating an active energy ray toward the element through the transfer substrate in a state in which the transfer substrate and the receiving substrate face each other across the element. The transfer substrate has a blistering layer in which a blister is generated due to irradiation of an active energy ray. The receiving substrate has a capture layer that is arranged facing the transfer substrate. The energy irradiation unit forms the blister in an element holding area to change a tilt of the element relative to the transfer substrate and to bring the element closer to the receiving substrate, thereby causing the a portion of the element to come in contact with the capture layer first, in a state in which the blistering layer holds the element.

公开(公告)号：US20170044662A1

公开(公告)日：2017-02-16

申请号：US15306416

申请日：2015-02-23

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Masamichi YAMASHITA ,  Toshiyuki JINDA ,  Takayoshi FUJIMOTO ,  Katsuyoshi MIYASHITA

IPC: C23C14/56 ,  C23C14/24 ,  C23C14/04 ,  C23C14/34

CPC classification number: C23C14/562 ,  C23C14/042 ,  C23C14/24 ,  C23C14/34 ,  C23C14/564 ,  C23C16/4409 ,  C23C16/45519 ,  C23C16/505 ,  C23C16/545 ,  H01J37/34

Abstract: A thin-film forming device forms a thin film on a strip-shaped substrate by subjecting the strip-shaped substrate to a surface treatment while conveying the strip-shaped substrate in a state of being laid along an outer peripheral face of a main roll. The thin-film forming device comprises: a main roll chamber accommodating the main roll; a plurality of film formation chambers arranged in a peripheral direction of the main roll, the film formation chambers having partitions disposed radially outward of the main roll; and a main roll cover covering the outer peripheral face of the main roll over which the strip-shaped substrate travels, the main roll cover being provided to the partitions, the main roll cover having a film formation chamber communication component that communicates with the film formation chambers. A pressure in an interior of the main roll cover defined between the main roll cover and the outer peripheral face of the main roll is set to be higher than a pressure in the film formation chambers.

Abstract translation: 薄膜形成装置在沿着主辊的外周面铺设的状态下输送带状基板的同时对带状基板进行表面处理，在带状基板上形成薄膜。 薄膜形成装置包括：容纳主辊的主辊室; 多个成膜室沿着主辊的周向布置，成膜室具有设置在主辊的径向外侧的隔板; 以及主辊盖，其覆盖主辊的外周面，带状基板行进，主辊盖设置在隔板上，主辊盖具有与成膜连通的成膜室连通部件 房间。 在主辊盖和主辊的外周面之间限定的主辊罩的内部的压力被设定为高于成膜室中的压力。

公开(公告)号：US20250015039A1

公开(公告)日：2025-01-09

申请号：US18892975

申请日：2024-09-23

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Tatsuya OKADA ,  Koichi KAZAMA ,  Toshiyuki JINDA ,  Yoshiyuki ARAI

IPC: H01L23/00 ,  H01L21/67

Abstract: A bonding device is configured to bond a first element and a second element. The bonding device comprises an activating unit configured to activate a first bonding surface, which is a bonding surface of the first element, and a second bonding surface, which is a bonding surface of the second element, and a bonding unit configured to irradiate an active energy ray to cause the first bonding surface and the second bonding surface to come closer and bond with each other, from a state in which the first bonding surface and the second bonding surface face each other with a prescribed gap therebetween.