摘要:
The present invention relates to a slide chip for a sensor for detection of food-borne bacteria and a fabrication method thereof. More particularly, the invention relates to a slide chip for a sensor for detection of food-borne bacteria and a fabrication method thereof, the slide chip comprising: a substrate coated with a metal; a linker having a substituent which may be bonded to the metal and is located at the 5′ end of deoxythymidine (dT); and a food-borne bacterium-derived RNA aptamer that is bound to the linker by the 3′-end poly A tail. The slide chip makes it possible to detect food-borne bacteria in a rapid and accurate manner.
摘要:
A manufacturing method of a picture comprises, disposing salt on a manufacturing board to form a salt layer, and coating and drying steps. In the primary coating and drying steps, polyurethane resin cured by exposure to air for about 10 to 20 minutes is poured onto the salt layer and the primary coating layer is dried in a condition of a relative humidity of 40 to 60%. In the secondary coating step, polyurethane resin cured for about 21 to 40 minutes is poured onto the primary coating layer and the secondary coating layer is dried in a condition of a relative humidity of 1 to 39%. In the tertiary coating step, polyurethane resin cured for about 50 to 70 minutes is poured onto the secondary coating layer and the tertiary coating layer is dried in a condition of a relative humidity of 1 to 39%.
摘要:
Provided is a semiconductor device having a high-reliability solder joint. The semiconductor device includes a high-temperature solder formed on a conductive pad. A low-temperature solder having a lower melting point than the high-temperature solder is formed on the high-temperature solder. A barrier layer is formed between the high-temperature solder and the low-temperature solder. An Sn content of the high-temperature solder is higher than that of the low-temperature solder.
摘要:
A display apparatus includes: a substrate having a display area and anon-display area; a display device formed on the display area; a bending embodiment unit formed on the non-display area and including bimetal elements; and a control unit for controlling bending of each of the bimetal elements so as to improve convenience to the user.
摘要:
A liquid crystal display is disclosed. In one embodiment, the display includes i) a liquid crystal display panel configured to display images, ii) a backlight unit configured to provide light to the liquid crystal display panel and iii) a mold frame comprising a frame main body and a plurality of first side walls, wherein the frame main body is configured to receive the backlight unit, and wherein the first side walls are formed on a top surface of the frame main body. The display may further include a bottom chassis comprising a bottom plate and a plurality of second side walls, wherein the bottom plate is configured to support the mold frame and wherein the second side walls are formed at edges of the bottom plate. The first and second side walls surround side surfaces of the liquid crystal display panel while not contacting the side surfaces, and the first and second side walls are alternately disposed along a circumferential direction of the liquid crystal display panel.
摘要:
A chemical-mechanical polishing (CMP) method of polishing a phase-change material and a method of fabricating a phase-change memory, the CMP method including forming the phase-change material on an activation surface of a semiconductor wafer, and performing a CMP process on the phase-change material using a polishing pad, wherein the performing the CMP process includes reducing a change in the composition of the phase-change material by adjusting, within a predetermined range, a temperature of a region where the semiconductor wafer and the polishing pad contact each other.
摘要:
A vehicle air conditioner is controlled to a target control value that controls a swash-plate control value of a swash-plate variable capacity compressor. The variable control is based on temperature deviation between target evaporator temperature and actual evaporator temperature, to control compressor discharge capacity. A target evaporator temperature is set. Deviation between the target evaporator temperature and actual evaporator temperature is calculated. Control coefficients are variably set according to the magnitude of the temperature deviation. A target control value of a pressure control valve of the swash-plate variable capacity compressor is calculated using the control coefficients. The pressure control valve is controlled by the target control value.
摘要:
Provided is a semiconductor device having a high-reliability solder joint. The semiconductor device includes a high-temperature solder formed on a conductive pad. A low-temperature solder having a lower melting point than the high-temperature solder is formed on the high-temperature solder. A barrier layer is formed between the high-temperature solder and the low-temperature solder. An Sn content of the high-temperature solder is higher than that of the low-temperature solder.
摘要:
A display device includes a first substrate, a light emission portion on the first substrate, a second substrate separated by a predetermined distance from the light emission portion, and a refractive layer on the second substrate, the refractive layer facing the light emission portion and being configured to change an optical path of light emitted from the light emission portion.
摘要:
The present invention relates to a method for controlling the operation of a compressor for preventing noise that occurs in case of the shortage of refrigerant flow caused by less discharge capacity of the compressor of an air conditioner for a vehicle. The compressor includes a cylinder bore for compressing a refrigerant, a piston inserted into the cylinder bore, a swash plate having a controllable slope with respect to a drive shaft, and a control valve for controlling the slope of the swash plate. The discharge capacity of the compressor is increased if it is determined that vehicle speed and accelerating rate satisfy predetermined conditions. If a low flow rate state of refrigerant of the compressor is predicted, the ECV duty is increased to prevent the compressor from entering the low flow rate state, thereby improving the workability of the compressor and solving the noise problem.