公开(公告)号：US20240186172A1

公开(公告)日：2024-06-06

申请号：US18284195

申请日：2022-03-23

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yukari ARIMOTO ,  Risano NAKAJIMA ,  Mika KOSHINO ,  Hitoshi ARAKI ,  Masao TOMIKAWA ,  Takenori FUJIWARA ,  Kenta AOSHIMA

IPC: H01L21/683 ,  C08K5/00

CPC classification number: H01L21/6835 ,  C08K5/0025 ,  C08K5/0041 ,  H01L2221/68381

Abstract: Provided is a laminate that allows semiconductor elements to be transferred over a wide range of processing margins using lasers of various wavelengths, without damaging the elements or leaving behind any pasty residue. This laminate is a substrate in which a laser-transmitting substrate 1, a resin film, and a semiconductor element are laminated in the stated order. The absorbance of the resin film at a wavelength of 248 nm, 266 nm, or 355 nm expressed in terms of a film thickness of 1.0 μm us 0.4-5.0, and the adhesive strength of the resin film with respect to the semiconductor elements is 0.02-0.3 N/cm.

公开(公告)号：US20240166556A1

公开(公告)日：2024-05-23

申请号：US18284107

申请日：2022-03-23

Applicant: TORAY INDUSTRIES, INC.

Inventor： Risano NAKAJIMA ,  Yukari ARIMOTO ,  Mika KOSHINO ,  Hitoshi ARAKI ,  Masao TOMIKAWA ,  Takenori FUJIWARA ,  Kenta AOSHIMA

IPC: C03C17/34 ,  H01L25/075

CPC classification number: C03C17/3405 ,  H01L25/0753 ,  C03C2217/78 ,  C03C2218/116 ,  C03C2218/32

Abstract: Provided is a laminate that can be implemented with a wide processing margin and without adhesive residue or damage to a semiconductor element in the transfer of the semiconductor element using laser light of various wavelengths. The laminate is obtained by laminating a substrate 1 having laser permeability, a resin film 1 and a resin film 2 in this order, wherein the light absorbance of the resin film 1 calculated for a film thickness of 1.0 μm at any wavelength of 200 nm to 1100 nm is 0.4-5.0, and the adhesive strength of the surface of the resin film 2 on the side opposite that of the resin film 1 side is 0.02-0.3 N/cm.