公开(公告)号：US20230349574A1

公开(公告)日：2023-11-02

申请号：US17733657

申请日：2022-04-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chia-Wei WU ,  Hao YANG ,  Hsiao-Chieh CHOU ,  Chun-Hung CHAO ,  Jao Sheng HUANG ,  Neng-Jye YANG ,  Kuo-Bin HUANG

IPC: F24F9/00 ,  H01L21/687 ,  H01L21/67

CPC classification number: F24F9/00 ,  H01L21/68707 ,  H01L21/67196

Abstract: The present disclosure is at least directed to utilizing air curtain devices to form air curtains to separate and isolate areas in which respective workpieces are stored from a transfer compartment within a workpiece processing apparatus. The transfer compartment of the workpiece processing apparatus includes a robot configured to transfer or transport ones of the workpieces to and from these respective storage areas through the transfer compartment and to and from a tool compartment. A tool is present in the tool compartment for processing and refining the respective workpieces. Clean dry air (CDA) may be circulated through the respective storage areas. The air curtains formed by the air curtain devices and the circulation of CDA through the respective storage areas reduces the likelihood of the generation of defects, damages, and degradation of the workpieces when present within the workpiece processing apparatus.

公开(公告)号：US20200266065A1

公开(公告)日：2020-08-20

申请号：US16869859

申请日：2020-05-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Nai-Chia CHEN ,  Wan Hsuan HSU ,  Chia-Wei WU ,  Neng-Jye YANG ,  Chun-Li CHOU

IPC: H01L21/033 ,  H01L21/02

Abstract: A middle layer removal method is provided. The method includes providing a substrate having a structure formed on the substrate, and forming a spacer layer on the structure. The method includes forming a mask layer over the spacer layer, the mask layer including a first layer, a second layer over the first layer, and a third layer over the second layer. The method also includes patterning the third layer of the mask layer, and etching the first layer and the second layer of the mask layer to form an opening to expose a bottom surface of the second layer. The method further includes removing the second layer using a wet etchant.

公开(公告)号：US20250109870A1

公开(公告)日：2025-04-03

申请号：US18979108

申请日：2024-12-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chia-Wei WU ,  Hao YANG ,  Hsiao-Chieh CHOU ,  Chun-Hung CHAO ,  Jao Sheng HUANG ,  Neng-Jye YANG ,  Kuo-Bin HUANG

IPC: F24F9/00 ,  H01L21/67 ,  H01L21/687

Abstract: The present disclosure is at least directed to utilizing air curtain devices to form air curtains to separate and isolate areas in which respective workpieces are stored from a transfer compartment within a workpiece processing apparatus. The transfer compartment of the workpiece processing apparatus includes a robot configured to transfer or transport ones of the workpieces to and from these respective storage areas through the transfer compartment and to and from a tool compartment. A tool is present in the tool compartment for processing and refining the respective workpieces. Clean dry air (CDA) may be circulated through the respective storage areas. The air curtains formed by the air curtain devices and the circulation of CDA through the respective storage areas reduces the likelihood of the generation of defects, damages, and degradation of the workpieces when present within the workpiece processing apparatus.