公开(公告)号：US20220384657A1

公开(公告)日：2022-12-01

申请号：US17884276

申请日：2022-08-09

Applicant: NIKON CORPORATION ,  TORAY ENGINEERING CO., LTD.

Inventor： Makoto NAKAZUMI ,  Tsukasa KISHIUME ,  Masaki MORI ,  Takayoshi FUJIMOTO

IPC: H01L29/786 ,  H01L29/66 ,  H01L21/02

Abstract: What is provided is a transistor including a gate electrode, a gate insulating film, a semiconductor film, a source electrode, and a drain electrode, in which the gate insulating film is a laminated film in which a SiOx film and a SiCyNz film are alternately formed, the total number of films constituting the laminated film is 3 or more and 18 or less, and the thickness of each film constituting the laminated film is 25 nm or more and 150 nm or less.

公开(公告)号：US20180108821A1

公开(公告)日：2018-04-19

申请号：US15562024

申请日：2016-03-23

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Takayoshi FUJIMOTO ,  Masamichi YAMASHITA ,  Masaki MORI ,  Yutaka OKA

IPC: H01L33/60 ,  H01L33/52 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L33/44 ,  H01L33/52 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00014

Abstract: In an LED module, modes to solve such a problem that a loss in the output of light discharged into the atmosphere occurs are embodied. Specifically, in an LED module in which an LED chip is sealed with a sealing resin, a surface of the sealing resin is covered with a thin film, the thin film is made of a material having a smaller linear expansion coefficient than the sealing resin, and an irregular surface is provided on a surface of the thin film such that light from the LED chip is multiply reflected.

公开(公告)号：US20170283951A1

公开(公告)日：2017-10-05

申请号：US15510845

申请日：2015-10-29

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Masamichi YAMASHITA ,  Takayoshi FUJIMOTO ,  Masaki MORI

IPC: C23C16/50

Abstract: A method for forming a sealing film, in which a buffer layer and a barrier layer whose density is higher than that of the buffer layer are alternately formed on a substrate, includes forming a first buffer layer on a surface of the substrate, forming a first barrier layer on a surface of the first buffer layer, and forming a second buffer layer on a surface of the first barrier layer. A ratio of a thickness of a portion of the first buffer layer in a thickness direction of the substrate relative to a thickness of a portion of the first buffer layer in an inclined direction that is inclined with respect to the thickness direction is closer to 1 than a ratio of a thickness of a portion of the second buffer layer in the thickness direction relative to a thickness of a portion of the second buffer layer in the inclined direction.

公开(公告)号：US20170044662A1

公开(公告)日：2017-02-16

申请号：US15306416

申请日：2015-02-23

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Masamichi YAMASHITA ,  Toshiyuki JINDA ,  Takayoshi FUJIMOTO ,  Katsuyoshi MIYASHITA

IPC: C23C14/56 ,  C23C14/24 ,  C23C14/04 ,  C23C14/34

CPC classification number: C23C14/562 ,  C23C14/042 ,  C23C14/24 ,  C23C14/34 ,  C23C14/564 ,  C23C16/4409 ,  C23C16/45519 ,  C23C16/505 ,  C23C16/545 ,  H01J37/34

Abstract: A thin-film forming device forms a thin film on a strip-shaped substrate by subjecting the strip-shaped substrate to a surface treatment while conveying the strip-shaped substrate in a state of being laid along an outer peripheral face of a main roll. The thin-film forming device comprises: a main roll chamber accommodating the main roll; a plurality of film formation chambers arranged in a peripheral direction of the main roll, the film formation chambers having partitions disposed radially outward of the main roll; and a main roll cover covering the outer peripheral face of the main roll over which the strip-shaped substrate travels, the main roll cover being provided to the partitions, the main roll cover having a film formation chamber communication component that communicates with the film formation chambers. A pressure in an interior of the main roll cover defined between the main roll cover and the outer peripheral face of the main roll is set to be higher than a pressure in the film formation chambers.

Abstract translation: 薄膜形成装置在沿着主辊的外周面铺设的状态下输送带状基板的同时对带状基板进行表面处理，在带状基板上形成薄膜。 薄膜形成装置包括：容纳主辊的主辊室; 多个成膜室沿着主辊的周向布置，成膜室具有设置在主辊的径向外侧的隔板; 以及主辊盖，其覆盖主辊的外周面，带状基板行进，主辊盖设置在隔板上，主辊盖具有与成膜连通的成膜室连通部件 房间。 在主辊盖和主辊的外周面之间限定的主辊罩的内部的压力被设定为高于成膜室中的压力。