公开(公告)号：US20210047470A1

公开(公告)日：2021-02-18

申请号：US16969315

申请日：2019-03-15

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yutaro KOYAMA ,  Yuki MASUDA ,  Masao TOMIKAWA

IPC: C08G73/10 ,  G03F7/038 ,  H01L23/31 ,  H01L23/498

Abstract: The present invention provides an alkali-soluble resin with which a cured film having high extensibility, reduced stress, high adhesion to a metal, and high heat resistance can be obtained, and a photosensitive resin composition containing the alkali-soluble resin, and the present invention is an alkali-soluble resin (A) including a structure represented by a general formula (1) wherein X1 represents a divalent organic group having 2 to 100 carbon atoms, Y1 and Y2 each represent a divalent to hexavalent organic group having 2 to 100 carbon atoms, X2 represents a tetravalent organic group having 2 to 100 carbon atoms, p and q each represent an integer in a range of 0 to 4, and n1 and n2 each represent an integer in a range of 5 to 100,000, wherein (I) and (II) described below are satisfied: (I) an organic group having an aliphatic chain having 8 to 30 carbon atoms is contained as X1 of the general formula (1) at a content of 30 to 70 mol % based on 100 mol % of a total of X1 and X2, and (II) an organic group having a diphenyl ether structure is contained as Y1 of the general formula (1) at a content of 1 to 30 mol % based on 100 mol % of a total of Y1 and Y2.

公开(公告)号：US20240186172A1

公开(公告)日：2024-06-06

申请号：US18284195

申请日：2022-03-23

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yukari ARIMOTO ,  Risano NAKAJIMA ,  Mika KOSHINO ,  Hitoshi ARAKI ,  Masao TOMIKAWA ,  Takenori FUJIWARA ,  Kenta AOSHIMA

IPC: H01L21/683 ,  C08K5/00

CPC classification number: H01L21/6835 ,  C08K5/0025 ,  C08K5/0041 ,  H01L2221/68381

Abstract: Provided is a laminate that allows semiconductor elements to be transferred over a wide range of processing margins using lasers of various wavelengths, without damaging the elements or leaving behind any pasty residue. This laminate is a substrate in which a laser-transmitting substrate 1, a resin film, and a semiconductor element are laminated in the stated order. The absorbance of the resin film at a wavelength of 248 nm, 266 nm, or 355 nm expressed in terms of a film thickness of 1.0 μm us 0.4-5.0, and the adhesive strength of the resin film with respect to the semiconductor elements is 0.02-0.3 N/cm.

公开(公告)号：US20140191222A1

公开(公告)日：2014-07-10

申请号：US14202595

申请日：2014-03-10

Applicant: TORAY INDUSTRIES, INC.

Inventor： Kazuto MIYOSHI ,  Mika KOSHINO ,  Masao TOMIKAWA

IPC: G02B1/04 ,  H01L27/32

CPC classification number: G02B1/04 ,  C08G73/10 ,  C08G73/22 ,  C08K5/13 ,  C08K5/17 ,  C09K11/06 ,  C09K2211/1007 ,  C09K2211/1014 ,  C09K2211/1044 ,  C09K2211/1059 ,  G03F7/0007 ,  G03F7/037 ,  G03F7/039 ,  G03F7/40 ,  H01L27/322 ,  H01L27/3246 ,  H01L27/3258 ,  H01L51/5284 ,  H01L2224/18 ,  H05B33/10 ,  H05B33/14 ,  Y10T428/10 ,  Y10T428/1018 ,  Y10T428/1023 ,  Y10T428/105 ,  Y10T428/1095 ,  C08L79/04 ,  C08L79/08

Abstract: The resin composition of the present invention is a resin composition characterized by including (a) a polyimide, a polybenzoxazole, a polyimide precursor or a polybenzoxazole precursor, (b) 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, or 2,3-dihydroxynaphthalene, and (c) a thermal cross-linking agent having a specific structure. By the use of the resin composition of the present invention, it is possible to reduce the transmittance in the visible region of a cured film while maintaining the transmittance of a resin film before curing.

Abstract translation: 本发明的树脂组合物是一种树脂组合物，其特征在于包括（a）聚酰亚胺，聚苯并恶唑，聚酰亚胺前体或聚苯并恶唑前体，（b）1,5-二羟基萘，1,6-二羟基萘， 二羟基萘或2,3-二羟基萘，和（c）具有特定结构的热交联剂。 通过使用本发明的树脂组合物，可以在固化前保持树脂膜的透射率，降低固化膜的可见光区域的透射率。

公开(公告)号：US20240166556A1

公开(公告)日：2024-05-23

申请号：US18284107

申请日：2022-03-23

Applicant: TORAY INDUSTRIES, INC.

Inventor： Risano NAKAJIMA ,  Yukari ARIMOTO ,  Mika KOSHINO ,  Hitoshi ARAKI ,  Masao TOMIKAWA ,  Takenori FUJIWARA ,  Kenta AOSHIMA

IPC: C03C17/34 ,  H01L25/075

CPC classification number: C03C17/3405 ,  H01L25/0753 ,  C03C2217/78 ,  C03C2218/116 ,  C03C2218/32

Abstract: Provided is a laminate that can be implemented with a wide processing margin and without adhesive residue or damage to a semiconductor element in the transfer of the semiconductor element using laser light of various wavelengths. The laminate is obtained by laminating a substrate 1 having laser permeability, a resin film 1 and a resin film 2 in this order, wherein the light absorbance of the resin film 1 calculated for a film thickness of 1.0 μm at any wavelength of 200 nm to 1100 nm is 0.4-5.0, and the adhesive strength of the surface of the resin film 2 on the side opposite that of the resin film 1 side is 0.02-0.3 N/cm.

