公开(公告)号：US20170301684A1

公开(公告)日：2017-10-19

申请号：US15490154

申请日：2017-04-18

申请人： Jong-kook PARK ,  Hong-soo Kim ,  Tae-keun Cho

发明人： Jong-kook PARK ,  Hong-soo Kim ,  Tae-keun Cho

IPC分类号： H01L27/115

CPC分类号： H01L27/11556 ,  H01L27/11521 ,  H01L27/11526 ,  H01L27/11546 ,  H01L27/11568 ,  H01L27/11573 ,  H01L27/11575 ,  H01L27/11582

摘要： A semiconductor memory device includes: a substrate including a cell region and a connection region; a first word line stack comprising a plurality of first word lines that extend to the connection region and are stacked on the cell region; a second word line stack comprising a plurality of second word lines that extend to the connection region and are stacked on the cell region, the second word line being adjacent to the first word line stack; vertical channels in the cell region of the substrate, the vertical channels being connected to the substrate and coupled with the plurality of first and second word lines; a bridge region that connects the first word lines of the first word line stack with the second word lines of the second word line stack; and a local planarized region under the bridge region.

公开(公告)号：US08834632B2

公开(公告)日：2014-09-16

申请号：US11987477

申请日：2007-11-30

申请人： Ho-Soo Hwang ,  Sung-Soo Kim ,  Jung-Keun Cho

发明人： Ho-Soo Hwang ,  Sung-Soo Kim ,  Jung-Keun Cho

IPC分类号： C01B31/02 ,  B01J19/00 ,  B82Y40/00 ,  B82Y30/00

CPC分类号： C01B31/0233 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/162 ,  Y10S977/843

摘要： In a method of manufacturing a carbon nanotube, a boat configured to receive substrates is positioned outside of a synthesis space where the carbon nanotube is synthesized. The substrates are loaded into the boat. The boat is then transferred to the synthesis space. A process for forming the carbon nanotube is performed on the substrates in the synthesis space to form the carbon nanotube. Thus, the carbon nanotube may be effectively manufactured.

摘要翻译： 在制造碳纳米管的方法中，构造成接收基板的舟皿位于合成碳纳米管的合成空间的外侧。 基板装载到船上。 然后将船转移到合成空间。 在合成空间的基板上进行形成碳纳米管的工序，形成碳纳米管。 因此，可以有效地制造碳纳米管。

公开(公告)号：US08744365B2

公开(公告)日：2014-06-03

申请号：US12049532

申请日：2008-03-17

申请人： Hyung-chan Kim ,  Chang-gi Kwon ,  Hee-min Kwon ,  Hyun-keun Cho

发明人： Hyung-chan Kim ,  Chang-gi Kwon ,  Hee-min Kwon ,  Hyun-keun Cho

IPC分类号： H04B7/00 ,  H04M1/00 ,  H04M1/24 ,  H04M3/08 ,  H04M3/22

CPC分类号： H04L67/125 ,  H04L67/16

摘要： A mobile communication device storing a file to be printed, the mobile communication device including: a communication unit to receive printer information of a printer; a network interface unit to connect to a printer server corresponding to the printer information received through the communication unit; and a control unit to transmit the file to be printed to the printer through the printer server according to the received printer information. Accordingly, users can print files using a mobile communication device while traveling away from a fixed printer.

摘要翻译： 一种存储要打印的文件的移动通信设备，所述移动通信设备包括：通信单元，用于接收打印机的打印机信息; 网络接口单元，其连接到与通过所述通信单元接收的打印机信息相对应的打印机服务器; 以及控制单元，用于根据所接收的打印机信息通过打印机服务器将要被打印的文件传送到打印机。 因此，用户可以在离开固定打印机的同时使用移动通信设备打印文件。

