公开(公告)号：US20180031970A1

公开(公告)日：2018-02-01

申请号：US15551078

申请日：2016-02-09

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yukari ARIMOTO ,  Yuki MASUDA ,  Ryoji OKUDA

IPC: G03F7/075 ,  C08G73/22 ,  C08G8/12 ,  C08F8/00 ,  G03F7/038 ,  G03F7/039 ,  G03F7/023 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/004 ,  G03F7/40 ,  G03F7/022 ,  H01L23/00 ,  C08G73/10

CPC classification number: G03F7/0387 ,  C08F8/00 ,  C08G8/12 ,  C08G73/10 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/106 ,  C08G73/22 ,  G03F7/004 ,  G03F7/0046 ,  G03F7/0226 ,  G03F7/023 ,  G03F7/0233 ,  G03F7/0236 ,  G03F7/038 ,  G03F7/039 ,  G03F7/075 ,  G03F7/0755 ,  G03F7/0757 ,  G03F7/161 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2004 ,  G03F7/322 ,  G03F7/40 ,  H01L24/02 ,  H01L2224/02311 ,  H01L2224/02379 ,  H01L2224/024 ,  H01L2924/07025

Abstract: Provided is a photosensitive resin composition containing: one or more kinds of alkali-soluble from a polyimide, a polybenzoxazole, a polyimide precursor, a polybenzoxazole precursor, and a copolymer formed of two or more polymers selected from the preceding substances; and a photosensitizer. The photosensitive resin composition further contains a compound represented by general formula (1). Even when a cured film is fired at low temperature, the photosensitive resin composition exhibits superior adhesion properties with metallic materials, particularly copper, and also exhibits high chemical resistance.

公开(公告)号：US20240166556A1

公开(公告)日：2024-05-23

申请号：US18284107

申请日：2022-03-23

Applicant: TORAY INDUSTRIES, INC.

Inventor： Risano NAKAJIMA ,  Yukari ARIMOTO ,  Mika KOSHINO ,  Hitoshi ARAKI ,  Masao TOMIKAWA ,  Takenori FUJIWARA ,  Kenta AOSHIMA

IPC: C03C17/34 ,  H01L25/075

CPC classification number: C03C17/3405 ,  H01L25/0753 ,  C03C2217/78 ,  C03C2218/116 ,  C03C2218/32

Abstract: Provided is a laminate that can be implemented with a wide processing margin and without adhesive residue or damage to a semiconductor element in the transfer of the semiconductor element using laser light of various wavelengths. The laminate is obtained by laminating a substrate 1 having laser permeability, a resin film 1 and a resin film 2 in this order, wherein the light absorbance of the resin film 1 calculated for a film thickness of 1.0 μm at any wavelength of 200 nm to 1100 nm is 0.4-5.0, and the adhesive strength of the surface of the resin film 2 on the side opposite that of the resin film 1 side is 0.02-0.3 N/cm.

公开(公告)号：US20240376348A1

公开(公告)日：2024-11-14

申请号：US18684498

申请日：2022-08-29

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yukari ARIMOTO ,  Takenori Fujiwara ,  Hitoshi ARAKI

IPC: C09J7/38 ,  C09J5/06 ,  C09J163/00 ,  C09J179/08 ,  H01L23/00

Abstract: The present invention aims to provide a pressure sensitive adhesive having high pressure sensitive adhesiveness and heat resistance and serves to makes it possible to transfer and mount a large number of semiconductor elements at once even when the process involves a step for applying heat to the semiconductor elements. It provides a pressure sensitive adhesive including a polyimide copolymer (A) having at least an acid dianhydride residue and a diamine residue and also comprising a dimer acid epoxy resin (B), wherein the diamine residue has a diamine residue (A1) as represented by the formula (1) in which n is a natural number of 1 or more and 15 or less (hereinafter referred to as the diamine residue (A1)), a diamine residue (A2) as represented by the formula (1) in which n is a natural number of 16 or more and 50 or less (hereinafter referred to as the diamine residue (A2)), and a diamine residue (A3) having a phenolic hydroxyl group (hereinafter referred to as the diamine residue (A3)) and also wherein the diamine residue (A1) accounts for 50.0 mol % or more and 95.0 mol % or less, the diamine residue (A2) accounting for 1.0 mol % or more and 40.0 mol % or less, and the diamine residue (A3) accounting for 1.0 mol % or more and 30.0 mol % or less, of all diamine residues, which account for 100.0 mol %, in the polyimide copolymer (A).

公开(公告)号：US20240186172A1

公开(公告)日：2024-06-06

申请号：US18284195

申请日：2022-03-23

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yukari ARIMOTO ,  Risano NAKAJIMA ,  Mika KOSHINO ,  Hitoshi ARAKI ,  Masao TOMIKAWA ,  Takenori FUJIWARA ,  Kenta AOSHIMA

IPC: H01L21/683 ,  C08K5/00

CPC classification number: H01L21/6835 ,  C08K5/0025 ,  C08K5/0041 ,  H01L2221/68381

Abstract: Provided is a laminate that allows semiconductor elements to be transferred over a wide range of processing margins using lasers of various wavelengths, without damaging the elements or leaving behind any pasty residue. This laminate is a substrate in which a laser-transmitting substrate 1, a resin film, and a semiconductor element are laminated in the stated order. The absorbance of the resin film at a wavelength of 248 nm, 266 nm, or 355 nm expressed in terms of a film thickness of 1.0 μm us 0.4-5.0, and the adhesive strength of the resin film with respect to the semiconductor elements is 0.02-0.3 N/cm.