Abstract:
A method of transmitting data is disclosed. At least one system block of a system-on-chip (SoC) is modeled at an untimed functional level in first and second untimed functional models. First and second transaction level (TL) models of the at least one system block system block are modeled at a transaction level (TL) using the first and second untimed functional models, respectively. First and second cycle accurate (CA) models are modeled at a cycle accurate (CA) level using the first and second TL models, respectively. Data is transmitted from the first untimed functional model to the first CA model, from the first CA model to the second CA model via a CA bus, and from the second CA model to the second untimed functional model.
Abstract:
A system comprises a processor-implemented tool configured to generate a layout of an integrated circuit (IC) die. At least one non-transitory machine readable storage medium includes a first portion encoded with a first gate-level description of first and second circuit patterns to be formed on first and second integrated circuit (IC) dies, respectively, and a second portion encoded with a second gate level description of the first and second circuit patterns received from the processor implemented tool. The second gate level description includes power and ground ports, and the first gate level description does not include power and ground ports. A processor-implemented first verification module is provided for comparing the first and second gate level descriptions and outputting a verified second gate-level description of the first and second circuit patterns.
Abstract:
A system and method is disclosed for functional verification of multi-die 3D ICs. The system and method include a reusable verification environment for testing each die in a stack of dies individually without having to simultaneously operate all of the dies in the stack. The system and method includes converting an input/output (“IO”) trace from a die verification test from a first format to a second format to improve performance.
Abstract:
A system comprises a processor-implemented tool configured to generate a layout of an integrated circuit (IC) die. At least one non-transitory machine readable storage medium includes a first portion encoded with a first gate-level description of first and second circuit patterns to be formed on first and second integrated circuit (IC) dies, respectively, and a second portion encoded with a second gate level description of the first and second circuit patterns received from the processor implemented tool. The second gate level description includes power and ground ports, and the first gate level description does not include power and ground ports. A processor-implemented first verification module is provided for comparing the first and second gate level descriptions and outputting a verified second gate-level description of the first and second circuit patterns.
Abstract:
A method for verifying functionality of a system-on-chip (SoC) comprises modeling a system block in first and second models at a first level and a second level lower than the first level, respectively. A stimulus transaction is generated at a first testbench at the first level. The stimulus transaction is transmitted from the first testbench to a second testbench at the second level. The stimulus transaction is transformed into a first response transaction, using the first model, at the first level. The stimulus transaction received at the second testbench is transformed into a second response transaction, using the second model, at the second level. Functionality of the SoC at the first and second levels is verified based on the first and second response transactions.