公开(公告)号：US08726613B2

公开(公告)日：2014-05-20

申请号：US13814581

申请日：2011-08-09

申请人： Ju Hun Rhee ,  Hee Keun Cho

发明人： Ju Hun Rhee ,  Hee Keun Cho

IPC分类号： E04C2/00

CPC分类号： B32B3/06 ,  B32B3/12 ,  B32B5/02 ,  B32B2250/40 ,  B32B2260/023 ,  B32B2260/046 ,  E04C2/365

摘要： The present invention relates to a composite honeycomb sandwich panel equipped with a composite rail aluminum I-shaped side insert, and more specifically, to an improved structure of a hybrid composite sandwich panel having a laminated composite skin and an aluminum honeycomb core which is mechanically improved in terms of assembly, strength and weight. The composite honeycomb sandwich panel includes: a planar honeycomb core; a composite rail which is wrapped around the periphery of the honeycomb core and has therein a hollow space that is open on opposite sides thereof; an I-shaped center rail insert which is fitted into the hollow space of the composite rail so that the sandwich panel is connected to an adjacent sandwich panel by bolting through the I-shaped center rail insert; and laminated composite skins which cover upper and lower surfaces of the honeycomb core having the composite rail wrapped around.

摘要翻译： 本发明涉及一种配有复合导轨铝I型侧插件的复合蜂窝夹层板，更具体地说，涉及一种具有层压复合表皮和铝蜂窝芯的混合复合夹层板的改进结构，机械改进 在组装，强度和重量方面。 复合蜂窝夹层板包括：平面蜂窝芯; 复合导轨，其围绕蜂窝芯的周边缠绕并且在其中具有在其相对侧上敞开的中空空间; I形的中心轨道插入件，其装配到复合导轨的中空空间中，使得夹层板通过螺栓穿过I形中心轨道插入件连接到相邻的夹层板; 以及覆盖复合导轨的蜂窝芯的上表面和下表面的层压复合材料表皮。

公开(公告)号：US20120227872A1

公开(公告)日：2012-09-13

申请号：US13508745

申请日：2010-12-23

申请人： Dong-Hyun Kim ,  You-Hwan Lee ,  Sang-Yoon Lee ,  Hyung-Keun Cho

发明人： Dong-Hyun Kim ,  You-Hwan Lee ,  Sang-Yoon Lee ,  Hyung-Keun Cho

IPC分类号： C21D9/52 ,  C22C38/12 ,  C22C38/04 ,  C22C38/02

CPC分类号： C22C38/12 ,  C21D8/065 ,  C21D9/0093 ,  C22C38/02 ,  C22C38/04

摘要： An ultra-high-strength steel wire rod having excellent resistance to delayed fracture includes, by wt %, 0.7-1.2% C, 0.25-0.5% Si, 0.5-0.8% Mn, 0.02-0.1% V and a balance of Fe and inevitable impurities. The method includes the steps of heating the above steel composition to 1100° C. or lower and hot rolling at a temperature of 900-1000° C., followed by cooling to 600-650° C. at a prescribed rate, followed by cold drawing at a reduction ratio of 60-80%.

摘要翻译： 具有优异的延迟断裂性的超高强度钢线材包括：重量％，0.7-1.2％C，0.25-0.5％Si，0.5-0.8％Mn，0.02-0.1％V，余量为Fe和 不可避免的杂质。 该方法包括以下步骤：将上述钢组合物加热至1100℃以下，在900-1000℃的温度下进行热轧，然后以规定的比例冷却至600-650℃，然后冷却 以60-80％的减速比绘制。

公开(公告)号：US08256774B2

公开(公告)日：2012-09-04

申请号：US11896351

申请日：2007-08-31

申请人： Jung Keun Cho ,  Kyo-Woog Koo ,  Bo Ram Chan Sung

发明人： Jung Keun Cho ,  Kyo-Woog Koo ,  Bo Ram Chan Sung

IPC分类号： B23B31/103

CPC分类号： B23B31/1269 ,  B23B2265/12 ,  H01L21/68728 ,  Y10T279/18

摘要： A chucking member configured to chuck the edge of a substrate includes a chucking pin which is eccentric from the rotation center. The chucking pin has a streamline shape and includes a first front-end portion disposed at the front end relative to the flow of an air current generated by the rotation of the substrate and a first back-end portion disposed at the back end relative to the flow of the air current. The first front-end portion includes a first tip, and the first front-end portion has a round shape.

