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    Stacked damascene structures for microelectronic devices
    3.
    发明授权
    Stacked damascene structures for microelectronic devices 有权
    用于微电子器件的堆叠镶嵌结构

    公开(公告)号：US09431343B1

    公开(公告)日：2016-08-30

    申请号：US14691336

    申请日：2015-04-20

    申请人： Ki-Don Lee ,  Jinseok Kim

    发明人： Ki-Don Lee ,  Jinseok Kim

    IPC分类号： H01L23/52 ,  H01L23/528 ,  H01L23/522 ,  H01L23/532 ,  H01L23/58

    CPC分类号： H01L23/5283 ,  H01L21/76838 ,  H01L23/5226 ,  H01L23/528 ,  H01L23/53238 ,  H01L23/58

    摘要： A microelectronic device includes a dual-damascene interconnect structure and a single-damascene line structure directly on the dual-damascene interconnect structure. The dual-damascene interconnect structure and the single-damascene line structure may each include multiple line segments that are arranged in a brick wall pattern. The brick wall pattern may also be used with two or more single-damascene line structures. Various microelectronic devices and related fabrication methods are described.

    摘要翻译： 微电子器件包括双镶嵌互连结构和直接在双镶嵌互连结构上的单镶嵌线结构。 双镶嵌互连结构和单镶嵌线结构可以各自包括以砖墙图案布置的多个线段。 砖墙图案也可以与两个或更多个单镶嵌线结构一起使用。 描述了各种微电子器件和相关的制造方法。

    STACKED DAMASCENE STRUCTURES FOR MICROELECTRONIC DEVICES
    4.
    发明申请
    STACKED DAMASCENE STRUCTURES FOR MICROELECTRONIC DEVICES 有权
    微电子器件的堆叠大容量结构

    公开(公告)号：US20160268199A1

    公开(公告)日：2016-09-15

    申请号：US14691336

    申请日：2015-04-20

    申请人： Ki-Don LEE ,  Jinseok Kim

    发明人： Ki-Don LEE ,  Jinseok Kim

    IPC分类号： H01L23/528 ,  H01L23/532 ,  H01L23/58 ,  H01L23/522

    CPC分类号： H01L23/5283 ,  H01L21/76838 ,  H01L23/5226 ,  H01L23/528 ,  H01L23/53238 ,  H01L23/58

    摘要： A microelectronic device includes a dual-damascene interconnect structure and a single-damascene line structure directly on the dual-damascene interconnect structure. The dual-damascene interconnect structure and the single-damascene line structure may each include multiple line segments that are arranged in a brick wall pattern. The brick wall pattern may also be used with two or more single-damascene line structures. Various microelectronic devices and related fabrication methods are described.

    摘要翻译： 微电子器件包括双镶嵌互连结构和直接在双镶嵌互连结构上的单镶嵌线结构。 双镶嵌互连结构和单镶嵌线结构可以各自包括以砖墙图案布置的多个线段。 砖墙图案也可以与两个或更多个单镶嵌线结构一起使用。 描述了各种微电子器件和相关的制造方法。

    Computer cooling fan
    5.
    发明申请
    Computer cooling fan 审中-公开
    电脑散热风扇

    公开(公告)号：US20070031262A1

    公开(公告)日：2007-02-08

    申请号：US11198378

    申请日：2005-08-04

    申请人： Jinseok Kim

    发明人： Jinseok Kim

    IPC分类号： F04D29/38

    CPC分类号： F04D29/329 ,  F04D29/384

    摘要： A cooling apparatus to increase airflow over electronic components is disclosed. The cooling apparatus comprises a non-flat hub disposed substantially centered about an axis of rotation. A plurality of fan blades, each of the plurality of fan blades is connected at a first end to an outer shell of the non-flat hub to form a first intersection angle greater than approximately 10 degrees between a top surface of the first end and the axis of rotation. Each of the plurality of fan blades has a substantially convex shaped outer surface to sweep air substantially parallel to the axis of rotation for passage through an effective channel surface area formed by an outer surface of the non-flat hub and a top surface of the plurality of fan blades.

    摘要翻译： 公开了一种用于增加电子部件上的气流的冷却装置。 冷却装置包括以围绕旋转轴线大致居中的非平坦毂。 多个风扇叶片，多个风扇叶片中的每一个在第一端处连接到非平坦轮毂的外壳，以在第一端的顶表面和第一端部之间形成大于约10度的第一交叉角度 旋转轴。 多个风扇叶片中的每一个具有基本上凸形的外表面，用于扫掠基本上平行于旋转轴线的空气，以便通过由非平坦轮毂的外表面形成的有效通道表面区域和多个 的风扇叶片。

    Computer power supply and cable
    7.
    发明申请
    Computer power supply and cable 审中-公开
    电脑电源和电缆

    公开(公告)号：US20070029880A1

    公开(公告)日：2007-02-08

    申请号：US11198377

    申请日：2005-08-04

    申请人： Jinseok Kim

    发明人： Jinseok Kim

    IPC分类号： H05K1/02

    CPC分类号： G06F1/189 ,  G06F1/20 ,  Y10T307/492

    摘要： A power supply apparatus is disclosed to provide power to a plurality of electrical components inside a computer housing. The power supply apparatus comprises a power supply module to convert electrical power to at least one power level. At least one power distribution panel is disposed within the computer housing. At least one wiring harness is electrically coupled at a first end of the at least one wiring harness to the at least one power distribution panel. The at least one wiring harness at a second end connects to the power supply module to transfer the at least one power level to the at least one power distribution panel. The at least one power distribution panel provides electrical adapters to transfer the at least one power level to cables that are coupled between the electrical adaptors and the plurality of electrical components.

    摘要翻译： 公开了一种供电装置，用于向计算机壳体内的多个电气部件提供电力。 电源装置包括将电力转换为至少一个功率电平的电源模块。 至少一个配电盘设置在计算机壳体内。 至少一个线束在所述至少一个线束的第一端电耦合到所述至少一个配电盘。 在第二端的至少一个线束连接到电源模块以将至少一个功率电平传送到至少一个配电盘。 所述至少一个配电盘提供电适配器以将所述至少一个功率电平传送到耦合在所述电适配器和所述多个电组件之间的电缆。