ENCAPSULATION STRUCTURE AND METHOD OF ORGANIC ELECTROLUMINESCENCE DEVICE
    9.
    发明申请
    ENCAPSULATION STRUCTURE AND METHOD OF ORGANIC ELECTROLUMINESCENCE DEVICE 有权
    有机电致发光器件的封装结构与方法

    公开(公告)号:US20100148661A1

    公开(公告)日:2010-06-17

    申请号:US12336683

    申请日:2008-12-17

    IPC分类号: H01L51/50 H01L51/56

    摘要: An encapsulation structure comprises a first barrier layer, and an electroluminescence device configured to be coupled to the first barrier layer and comprising a substrate and an electroluminescence element both defining a lateral side. The electroluminescence element comprises a first electrode disposed on the substrate, a second electrode, and an organic light-emitting layer disposed between the first and second electrodes. Further, the encapsulation structure comprises a second barrier layer configured to be coupled to the electroluminescence device, and an adhesive configured to locate between and connect the first and second barrier layers, and at least to be coupled to the lateral side of the electroluminescence device to seal the electroluminescence device between the first and second barrier layers. An encapsulation method is also presented.

    摘要翻译: 封装结构包括第一阻挡层和被配置为耦合到第一阻挡层并且包括限定侧面的基板和电致发光元件的电致发光器件。 电致发光元件包括设置在基板上的第一电极,第二电极和设置在第一和第二电极之间的有机发光层。 此外,封装结构包括被配置为耦合到电致发光器件的第二阻挡层和被配置为定位在第一和第二阻挡层之间并连接第一和第二势垒层的粘合剂,并且至少要连接到电致发光器件的侧面, 密封第一和第二阻挡层之间的电致发光器件。 还提出了一种封装方法。

    Encapsulation structures of organic electroluminescence devices
    10.
    发明授权
    Encapsulation structures of organic electroluminescence devices 有权
    有机电致发光器件的封装结构

    公开(公告)号:US08350470B2

    公开(公告)日:2013-01-08

    申请号:US12336683

    申请日:2008-12-17

    IPC分类号: H01J1/62 H01J63/04

    摘要: An encapsulation structure comprises a first barrier layer, and an electroluminescence device configured to be coupled to the first barrier layer and comprising a substrate and an electroluminescence element both defining a lateral side. The electroluminescence element comprises a first electrode disposed on the substrate, a second electrode, and an organic light-emitting layer disposed between the first and second electrodes. Further, the encapsulation structure comprises a second barrier layer configured to be coupled to the electroluminescence device, and an adhesive configured to locate between and connect the first and second barrier layers, and at least to be coupled to the lateral side of the electroluminescence device to seal the electroluminescence device between the first and second barrier layers. An encapsulation method is also presented.

    摘要翻译: 封装结构包括第一阻挡层和被配置为耦合到第一阻挡层并且包括限定侧面的基板和电致发光元件的电致发光器件。 电致发光元件包括设置在基板上的第一电极,第二电极和设置在第一和第二电极之间的有机发光层。 此外,封装结构包括被配置为耦合到电致发光器件的第二阻挡层和被配置为定位在第一和第二阻挡层之间并连接第一和第二阻挡层的粘合剂,并且至少要耦合到电致发光器件的侧面, 密封第一和第二阻挡层之间的电致发光器件。 还提出了一种封装方法。