摘要翻译： 构造成夹持基板的边缘的夹紧构件包括从旋转中心偏心的夹紧销。 夹紧销具有流线形状，并且包括相对于由基板的旋转产生的气流的流动而位于前端的第一前端部分和设置在后端相对于基板的第一后端部分 气流的流动。 第一前端部包括第一末端，第一前端部具有圆形。

公开(公告)号：US20120070924A1

公开(公告)日：2012-03-22

申请号：US12976492

申请日：2010-12-22

申请人： Su Hyoung SON ,  Kyoung Jin Kim ,  Won Keun Cho ,  Eun Mi Ko ,  Hyung Sun Hwang

发明人： Su Hyoung SON ,  Kyoung Jin Kim ,  Won Keun Cho ,  Eun Mi Ko ,  Hyung Sun Hwang

IPC分类号： H01L33/44 ,  H01L33/50

CPC分类号： H01L33/007 ,  H01L33/22

摘要： Disclosed is a method for manufacturing a semiconductor light-emitting device, which carries out a wet-etching process after a dry-etching process so as to form protrusions in a surface of a substrate for growing a nitride semiconductor material thereon. The method comprises coating a substrate with photoresist; forming a mask pattern on the substrate by selectively removing the photoresist; forming protrusions on the substrate by dry-etching the substrate with the mask pattern through the use of etching gas; wet-etching the dry-etched substrate through the use of etching solution; forming a first semiconductor layer on the substrate including the protrusions; forming an active layer on the first semiconductor layer; forming a second semiconductor layer on the active layer; etching predetermined portions of the active layer and second semiconductor layer until the first semiconductor layer is exposed; and forming a first electrode on a predetermined portion of the first semiconductor layer, wherein the active layer and second semiconductor layer are not formed on the predetermined portion of the first semiconductor layer, and forming a second electrode on the second semiconductor layer.

摘要翻译： 公开了一种半导体发光器件的制造方法，该半导体发光器件在干蚀刻工艺之后进行湿蚀刻工艺，以在其上形成氮化物半导体材料的衬底的表面中形成突起。 该方法包括用光刻胶涂覆基底; 通过选择性地除去光致抗蚀剂在衬底上形成掩模图案; 通过使用蚀刻气体通过用掩模图案干蚀刻基板在基板上形成突起; 通过使用蚀刻溶液湿法蚀刻干蚀刻基板; 在包括所述突起的所述基板上形成第一半导体层; 在所述第一半导体层上形成有源层; 在所述有源层上形成第二半导体层; 蚀刻有源层和第二半导体层的预定部分直到暴露第一​​半导体层; 以及在所述第一半导体层的预定部分上形成第一电极，其中所述有源层和所述第二半导体层未形成在所述第一半导体层的所述预定部分上，并且在所述第二半导体层上形成第二电极。

公开(公告)号：US20120037283A1

公开(公告)日：2012-02-16

申请号：US13263758

申请日：2010-04-23

申请人： Dong-Hyun Kim ,  You-Hwan Lee ,  Sang-Yoon Lee ,  Hyung-Keun Cho

发明人： Dong-Hyun Kim ,  You-Hwan Lee ,  Sang-Yoon Lee ,  Hyung-Keun Cho

IPC分类号： C21D9/52 ,  C22C38/04 ,  C22C38/02 ,  C22C38/00 ,  C22C38/06

CPC分类号： C22C38/12 ,  C22C38/001 ,  C22C38/06 ,  C22C38/14

摘要： Provided are a high-strength, high-toughness steel wire rod and a method of manufacturing the same. The steel wire rod has a composition including 0.07 wt % to 0.14 wt % of aluminum (Al) and nitrogen (N) wherein Al:N (where Al and N denote wt % of each element) is in a range of 15:1 to 25:1. Since a steel wire rod having sufficient strength and toughness improvement effects can be obtained with a simple alloy component, a steel wire rod capable of allowing processing such as cold forging to be performed without an additional heat treatment may be provided.