公开(公告)号：US20170342214A1

公开(公告)日：2017-11-30

申请号：US15517783

申请日：2015-10-02

Applicant: TORAY INDUSTRIES, INC.

Inventor： Natsuko CHAYAMA ,  Masao TOMIKAWA ,  Tomoyuki YUBA

IPC: C08G73/10 ,  D04H1/4326 ,  C08L79/08 ,  D01F6/74 ,  H01M2/16 ,  D04H1/728

Abstract: The present invention provides a polyimide solution which does not require a ring-closing process at a high temperature for obtaining a heat-resistant polyimide non-woven fabric and which is hardly affected by atmosphere humidity in fiber production by electrospinning, so that a fiber with a stable diameter can be obtained in any circumstance.A polyimide solution including: (a) a resin containing 50 mol % or more, based on the total amount of the resin, of a structural unit represented by the general formula (1); and (b) a solvent.

公开(公告)号：US20170299965A1

公开(公告)日：2017-10-19

申请号：US15517093

申请日：2015-10-01

Applicant: TORAY INDUSTRIES, INC.

Inventor： Keika HASHIMOTO ,  Kazuto MIYOSHI ,  Masao TOMIKAWA

IPC: G03F7/40 ,  H01L27/32 ,  G03F7/037 ,  C09D179/08 ,  G03F7/023 ,  G03F7/004 ,  H01L51/52 ,  G03F7/038

CPC classification number: G03F7/40 ,  C08L101/02 ,  C09D179/08 ,  G03F7/0046 ,  G03F7/0226 ,  G03F7/0233 ,  G03F7/0236 ,  G03F7/037 ,  G03F7/0387 ,  H01L21/027 ,  H01L27/3246 ,  H01L27/3258 ,  H01L29/786 ,  H01L51/529

Abstract: A resin composition which is configured such that if the resin composition is formed into a resin composition film that has a thickness of 3.0 μm after a heat treatment at a temperature within the range of 200-350° C., the resin composition film forms a heat-resistant resin film that has a light transmittance of 50% or more at a wavelength of 365-436 nm before the heat treatment, while having a light transmittance of 10% or less at a wavelength of 365-436 nm after the heat treatment. Provided is a resin composition having a function of absorbing ultraviolet light and visible light in a short wavelength range, which is suitable for the formation of a planarization film, an insulating layer and a partition wall that are used for organic light emitting devices or display devices.

公开(公告)号：US20160340547A1

公开(公告)日：2016-11-24

申请号：US15225569

申请日：2016-08-01

Applicant: TORAY INDUSTRIES, INC.

Inventor： Daichi MIYAZAKI ,  Masao TOMIKAWA

IPC: C09D179/08 ,  C08G73/10

CPC classification number: C09D179/08 ,  C08G69/44 ,  C08G73/1007 ,  C08G73/101 ,  C08G73/1067 ,  C08G73/1071 ,  C08G73/1075 ,  C08G73/1082 ,  C08G2150/00

Abstract: A polyamic acid useful for forming a protective or insulative layer for semiconductor elements has a structure represented by chemical formula (1): wherein δ represents an oxygen or sulfur atom; W represents an electron-withdrawing group; and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.

Abstract translation: 其中δ表示氧或硫原子; W表示吸电子基团; R 11和R 12分别独立地表示氢原子或碳原子数1〜10的烃基。

公开(公告)号：US20160002407A1

公开(公告)日：2016-01-07

申请号：US14387823

申请日：2013-12-26

Applicant: TORAY INDUSTRIES, INC.

Inventor： Junji WAKITA ,  Yukari JO ,  Masao TOMIKAWA

IPC: C08G73/10 ,  G02B5/22 ,  B29D11/00 ,  H01L51/00 ,  H01L51/52

CPC classification number: C08G73/1007 ,  B29D11/00634 ,  B29K2079/08 ,  B29K2995/002 ,  B29K2995/0026 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/106 ,  C08G73/1064 ,  C08G73/1067 ,  C08G73/1071 ,  C08G73/1082 ,  C09D179/08 ,  G02B5/223 ,  G02B5/287 ,  H01L27/3241 ,  H01L51/0024 ,  H01L51/0097 ,  H01L51/52

Abstract: The present invention is based on a polyimide precursor having unit structures represented by general formula (1) and unit structures represented by general formula (2), provides a polyimide precursor for which film whitening, cracking and bubbling do not occur regardless of film baking conditions, and provides a flexible TFT array, a flexible color filter, and a flexible substrate with a gas barrier layer using the polyimide precursor, and a flexible display device, etc. using same. (In general formulas (1) and (2), X1-X4 each independently represents a hydrogen atom, C1 to C10 monovalent organic group or C1 to C10 monovalent alkylsilyl group. R1 is represented by general formula (3) and R2 is represented by general formula (4).) (In general formula (4), R3 and R4 each independently represents a C1 to C10 monovalent organic group.)

Abstract translation: 本发明基于具有由通式（1）表示的单元结构和由通式（2）表示的单元结构的聚酰亚胺前体，提供了聚酰亚胺前体，不管膜的烘烤条件如何，都不会发生膜增白，开裂和起泡 并且使用该聚酰亚胺前体提供柔性TFT阵列，柔性滤色器和具有阻气层的柔性基板，以及使用其的柔性显示装置等。 （通式（1）和（2）中，X1-X4各自独立地表示氢原子，C1〜C10一价有机基团或C1〜C10一价烷基甲硅烷基，R1表示通式（3）表示，R2表示为 通式（4））（通式（4）中，R 3和R 4各自独立地表示C1〜C10一价有机基团。