公开(公告)号：US20250015039A1

公开(公告)日：2025-01-09

申请号：US18892975

申请日：2024-09-23

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Tatsuya OKADA ,  Koichi KAZAMA ,  Toshiyuki JINDA ,  Yoshiyuki ARAI

IPC: H01L23/00 ,  H01L21/67

Abstract: A bonding device is configured to bond a first element and a second element. The bonding device comprises an activating unit configured to activate a first bonding surface, which is a bonding surface of the first element, and a second bonding surface, which is a bonding surface of the second element, and a bonding unit configured to irradiate an active energy ray to cause the first bonding surface and the second bonding surface to come closer and bond with each other, from a state in which the first bonding surface and the second bonding surface face each other with a prescribed gap therebetween.

公开(公告)号：US20250014936A1

公开(公告)日：2025-01-09

申请号：US18893241

申请日：2024-09-23

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Koichi KAZAMA ,  Tatsuya OKADA ,  Toshiyuki JINDA ,  Yoshiyuki ARAI

IPC: H01L21/683

Abstract: A transfer device transfers an element held on a transfer substrate to a receiving substrate. The transfer device comprises an energy irradiation unit irradiating an active energy ray toward the element through the transfer substrate in a state in which the transfer substrate and the receiving substrate face each other across the element. The transfer substrate has a blistering layer in which a blister is generated due to irradiation of an active energy ray. The receiving substrate has a capture layer that is arranged facing the transfer substrate. The energy irradiation unit forms the blister in an element holding area to change a tilt of the element relative to the transfer substrate and to bring the element closer to the receiving substrate, thereby causing the a portion of the element to come in contact with the capture layer first, in a state in which the blistering layer holds the element.

公开(公告)号：US20230360936A1

公开(公告)日：2023-11-09

申请号：US18355484

申请日：2023-07-20

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Koichi KAZAMA ,  Yoshiyuki ARAI ,  Jun INAGAKI

IPC: H01L21/67 ,  B32B43/00 ,  B23K26/57 ,  B23K26/067

CPC classification number: H01L21/67144 ,  B32B43/006 ,  B23K26/57 ,  B23K26/067 ,  B32B2310/0843

Abstract: A transfer device is provided that comprises a transfer substrate holding unit, a receiving substrate holding unit, and an active energy ray irradiation unit. The transfer substrate holding unit holds a transfer substrate with an ablation layer on which at least one element is held. The receiving substrate holding unit holds a receiving substrate such that the ablation layer of the transfer substrate is opposite the receiving substrate. The active energy ray irradiation unit irradiates the ablation layer of the transfer substrate with an active energy ray to cause ablation for transferring the at least one element held by the ablation layer from the transfer substrate to the receiving substrate. The active energy ray irradiation unit irradiates the ablation layer with the active energy ray at a plurality of locations in a holding region of the ablation layer that holds one of the at least one element.