摘要翻译： 本发明提供高强度，高韧性钢线材及其制造方法。 钢线材具有含有0.07重量％至0.14重量％的铝（Al）和氮（N）的组成，其中Al：N（其中Al和N表示各元素的重量％）在15:1至 25：1。 由于可以通过简单的合金成分获得具有足够的强度和韧性改善效果的钢丝棒，所以可以提供能够进行诸如冷锻的加工的钢线，而不进行额外的热处理。

公开(公告)号：US08038838B2

公开(公告)日：2011-10-18

申请号：US11945342

申请日：2007-11-27

申请人： Ju Won Kim ,  Ki Hoon Choi ,  Jung Keun Cho ,  Kyo Woog Koo ,  Jung Bong Choi

发明人： Ju Won Kim ,  Ki Hoon Choi ,  Jung Keun Cho ,  Kyo Woog Koo ,  Jung Bong Choi

IPC分类号： H01L21/68 ,  H01L21/027

CPC分类号： H01L21/68728 ,  H01L21/68742

摘要： A spin head includes chucking pins configures to chuck and unchuck a substrate. Contact portions of the chucking pins and the substrate are varied during a process to prevent a treating solution from remaining at the contact portions.

摘要翻译： 旋转头包括夹紧销配置为卡盘和解锁基板。 夹持销和基板的接触部分在防止处理溶液残留在接触部分的过程中变化。

公开(公告)号：US07934513B2

公开(公告)日：2011-05-03

申请号：US10574113

申请日：2004-10-07

申请人： Joung-Hyeon Lim ,  Jung-Keun Cho ,  Kyo-Woog Koo ,  In-Ho Bang ,  Woo-Young Kim ,  Man-Seok Oh ,  Hyun-Jong Kim

发明人： Joung-Hyeon Lim ,  Jung-Keun Cho ,  Kyo-Woog Koo ,  In-Ho Bang ,  Woo-Young Kim ,  Man-Seok Oh ,  Hyun-Jong Kim

IPC分类号： B08B3/00

CPC分类号： H01L21/67207 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/67173 ,  H01L21/67745

摘要： A facility for cleaning substrates such as semiconductor wafers includes a loading/unloading part, an aligning part where wafers are repositioned from a horizontal state to a vertical state, a cleaning part performing etchant-treating, rinsing, and drying processes for wafers and having a plurality of process chamber stacked, and an interface part where a transfer bath is disposed to transfer wafers between the process chambers. When the wafers are transferred between the process chamber, the transfer bath is filled with deionized water (DI water) to prevent their exposure to the air. Wafers drawn out of the loading/unlading part are repositioned from a horizontal state to a vertical state and are transferred to a first process chamber being one of the process chambers to be subjected to a part of processes. After the wafers are transferred to a second process chamber being the other one of the process chambers to be subjected to the other processes, they are repositioned from a vertical state to a horizontal state. That is, the wafers are transferred along a loop shape to be processed.

摘要翻译： 用于清洁诸如半导体晶片的基板的设备包括装载/卸载部分，其中晶片从水平状态重新定位到垂直状态的对准部分，执行晶片的蚀刻处理，漂洗和干燥处理的清洁部件，并且具有 多个处理室堆叠，以及界面部分，其中设置传送槽以在处理室之间传送晶片。 当晶片在处理室之间转移时，转移浴用去离子水（DI水）填充，以防止它们暴露于空气中。 从加载/非拉伸部分引出的晶片从水平状态重新定位到垂直状态，并被转移到作为处理室之一进行一部分处理的第一处理室。 在将晶片转移到作为要进行其它处理的另一个处理室的第二处理室之后，它们从垂直状态重新定位到水平状态。 也就是说，晶片沿着要被处理的环形传送。